Hybrid Systems-in-Foil

Hybrid Systems-in-Foil
Author: Mourad Elsobky
Publisher: Cambridge University Press
Total Pages: 92
Release: 2021-10-14
Genre: Technology & Engineering
ISBN: 1108983383

Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible electronics world. In HySiF, an economical implementation of flexible electronic systems is possible by integrating a minimum number of embedded silicon chips and a maximum number of on-foil components. Here, the complementary characteristics of CMOS SoCs and larger area organic and printed electronics are combined in a HySiF-compatible polymeric substrate. Within the HySiF scope, the fabrication process steps and the integration design rules with all the accompanying boundary conditions concerning material compatibility, surface properties, and thermal budget, are defined. This Element serves as an introduction to the HySiF concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided. Several bendable electronic components are presented demonstrating the benefits of HySiF. Finally, prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.

Hybrid Systems Based on Solid Oxide Fuel Cells

Hybrid Systems Based on Solid Oxide Fuel Cells
Author: Mario L. Ferrari
Publisher: John Wiley & Sons
Total Pages: 341
Release: 2017-08-14
Genre: Science
ISBN: 1119039053

A comprehensive guide to the modelling and design of solid oxide fuel cell hybrid power plants This book explores all technical aspects of solid oxide fuel cell (SOFC) hybrid systems and proposes solutions to a range of technical problems that can arise from component integration. Following a general introduction to the state-of-the-art in SOFC hybrid systems, the authors focus on fuel cell technology, including the components required to operate with standard fuels. Micro-gas turbine (mGT) technology for hybrid systems is discussed, with special attention given to issues related to the coupling of SOFCs with mGTs. Throughout the book emphasis is placed on dynamic issues, including control systems used to avoid risk conditions. With an eye to mitigating the high costs and risks incurred with the building and use of prototype hybrid systems, the authors demonstrate a proven, economically feasible approach to obtaining important experimental results using simplified plants that simulate both generic and detailed system-level behaviour using emulators. Computational models and experimental plants are developed to support the analysis of SOFC hybrid systems, including models appropriate for design, development and performance analysis at both component and system levels. Presents models for a range of size units, technology variations, unit coupling dynamics and start-up and shutdown behaviours Focuses on SOFCs integration with mGTs in light of key constraints and risk avoidance issues under steady-state conditions and during transient operations Identifies interaction and coupling problems within the GT/SOFC environment, including exergy analysis and optimization Demonstrates an economical approach to obtaining important experimental results while avoiding high-cost components and risk conditions Presents analytical/computational and experimental tools for the efficient design and development of hardware and software systems Hybrid Systems Based on Solid Oxide Fuel Cells: Modelling and Design is a valuable resource for researchers and practicing engineers involved in fuel cell fundamentals, design and development. It is also an excellent reference for academic researchers and advanced-level students exploring fuel cell technology.

Advances in Semiconductor Technologies

Advances in Semiconductor Technologies
Author: An Chen
Publisher: John Wiley & Sons
Total Pages: 372
Release: 2022-09-27
Genre: Technology & Engineering
ISBN: 1119869609

Advances in Semiconductor Technologies Discover the broad sweep of semiconductor technologies in this uniquely curated resource Semiconductor technologies and innovations have been the backbone of numerous different fields: electronics, online commerce, the information and communication industry, and the defense industry. For over fifty years, silicon technology and CMOS scaling have been the central focus and primary driver of innovation in the semiconductor industry. Traditional CMOS scaling has approached some fundamental limits, and as a result, the pace of scientific research and discovery for novel semiconductor technologies is increasing with a focus on novel materials, devices, designs, architectures, and computer paradigms. In particular, new computing paradigms and systems—such as quantum computing, artificial intelligence, and Internet of Things—have the potential to unlock unprecedented power and application space. Advances in Semiconductor Technologies provides a comprehensive overview of selected semiconductor technologies and the most up-to-date research topics, looking in particular at mainstream developments in current industry research and development, from emerging materials and devices, to new computing paradigms and applications. This full-coverage volume gives the reader valuable insights into state-of-the-art advances currently being fabricated, a wide range of novel applications currently under investigation, and a glance into the future with emerging technologies in development. Advances in Semiconductor Technologies readers will also find: A comprehensive approach that ensures a thorough understanding of state-of-the-art technologies currently being fabricated Treatments on all aspects of semiconductor technologies, including materials, devices, manufacturing, modeling, design, architecture, and applications Articles written by an impressive team of international academics and industry insiders that provide unique insights into a wide range of topics Advances in Semiconductor Technologies is a useful, time-saving reference for electrical engineers working in industry and research, who are looking to stay abreast of rapidly advancing developments in semiconductor electronics, as well as academics in the field and government policy advisors.

Two-Hybrid Systems

Two-Hybrid Systems
Author: Paul N. MacDonald
Publisher: Springer Science & Business Media
Total Pages: 337
Release: 2008-02-03
Genre: Science
ISBN: 1592592104

The yeast two-hybrid system is one of the most widely used and productive techniques available for investigating the macromolecular interactions that affect virtually all biological processes. In Two-Hybrid Systems: Methods and Protocols, Paul N. MacDonald has assembled a collection of these powerful molecular tools for examining and characterizing protein-protein, protein-DNA, and protein-RNA interactions. The techniques range from the most basic (introducing plasmids into yeasts, interaction assays, and recovering the plasmids from yeast) to the most advanced alternative strategies (involving one-hybrid, split two-hybrid, three-hybrid, membrane recruitment systems, and mammalian systems). Methods are also provided for dealing with the well-known problems of artifacts and false positives and for identifying the interacting partners in important biological systems, including the Smad and nuclear receptor pathways. To ensure ready reproducibility and robust results, each technique is described in step-by-step detail by researchers who employ it regularly. Comprehensive and highly practical, Two-Hybrid Systems: Methods and Protocols not only reveals how the great variety of plasmid vectors and approaches may be optimally deployed, but also quickly empowers novices to establish two-hybrid systems in their laboratories, and experienced researchers to expand their repertoire of techniques.

Propulsion Systems for Hybrid Vehicles

Propulsion Systems for Hybrid Vehicles
Author: John M. Miller
Publisher: IET
Total Pages: 473
Release: 2008
Genre: Technology & Engineering
ISBN: 0863419151

Offering in-depth coverage of hybrid propulsion topics, energy storage systems and modelling, and supporting electrical systems, this book will be an invaluable resource for practising engineers and managers involved in all aspects of hybrid vehicle development, modelling, simulation and testing.

Pattern Recognition in Practice IV: Multiple Paradigms, Comparative Studies and Hybrid Systems

Pattern Recognition in Practice IV: Multiple Paradigms, Comparative Studies and Hybrid Systems
Author: E.S. Gelsema
Publisher: Elsevier
Total Pages: 593
Release: 2014-06-28
Genre: Computers
ISBN: 1483297845

The era of detailed comparisons of the merits of techniques of pattern recognition and artificial intelligence and of the integration of such techniques into flexible and powerful systems has begun.So confirm the editors of this fourth volume of Pattern Recognition in Practice, in their preface to the book.The 42 quality papers are sourced from a broad range of international specialists involved in developing pattern recognition methodologies and those using pattern recognition techniques in their professional work. The publication is divided into six sections: Pattern Recognition, Signal and Image Processing, Probabilistic Reasoning, Neural Networks, Comparative Studies, and Hybrid Systems, giving prospective users a feeling for the applicability of the various methods in their particular field of specialization.

Flexible Electronic Packaging and Encapsulation Technology

Flexible Electronic Packaging and Encapsulation Technology
Author: Hong Meng
Publisher: John Wiley & Sons
Total Pages: 389
Release: 2024-03-25
Genre: Technology & Engineering
ISBN: 3527353593

Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.

The Yeast Two-hybrid System

The Yeast Two-hybrid System
Author: Paul L. Bartel
Publisher: Oxford University Press, USA
Total Pages: 362
Release: 1997
Genre: Carrier proteins
ISBN: 9780195109382

This volume, part of the Advances in Molecular Biology series, presents work by pioneers in the field and is the first publication devoted solely to the yeast two-hybrid system. It includes detailed protocols, practical advice on troubleshooting, and suggestions for future development. In addition, it illustrates how to construct an activation domain hybrid library, how to identify mutations that disrupt an interaction, and how to use the system in mammalian cells. Many of the contributors have developed new applications and variations of the technique.

Cryogenic Heat Management

Cryogenic Heat Management
Author: Jonathan Demko
Publisher: CRC Press
Total Pages: 459
Release: 2022-07-21
Genre: Science
ISBN: 1000579689

Cryogenic engineering (cryogenics) is the production, preservation, and use or application of cold. This book presents a comprehensive introduction to designing systems to deal with heat – effective management of cold, exploring the directing (or redirecting), promoting, or inhibiting this flow of heat in a practical way. It provides a description of the necessary theory, design methodology, and advanced demonstrations (thermodynamics, heat transfer, thermal insulation, fluid mechanics) for many frequently occurring situations in low-temperature apparatus. This includes systems that are widely used such as superconducting magnets for magnetic resonance imaging (MRI), high-energy physics, fusion, tokamak and free electron laser systems, space launch and exploration, and energy and transportation use of liquid hydrogen, as well as potential future applications of cryo-life sciences and chemical industries. The book is written with the assumption that the reader has an undergraduate understanding of thermodynamics, heat transfer, and fluid mechanics, in addition to the mechanics of materials, material science, and physical chemistry. Cryogenic Heat Management: Technology and Applications for Science and Industry will be a valuable guide for those researching, teaching, or working with low-temperature or cryogenic systems, in addition to postgraduates studying the topic. Key features: Presents simplified but useful and practical equations that can be applied in estimating performance and design of energy-efficient systems in low-temperature systems or cryogenics Contains practical approaches and advanced design materials for insulation, shields/anchors, cryogen vessels/pipes, calorimeters, cryogenic heat switches, cryostats, current leads, and RF couplers Provides a comprehensive introduction to the necessary theory and models needed for solutions to common difficulties and illustrates the engineering examples with more than 300 figures