High-Thermal-Conductivity AIN Packages for High-Temperature Electronics

High-Thermal-Conductivity AIN Packages for High-Temperature Electronics
Author:
Publisher:
Total Pages: 56
Release: 1995
Genre:
ISBN:

A novel metallization for aluminum nitride substrates to package silicon carbide integrated circuits for use at temperatures of 600 deg C and above was investigated. Chemical equilibrium calculations were used to determine the chemical compatibility of several refractory and transition metal disilicides with AlN and SiC. Tungsten disilicide, niobium disilicide, and titanium disilicide were selected for diffusion couple and thin film deposition studies. AlN-WSi2-SiC, AlN-NbSi2-SiC, and AlN-TiSi2-SiC diffusion couples were formed at 1000 deg C and 1200 deg C. WSi2, NbSi2, and TiSi2 thin films were deposited by RF sputtering on AIN substrates and heat treated at 900 deg C, 1000 deg C, and l200 deg C in an argon atmosphere, while WSi2 thin film was deposited on a single crystal SiC wafer and heat treated at 900 deg C. Sheet resistivities were measured, and interfaces were characterized by scanning and transmission electron microscopy imaging, electron diffraction, and energy dispersive x ray microanalysis spectroscopy. The results show that metal silicides appear to be promising as metallization for aluminum nitride for use at 600 deg C and above.

High Thermal Conductivity AlN Packages for High-Temperature Electronics

High Thermal Conductivity AlN Packages for High-Temperature Electronics
Author:
Publisher:
Total Pages: 0
Release: 1998
Genre:
ISBN:

A novel metallization for aluminum nitride substrates and related interconnection materials were investigated for packaging silicon carbide devices for use at temperatures up to 600 deg C. Aluminum nitride substrates were metallized with refractory metals using both thin and thick film metallization techniques. Excellent metallization adhesions (>- 10 ksi) were achieved at low sheet resistivities for both films. Phase diagrams were used to select potential bond pad, die attach and wire bond materials. Diffusion couples were constructed to screen the selected candidates. Gold and platinum were found to be stable bond pad materials on the refractory metallizations at 700 deg C. Gold-gold and platinum-platinum pad-wire combinations were suitable for use at temperatures of 600 deg C and beyond. Platinum-gold, copper-gold, and nickel-gold pad-wire combinations could be used with refractory metallized aluminum nitride substrate up to 400 deg C.

Materials for High-Temperature Semiconductor Devices

Materials for High-Temperature Semiconductor Devices
Author: National Research Council
Publisher: National Academies Press
Total Pages: 136
Release: 1995-10-14
Genre: Technology & Engineering
ISBN: 0309053358

Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international efforts to develop these materials, identifies the technical barriers to their development and manufacture, determines the criteria for successfully packaging and integrating these devices into existing systems, and recommends future research priorities.

Advanced Thermal Management Materials

Advanced Thermal Management Materials
Author: Guosheng Jiang
Publisher: Springer Science & Business Media
Total Pages: 163
Release: 2012-09-13
Genre: Technology & Engineering
ISBN: 1461419638

Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.

Materials for Electronic Packaging

Materials for Electronic Packaging
Author: Deborah D.L. Chung
Publisher: Elsevier
Total Pages: 383
Release: 1995-03-31
Genre: Technology & Engineering
ISBN: 0080511171

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems

High Thermal Conductivity Materials

High Thermal Conductivity Materials
Author: Subhash L. Shinde
Publisher: Springer Science & Business Media
Total Pages: 302
Release: 2006
Genre: Science
ISBN: 9780387220215

Thedemandfore?cientthermalmanagementhasincreasedsubstantiallyover the last decade in every imaginable area, be it a formula 1 racing car suddenly braking to decelerate from 200 to 50 mph going around a sharp corner, a space shuttle entering the earth’s atmosphere, or an advanced microproc- sor operating at a very high speed. The temperatures at the hot junctions are extremely high and the thermal ?ux can reach values higher than a few 2 hundred to a thousand watts/cm in these applications. To take a speci?c example of the microelectronics area, the chip heat ?ux for CMOS microp- cessors, though moderate compared to the numbers mentioned above have 2 already reached values close to 100 W/cm , and are projected to increase 2 above 200 W/cm over the next few years. Although the thermal mana- ment strategies for microprocessors do involve power optimization through improved design, it is extremely di?cult to eliminate “hot spots” completely. This is where high thermal conductivity materials ?nd most of their appli- tions, as “heat spreaders”. The high thermal conductivity of these materials allows the heat to be carried away from the “hot spots” very quickly in all directions thereby “spreading” the heat. Heat spreading reduces the heat ?ux density, and thus makes it possible to cool systems using standard cooling solutions like ?nned heat sinks with forced air cooling.

Extreme Environment Electronics

Extreme Environment Electronics
Author: John D. Cressler
Publisher: CRC Press
Total Pages: 1044
Release: 2017-12-19
Genre: Technology & Engineering
ISBN: 1351832808

Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.

Advanced Electronic Packaging

Advanced Electronic Packaging
Author: Richard K. Ulrich
Publisher: John Wiley & Sons
Total Pages: 852
Release: 2006-02-24
Genre: Technology & Engineering
ISBN: 0471466093

As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

Materials for High-Temperature Semiconductor Devices

Materials for High-Temperature Semiconductor Devices
Author: National Research Council
Publisher: National Academies Press
Total Pages: 135
Release: 1995-09-14
Genre: Technology & Engineering
ISBN: 0309176050

Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international efforts to develop these materials, identifies the technical barriers to their development and manufacture, determines the criteria for successfully packaging and integrating these devices into existing systems, and recommends future research priorities.

Thermal Management for Opto-electronics Packaging and Applications

Thermal Management for Opto-electronics Packaging and Applications
Author: Xiaobing Luo
Publisher: John Wiley & Sons
Total Pages: 373
Release: 2024-08-12
Genre: Technology & Engineering
ISBN: 1119179270

Thermal Management for Opto-electronics Packaging and Applications A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.