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| Author | : Qing K. Zhu |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 191 |
| Release | : 2013-03-14 |
| Genre | : Technology & Engineering |
| ISBN | : 147573705X |
High-Speed Clock Network Design is a collection of design concepts, techniques and research works from the author for clock distribution in microprocessors and high-performance chips. It is organized in 11 chapters.
| Author | : Eby G. Friedman |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 163 |
| Release | : 2012-12-06 |
| Genre | : Technology & Engineering |
| ISBN | : 1468484400 |
A number of fundamental topics in the field of high performance clock distribution networks is covered in this book. High Performance Clock Distribution Networks is composed of ten contributions from authors at academic and industrial institutions. Topically, these contributions can be grouped within three primary areas. The first topic area deals with exploiting the localized nature of clock skew. The second topic area deals with the implementation of these clock distribution networks, while the third topic area considers more long-range aspects of next-generation clock distribution networks. High Performance Clock Distribution Networks presents a number of interesting strategies for designing and building high performance clock distribution networks. Many aspects of the ideas presented in these contributions are being developed and applied today in next-generation high-performance microprocessors.
| Author | : Sung Kyu Lim |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 573 |
| Release | : 2012-11-27 |
| Genre | : Technology & Engineering |
| ISBN | : 1441995420 |
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.
| Author | : Kerry Bernstein |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 368 |
| Release | : 2012-12-06 |
| Genre | : Technology & Engineering |
| ISBN | : 1461555736 |
High Speed CMOS Design Styles is written for the graduate-level student or practicing engineer who is primarily interested in circuit design. It is intended to provide practical reference, or `horse-sense', to mechanisms typically described with a more academic slant. This book is organized so that it can be used as a textbook or as a reference book. High Speed CMOS Design Styles provides a survey of design styles in use in industry, specifically in the high speed microprocessor design community. Logic circuit structures, I/O and interface, clocking, and timing schemes are reviewed and described. Characteristics, sensitivities and idiosyncrasies of each are highlighted. High Speed CMOS Design Styles also pulls together and explains contributors to performance variability that are associated with process, applications conditions and design. Rules of thumb and practical references are offered. Each of the general circuit families is then analyzed for its sensitivity and response to this variability. High Speed CMOS Design Styles is an excellent source of ideas and a compilation of observations that highlight how different approaches trade off critical parameters in design and process space.
| Author | : Haidi Ibrahim |
| Publisher | : Springer |
| Total Pages | : 821 |
| Release | : 2016-09-29 |
| Genre | : Technology & Engineering |
| ISBN | : 9811017212 |
The proceeding is a collection of research papers presented, at the 9th International Conference on Robotics, Vision, Signal Processing & Power Applications (ROVISP 2016), by researchers, scientists, engineers, academicians as well as industrial professionals from all around the globe to present their research results and development activities for oral or poster presentations. The topics of interest are as follows but are not limited to: • Robotics, Control, Mechatronics and Automation • Vision, Image, and Signal Processing • Artificial Intelligence and Computer Applications • Electronic Design and Applications • Telecommunication Systems and Applications • Power System and Industrial Applications • Engineering Education
| Author | : Aida Todri-Sanial |
| Publisher | : CRC Press |
| Total Pages | : 409 |
| Release | : 2017-12-19 |
| Genre | : Technology & Engineering |
| ISBN | : 1351830198 |
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
| Author | : Hoi-Jun Yoo |
| Publisher | : CRC Press |
| Total Pages | : 304 |
| Release | : 2018-10-08 |
| Genre | : Technology & Engineering |
| ISBN | : 1420051733 |
Chip Design and Implementation from a Practical Viewpoint Focusing on chip implementation, Low-Power NoC for High-Performance SoC Design provides practical knowledge and real examples of how to use network on chip (NoC) in the design of system on chip (SoC). It discusses many architectural and theoretical studies on NoCs, including design methodology, topology exploration, quality-of-service guarantee, low-power design, and implementation trials. The Steps to Implement NoC The book covers the full spectrum of the subject, from theory to actual chip design using NoC. Employing the Unified Modeling Language (UML) throughout, it presents complicated concepts, such as models of computation and communication–computation partitioning, in a manner accessible to laypeople. The authors provide guidelines on how to simplify complex networking theory to design a working chip. In addition, they explore the novel NoC techniques and implementations of the Basic On-Chip Network (BONE) project. Examples of real-time decisions, circuit-level design, systems, and chips give the material a real-world context. Low-Power NoC and Its Application to SoC Design Emphasizing the application of NoC to SoC design, this book shows how to build the complicated interconnections on SoC while keeping a low power consumption.
| Author | : Yezid Donoso |
| Publisher | : CRC Press |
| Total Pages | : 308 |
| Release | : 2009-02-23 |
| Genre | : Computers |
| ISBN | : 1420067540 |
The emergence of quality-of-service (QoS) mechanisms continues to propel the development of real-time multimedia services such as VoIP and videoconferencing. However, many challenges remain in achieving optimized standardization convergence. Network Design for IP Convergence is a comprehensive, global guide to recent advances in IP network implementation. Providing an introduction to basic LAN/WAN/MAN network design, the author covers the latest equipment and architecture, addressing, QoS policies, and integration of services, among other topics. The book explains how to integrate the different layers of reference models and various technological platforms to mirror the harmonization that occurs in the real world of carrier networks. It furnishes appropriate designs for traditional and critical services in the LAN and carrier networks (both MAN and WAN), and it clarifies how a specific layer or technology can cause those services to malfunction. This book lays a foundation for understanding with concepts and applicability of QoS parameters under the multilayer scheme, and a solid explanation of service infrastructure. It goes on to describe integration in both real time and "not real time," elaborating on how both processes can co-exist within the same IP network and concluding with the designs and configurations of service connections. Learn How to Overcome Obstacles to Improve Technology This sweeping analysis of the implementation of IP convergence and QoS mechanisms helps designers and operators get past key obstacles, such as integrating platform layers and technologies and implementing various associated QoS concepts, to improve technology and standards.
| Author | : Ayan Mandal |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 151 |
| Release | : 2013-11-19 |
| Genre | : Technology & Engineering |
| ISBN | : 1461494052 |
This book describes novel methods for network-on-chip (NoC) design, using source-synchronous high-speed resonant clocks. The authors discuss NoCs from the bottom up, providing circuit level details, before providing architectural simulations. As a result, readers will get a complete picture of how a NoC can be designed and optimized. Using the methods described in this book, readers are enabled to design NoCs that are 5X better than existing approaches in terms of latency and throughput and can also sustain a significantly greater amount of traffic.
| Author | : David Robert Stauffer |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 495 |
| Release | : 2008-12-19 |
| Genre | : Technology & Engineering |
| ISBN | : 038779834X |
The simplest method of transferring data through the inputs or outputs of a silicon chip is to directly connect each bit of the datapath from one chip to the next chip. Once upon a time this was an acceptable approach. However, one aspect (and perhaps the only aspect) of chip design which has not changed during the career of the authors is Moore’s Law, which has dictated substantial increases in the number of circuits that can be manufactured on a chip. The pin densities of chip packaging technologies have not increased at the same pace as has silicon density, and this has led to a prevalence of High Speed Serdes (HSS) devices as an inherent part of almost any chip design. HSS devices are the dominant form of input/output for many (if not most) high-integration chips, moving serial data between chips at speeds up to 10 Gbps and beyond. Chip designers with a background in digital logic design tend to view HSS devices as simply complex digital input/output cells. This view ignores the complexity associated with serially moving billions of bits of data per second. At these data rates, the assumptions associated with digital signals break down and analog factors demand consideration. The chip designer who oversimplifies the problem does so at his or her own peril.
