High Performance Wireless Vertical Links With Scalable Time Domain Mixed Signal Processing For 3d Network On Chip
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| Author | : Konstantinos Tatas |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 271 |
| Release | : 2013-10-08 |
| Genre | : Technology & Engineering |
| ISBN | : 1461442745 |
This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.
| Author | : David Munoz |
| Publisher | : Academic Press |
| Total Pages | : 297 |
| Release | : 2009-05-15 |
| Genre | : Technology & Engineering |
| ISBN | : 0080921930 |
This book is the definitive guide to the techniques and applications of position location, covering both terrestrial and satellite systems. It gives all the techniques, theoretical models, and algorithms that engineers need to improve their current location schemes and to develop future location algorithms and systems. Comprehensive coverage is given to system design trade-offs, complexity issues, and the design of efficient positioning algorithms to enable the creation of high-performance location positioning systems. Traditional methods are also reexamined in the context of the challenges posed by reconfigurable and multihop networks. Applications discussed include wireless networks (WiFi, ZigBee, UMTS, and DVB networks), cognitive radio, sensor networks and multihop networks. Features - Contains a complete guide to models, techniques, and applications of position location - Includes applications to wireless networks, demonstrating the relevance of location positioning to these "hot" areas in research and development - Covers system design trade-offs and the design of efficient positioning algorithms, enabling the creation of future location positioning systems - Provides a theoretical underpinning for understanding current position location algorithms, giving researchers a foundation to develop future algorithms David Muñoz is Director and César Vargas is a member of the Center for Electronics and Telecommunications, Tecnológico de Monterrey, Mexico. Frantz Bouchereau is a senior communications software developer at The MathWorks Inc. in Natick, MA. Rogerio Enríquez-Caldera is at Instituto Nacional de Atrofisica, Optica y Electronica (INAOE), Puebla, Mexico. - Contains a complete guide to models, techniques and applications of position location - Includes applications to wireless networks (WiFi, ZigBee, DVB networks), cognitive radio, sensor networks and reconfigurable and multi-hop networks, demonstrating the relevance of location positioning to these 'hot' areas in research and development - Covers system design trade-offs, and the design of efficient positioning algorithms enables the creation of future location positioning systems - Provides a theoretical underpinning for understanding current position location algorithms, giving researchers a foundation to develop future algorithms
| Author | : Paul R. Prucnal |
| Publisher | : CRC Press |
| Total Pages | : 412 |
| Release | : 2017-05-08 |
| Genre | : Science |
| ISBN | : 1498725244 |
This book sets out to build bridges between the domains of photonic device physics and neural networks, providing a comprehensive overview of the emerging field of "neuromorphic photonics." It includes a thorough discussion of evolution of neuromorphic photonics from the advent of fiber-optic neurons to today’s state-of-the-art integrated laser neurons, which are a current focus of international research. Neuromorphic Photonics explores candidate interconnection architectures and devices for integrated neuromorphic networks, along with key functionality such as learning. It is written at a level accessible to graduate students, while also intending to serve as a comprehensive reference for experts in the field.
| Author | : Vivienne Sze |
| Publisher | : Springer Nature |
| Total Pages | : 254 |
| Release | : 2022-05-31 |
| Genre | : Technology & Engineering |
| ISBN | : 3031017668 |
This book provides a structured treatment of the key principles and techniques for enabling efficient processing of deep neural networks (DNNs). DNNs are currently widely used for many artificial intelligence (AI) applications, including computer vision, speech recognition, and robotics. While DNNs deliver state-of-the-art accuracy on many AI tasks, it comes at the cost of high computational complexity. Therefore, techniques that enable efficient processing of deep neural networks to improve key metrics—such as energy-efficiency, throughput, and latency—without sacrificing accuracy or increasing hardware costs are critical to enabling the wide deployment of DNNs in AI systems. The book includes background on DNN processing; a description and taxonomy of hardware architectural approaches for designing DNN accelerators; key metrics for evaluating and comparing different designs; features of DNN processing that are amenable to hardware/algorithm co-design to improve energy efficiency and throughput; and opportunities for applying new technologies. Readers will find a structured introduction to the field as well as formalization and organization of key concepts from contemporary work that provide insights that may spark new ideas.
| Author | : Tadahiro Kuroda |
| Publisher | : Cambridge University Press |
| Total Pages | : 337 |
| Release | : 2021-09-30 |
| Genre | : Technology & Engineering |
| ISBN | : 110884121X |
Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.
| Author | : Giovanni De Micheli |
| Publisher | : Elsevier |
| Total Pages | : 408 |
| Release | : 2006-08-30 |
| Genre | : Technology & Engineering |
| ISBN | : 0080473563 |
The design of today's semiconductor chips for various applications, such as telecommunications, poses various challenges due to the complexity of these systems. These highly complex systems-on-chips demand new approaches to connect and manage the communication between on-chip processing and storage components and networks on chips (NoCs) provide a powerful solution. This book is the first to provide a unified overview of NoC technology. It includes in-depth analysis of all the on-chip communication challenges, from physical wiring implementation up to software architecture, and a complete classification of their various Network-on-Chip approaches and solutions.* Leading-edge research from world-renowned experts in academia and industry with state-of-the-art technology implementations/trends* An integrated presentation not currently available in any other book* A thorough introduction to current design methodologies and chips designed with NoCs
| Author | : Nitish V. Thakor |
| Publisher | : Springer Nature |
| Total Pages | : 3686 |
| Release | : 2023-02-02 |
| Genre | : Technology & Engineering |
| ISBN | : 9811655405 |
This Handbook serves as an authoritative reference book in the field of Neuroengineering. Neuroengineering is a very exciting field that is rapidly getting established as core subject matter for research and education. The Neuroengineering field has also produced an impressive array of industry products and clinical applications. It also serves as a reference book for graduate students, research scholars and teachers. Selected sections or a compendium of chapters may be used as “reference book” for a one or two semester graduate course in Biomedical Engineering. Some academicians will construct a “textbook” out of selected sections or chapters. The Handbook is also meant as a state-of-the-art volume for researchers. Due to its comprehensive coverage, researchers in one field covered by a certain section of the Handbook would find other sections valuable sources of cross-reference for information and fertilization of interdisciplinary ideas. Industry researchers as well as clinicians using neurotechnologies will find the Handbook a single source for foundation and state-of-the-art applications in the field of Neuroengineering. Regulatory agencies, entrepreneurs, investors and legal experts can use the Handbook as a reference for their professional work as well.
| Author | : Frank H. P. Fitzek |
| Publisher | : Academic Press |
| Total Pages | : 510 |
| Release | : 2021-03-06 |
| Genre | : Technology & Engineering |
| ISBN | : 0128213558 |
Tactile Internet with Human-in-the-Loop describes the change from the current Internet, which focuses on the democratization of information independent of location or time, to the Tactile Internet, which democratizes skills to promote equity that is independent of age, gender, sociocultural background or physical limitations. The book promotes the concept of the Tactile Internet for remote closed-loop human-machine interaction and describes the main challenges and key technologies. Current standardization activities in the field for IEEE and IETF are also described, making this book an ideal resource for researchers, graduate students, and industry R&D engineers in communications engineering, electronic engineering, and computer engineering. - Provides a comprehensive reference that addresses all aspects of the Tactile Internet – technologies, engineering challenges, use cases and standards - Written by leading researchers in the field - Presents current standardizations surrounding the IETF and the IEEE - Contains use cases that illustrate practical applications
| Author | : Tünde Kirstein |
| Publisher | : Elsevier |
| Total Pages | : 540 |
| Release | : 2013-04-04 |
| Genre | : Technology & Engineering |
| ISBN | : 0857093533 |
Smart-textiles developers draw on diverse fields of knowledge to produce unique materials with enhanced properties and vast potential. Several disciplines outside the traditional textile area are involved in the construction of these smart textiles, and each individual field has its own language, specific terms and approaches. Multidisciplinary know-how for smart-textiles developers provides a filtered knowledge of these areas of expertise, explaining key expressions and demonstrating their relevance to the smart-textiles field.Following an introduction to the new enabling technologies, commercialisation and market trends that make up the future of smart-textiles development, part one reviews materials employed in the production of smart textiles. Types and processing of electro-conductive and semiconducting materials, optical fibres for smart photonic textiles, conductive nanofibres and nanocoatings, polymer-based resistive sensors, and soft capacitance fibres for touch-sensitive smart textiles are all discussed. Part two then investigates such technologies as the embedding of electronic functions, the integration of thin-film electronics, and the development of organic and large-area electronic (OLAE) technologies for smart textiles. Joining technologies are also discussed, alongside kinetic, thermoelectric and solar energy harvesting technologies, and signal processing technologies for activity-aware smart textiles. Finally, product development and applications are the focus of part three, which investigates strategies for technology management, innovation and improved sustainability, before the book concludes by exploring medical, automotive and architectural applications of smart textiles.With its distinguished editor and international team of expert contributors, Multidisciplinary know-how for smart-textiles developers is a key tool for readers working in industries including design, fashion, textiles, through to electronics, computing and material science. It also provides a useful guide to the subject for academics working across a wide range of fields. - Reviews materials used in the production of smart textiles - Examines the technologies used in smart textiles, such as optical fibres and polymer based resistive sensors - Investigates strategies for technology management, innovation and improved development
| Author | : Chrysostomos Nicopoulos |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 237 |
| Release | : 2009-09-18 |
| Genre | : Technology & Engineering |
| ISBN | : 904813031X |
[2]. The Cell Processor from Sony, Toshiba and IBM (STI) [3], and the Sun UltraSPARC T1 (formerly codenamed Niagara) [4] signal the growing popularity of such systems. Furthermore, Intel’s very recently announced 80-core TeraFLOP chip [5] exemplifies the irreversible march toward many-core systems with tens or even hundreds of processing elements. 1.2 The Dawn of the Communication-Centric Revolution The multi-core thrust has ushered the gradual displacement of the computati- centric design model by a more communication-centric approach [6]. The large, sophisticated monolithic modules are giving way to several smaller, simpler p- cessing elements working in tandem. This trend has led to a surge in the popularity of multi-core systems, which typically manifest themselves in two distinct incarnations: heterogeneous Multi-Processor Systems-on-Chip (MPSoC) and homogeneous Chip Multi-Processors (CMP). The SoC philosophy revolves around the technique of Platform-Based Design (PBD) [7], which advocates the reuse of Intellectual Property (IP) cores in flexible design templates that can be customized accordingly to satisfy the demands of particular implementations. The appeal of such a modular approach lies in the substantially reduced Time-To- Market (TTM) incubation period, which is a direct outcome of lower circuit complexity and reduced design effort. The whole system can now be viewed as a diverse collection of pre-existing IP components integrated on a single die.
