Handbook Of Vlsi Microlithography
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Author | : John N. Helbert |
Publisher | : Cambridge University Press |
Total Pages | : 1026 |
Release | : 2001-04 |
Genre | : Technology & Engineering |
ISBN | : 0080946801 |
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatingsùincluding optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely coveredùincluding an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
Author | : William B. Glendinning |
Publisher | : William Andrew |
Total Pages | : 672 |
Release | : 2012-12-02 |
Genre | : Technology & Engineering |
ISBN | : 1437728227 |
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings-- including optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely covered -- including an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
Author | : P. Rai-Choudhury |
Publisher | : IET |
Total Pages | : 784 |
Release | : 1997 |
Genre | : Technology & Engineering |
ISBN | : 9780852969069 |
Focusing on the use of microlithography techniques in microelectronics manufacturing, this volume is one of a series addressing a rapidly growing field affecting the integrated circuit industry. New applications in such areas as sensors, actuators and biomedical devices, are described.
Author | : Ioan D. Marinescu |
Publisher | : William Andrew |
Total Pages | : 501 |
Release | : 2000-01-01 |
Genre | : Technology & Engineering |
ISBN | : 0815517416 |
Focusing on the machining of ceramic materials such as silicon nitride, silicon carbide, and zirconia, this handbook meets the growing need in industry for a clear understanding of modern improvements in ceramic processing. The presentation is international in scope, with techniques and information represented from the USA, Japan, Germany, and the United Kingdomùcountries that have made important contributions to the field. The 20 expert chapter authors explore the challenge of reducing the costs of machining operations, a continuing problem in an industry where ceramic parts must be machined into final form to achieve a proper fit. The handbook reveals that the abrasive machining of ceramic materials will always be a requirement because of the difficulty of controlling parts dimensions at the high temperatures required in their creation. The contributors then explain the properties and characteristics of ceramics, the various types of abrasive processes, and typical tests used in the procedures. An entire section of the handbook concerns grinding tools, their conditioning, lubrication, and cooling, checking for wear on the tools, and using them efficiently. The book also examines modern honing and superfinishing tools and machines, and describes advances in the technology, as well as lapping and polishing techniques using chemical compounds and ultrasound.Ceramics is a field where more advanced products are sure to appear. Many of the products will require advanced, better-controlled processing technologies; vastly improved productivity in manufacturing; and increased product reliability. The contributors to this Handbook will assist readers in the attainment of these important goals.
Author | : James J. Licari |
Publisher | : Elsevier |
Total Pages | : 603 |
Release | : 1998-12-31 |
Genre | : Technology & Engineering |
ISBN | : 081551798X |
The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.
Author | : Jon Orloff |
Publisher | : CRC Press |
Total Pages | : 666 |
Release | : 2017-12-19 |
Genre | : Science |
ISBN | : 1420045555 |
With the growing proliferation of nanotechnologies, powerful imaging technologies are being developed to operate at the sub-nanometer scale. The newest edition of a bestseller, the Handbook of Charged Particle Optics, Second Edition provides essential background information for the design and operation of high resolution focused probe instruments. The book’s unique approach covers both the theoretical and practical knowledge of high resolution probe forming instruments. The second edition features new chapters on aberration correction and applications of gas phase field ionization sources. With the inclusion of additional references to past and present work in the field, this second edition offers perfectly calibrated coverage of the field’s cutting-edge technologies with added insight into how they work. Written by the leading research scientists, the second edition of the Handbook of Charged Particle Optics is a complete guide to understanding, designing, and using high resolution probe instrumentation.
Author | : R.J. Shul |
Publisher | : Springer Science & Business Media |
Total Pages | : 664 |
Release | : 2011-06-28 |
Genre | : Technology & Engineering |
ISBN | : 3642569897 |
Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.
Author | : D. Nirmal |
Publisher | : CRC Press |
Total Pages | : 434 |
Release | : 2019-05-14 |
Genre | : Science |
ISBN | : 0429862520 |
This book focusses on III-V high electron mobility transistors (HEMTs) including basic physics, material used, fabrications details, modeling, simulation, and other important aspects. It initiates by describing principle of operation, material systems and material technologies followed by description of the structure, I-V characteristics, modeling of DC and RF parameters of AlGaN/GaN HEMTs. The book also provides information about source/drain engineering, gate engineering and channel engineering techniques used to improve the DC-RF and breakdown performance of HEMTs. Finally, the book also highlights the importance of metal oxide semiconductor high electron mobility transistors (MOS-HEMT). Key Features Combines III-As/P/N HEMTs with reliability and current status in single volume Includes AC/DC modelling and (sub)millimeter wave devices with reliability analysis Covers all theoretical and experimental aspects of HEMTs Discusses AlGaN/GaN transistors Presents DC, RF and breakdown characteristics of HEMTs on various material systems using graphs and plots
Author | : Paul H. Holloway |
Publisher | : Cambridge University Press |
Total Pages | : 937 |
Release | : 2008-10-19 |
Genre | : Technology & Engineering |
ISBN | : 0080946143 |
This book reviews the recent advances and current technologies used to produce microelectronic and optoelectronic devices from compound semiconductors. It provides a complete overview of the technologies necessary to grow bulk single-crystal substrates, grow hetero-or homoepitaxial films, and process advanced devices such as HBT's, QW diode lasers, etc.
Author | : Hugh O. Pierson |
Publisher | : William Andrew |
Total Pages | : 363 |
Release | : 1996-12-31 |
Genre | : Technology & Engineering |
ISBN | : 081551770X |
Refractory carbides and nitrides are useful materials with numerous industrial applications and a promising future, in addition to being materials of great interest to the scientific community. Although most of their applications are recent, the refractory carbides and nitrides have been known for over one hundred years. The industrial importance of the refractory carbides and nitrides is growing rapidly, not only in the traditional and well-established applications based on the strength and refractory nature of these materials such as cutting tools and abrasives, but also in new and promising fields such as electronics and optoelectronics.