Handbook Of Integrated Circuit Industry
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| Author | : Yangyuan Wang |
| Publisher | : Springer Nature |
| Total Pages | : 2006 |
| Release | : 2023-12-29 |
| Genre | : Technology & Engineering |
| ISBN | : 9819928362 |
Written by hundreds experts who have made contributions to both enterprise and academics research, these excellent reference books provide all necessary knowledge of the whole industrial chain of integrated circuits, and cover topics related to the technology evolution trends, fabrication, applications, new materials, equipment, economy, investment, and industrial developments of integrated circuits. Especially, the coverage is broad in scope and deep enough for all kind of readers being interested in integrated circuit industry. Remarkable data collection, update marketing evaluation, enough working knowledge of integrated circuit fabrication, clear and accessible category of integrated circuit products, and good equipment insight explanation, etc. can make general readers build up a clear overview about the whole integrated circuit industry. This encyclopedia is designed as a reference book for scientists and engineers actively involved in integrated circuit research and development field. In addition, this book provides enough guide lines and knowledges to benefit enterprisers being interested in integrated circuit industry.
| Author | : Philip Garrou |
| Publisher | : John Wiley & Sons |
| Total Pages | : 798 |
| Release | : 2011-09-22 |
| Genre | : Technology & Engineering |
| ISBN | : 352762306X |
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
| Author | : Robert Zorich |
| Publisher | : Academic Press |
| Total Pages | : 604 |
| Release | : 2012-12-02 |
| Genre | : Technology & Engineering |
| ISBN | : 0323140556 |
Here is a comprehensive practical guide to entire wafer fabrication process from A to Z. Written by a practicing process engineer with years of experience, this book provides a thorough introduction to the complex field of IC manufacturing, including wafer area layout and design, yield optimization, just-in-time management systems, statistical quality control, fabrication equipment and its setup, and cleanroom techniques. In addition, it contains a wealth of information on common process problems: How to detect them, how to confirm them, and how to solve them. Whether you are a new enginner or technician just entering the field, a fabrication manager looking for ways to improve quality and production, or someone who would just like to know more about IC manufacturing, this is the book you're looking for. - Provides a readable, practical overview of the entire wafer fabrication process for new engineers and those just entering this complex field - Enables engineers and managers to improve production, raise quality levels, and solve problems that commonly occur in the fabrication process - Presents the latest techniques and gives special attention to Japanese IC manufacturing techniques, showing how they obtain outstanding quality
| Author | : P. Rai-Choudhury |
| Publisher | : SPIE Press |
| Total Pages | : 706 |
| Release | : 1997 |
| Genre | : Technology & Engineering |
| ISBN | : 9780819423795 |
Focusing on the use of microlithography techniques in microelectronics manufacturing, this volume is one of a series addressing a rapidly growing field affecting the integrated circuit industry. New applications in such areas as sensors, actuators and biomedical devices, are described.
| Author | : |
| Publisher | : Elsevier |
| Total Pages | : 385 |
| Release | : 1995-09-27 |
| Genre | : Technology & Engineering |
| ISBN | : 0080532292 |
Gallium Arsenide IC Applications Handbook is the first text to offer a comprehensive treatment of Gallium Arsenide (GaAs) integrated chip (IC) applications, specifically in microwave systems. The books coverage of GaAs in microwave monolithic ICs demonstrates why GaAs is being hailed as a material of the future for the various advantages it holds over silicon. This volume provides scientists, physicists, electrical engineers, and technology professionals and managers working on microwave technology with practical information on GaAs applications in radar, electronic warfare, communications, consumer electronics, automotive electronics and traffic control. Includes an executive summary in each volume and chapter Facilitates comprehension with its tutorial writing style Covers key technical issues Emphasizes practical aspects of the technology Contains minimal mathematics Provides a complete reference list
| Author | : R.R. Tummala |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 1060 |
| Release | : 2013-11-27 |
| Genre | : Computers |
| ISBN | : 1461560373 |
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
| Author | : Yoshio Nishi |
| Publisher | : CRC Press |
| Total Pages | : 3276 |
| Release | : 2017-12-19 |
| Genre | : Technology & Engineering |
| ISBN | : 1351829823 |
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
| Author | : Shenzhen Securities Information CO. LTD |
| Publisher | : Javvin Technologies Inc. |
| Total Pages | : 419 |
| Release | : 1900 |
| Genre | : |
| ISBN | : 1602670269 |
| Author | : J. David Irwin |
| Publisher | : CRC Press |
| Total Pages | : 1740 |
| Release | : 1997-05-09 |
| Genre | : Technology & Engineering |
| ISBN | : 9780849383434 |
From traditional topics that form the core of industrial electronics, to new and emerging concepts and technologies, The Industrial Electronics Handbook, in a single volume, has the field covered. Nowhere else will you find so much information on so many major topics in the field. For facts you need every day, and for discussions on topics you have only dreamed of, The Industrial Electronics Handbook is an ideal reference.
| Author | : Jeorge S. Hurtarte |
| Publisher | : Elsevier |
| Total Pages | : 294 |
| Release | : 2011-04-01 |
| Genre | : Technology & Engineering |
| ISBN | : 008055119X |
Fabless (no fabrication) IC (integrated circuit) techniques are growing rapidly and promise to become the standard method of IC manufacturing in the near future, this book will provide readers with what will soon be required knowledge of the subject. Other books on IC fabrication deal with the strictly physical process aspects of the topic and assume all factors in IC fabrication are under the control of the IC designing company. By contrast, this title recognizing that fabless IC design is often as much about managing business relationships as it is about physical processes. "Fabless ICs are those designed and marketed by one company but actually manufactured by another.*Written by board members of the Fabless Semiconductor Association, an industry consortium that include Xilinx, Intersil, Micro Linear, and many other members*Approriate for a wide range of integrated circuit (IC) designers and users who need to understand the fabless process and its advantages/limitations*Discusses important topics such as negotiating with outside fabrication companies, choosing the right electronic design tools, protection of intellectual property and business plans, and maintaining quality control
