Fundamentals of Interfacial Engineering

Fundamentals of Interfacial Engineering
Author: Robert J. Stokes
Publisher: John Wiley & Sons
Total Pages: 736
Release: 1996-12-27
Genre: Science
ISBN: 9780471186472

Eine in sich geschlossene, umfassende Einführung in die Grundlagen der Grenzflächenphänomene und ihrer Anwendung auf Prozesse und Produktdesign - geschrieben für Ingenieure aus Chemie, Elektronik und Biomedizin. Zwischenmolekulare Wechselwirkungen an der Grenzfläche werden ausführlich behandelt; Eigenschaften, Verarbeitung und Verhalten fluider Grenzflächen werden ebenso diskutiert wie Ober- und Grenzflächenmerkmale fester Stoffe. Dieses Buch ist relevant für den Praktiker in der Industrie, stellt aber gleichzeitig eine wertvolle Hilfe für Lehrkräfte ingenieurwissenschaftlicher Fachrichtungen bei der Ausbildungsplanung dar.

Fundamentals of Interface and Colloid Science

Fundamentals of Interface and Colloid Science
Author: J. Lyklema
Publisher: Elsevier
Total Pages: 844
Release: 2005-03-30
Genre: Science
ISBN: 0080457401

Volume V is the counterpart of Volume IV and treats hydrophilic colloids and related items. Contains edited contributions on steric stabilization, depletion, polyelectrolytes, proteins at interfaces, association colloids, microemulsions, thin films, foams and emulsions. J. Lyklema is coauthor of two chapters and general editor. Other authors include: G.J. Fleer, F.A.M. Leermakers, M.A. Cohen Stuart, W. Norde, J.A.G. Buijs, J.C. Eriksson, T.Sottmann, R. Strey, D. Platikanov, D. Ekserova, V.Bergeron and P.Walstra. * This volume completes the prestigious series Fundamentals of Interface and Colloid Science* Together with Volume IV this book provides a comprehensive introduction to colloid science.* Explains and elaborates phenomena starting from basic principles and progresses to more advanced topics

Luminous Chemical Vapor Deposition and Interface Engineering

Luminous Chemical Vapor Deposition and Interface Engineering
Author: Hirotsugu Yasuda
Publisher: CRC Press
Total Pages: 840
Release: 2004-11-30
Genre: Science
ISBN: 1420030299

Providing in-depth coverage of the technologies and various approaches, Luminous Chemical Vapor Deposition and Interface Engineering showcases the development and utilization of LCVD procedures in industrial scale applications. It offers a wide range of examples, case studies, and recommendations for clear understanding of this innovative science.

Interfacial Engineering for Optimized Properties: Volume 458

Interfacial Engineering for Optimized Properties: Volume 458
Author: Clyde L. Briant
Publisher:
Total Pages: 546
Release: 1997-07-08
Genre: Science
ISBN:

The study of interfaces is one of the oldest areas of research in materials science. The presence of grain boundaries in materials has long been recognized, as has its crucial role in determining mechanical properties. Another long-recognized concept is that the properties of a surface are quite different from those of the bulk. In recent years, researchers have been able to study these interfaces, both internal and external, with a detail not before possible. These advances have stemmed from the ability to obtain atomic resolution images of interfaces, to measure accurate chemical compositions of interfaces, and to model these interfaces and their properties. This volume goes a step further, beyond structural and chemical studies, to explore how all of this information can be used to engineer interfaces for improved properties and overall improved material performance. Significant attention is given to the crystallographic nature of grain boundaries and interfaces, and the relationship between this nature and the performance of a material. The versatility of electron back-scattering pattern analysis (EBSP) in solving a number of interface-related problems is also featured.

Interface Engineering in Organic Field-Effect Transistors

Interface Engineering in Organic Field-Effect Transistors
Author: Xuefeng Guo
Publisher: John Wiley & Sons
Total Pages: 277
Release: 2023-09-25
Genre: Technology & Engineering
ISBN: 3527351450

Systematic summary of advances in developing effective methodologies of interface engineering in organic field-effect transistors, from models to experimental techniques Interface Engineering in Organic Field-Effect Transistors covers the state of the art in organic field-effect transistors and reviews charge transport at the interfaces, device design concepts, and device fabrication processes, and gives an outlook on the development of future optoelectronic devices. This book starts with an overview of the commonly adopted methods to obtain various semiconductor/semiconductor interfaces and charge transport mechanisms at these heterogeneous interfaces. Then, it covers the modification at the semiconductor/electrode interfaces, through which to tune the work function of electrodes as well as reveal charge injection mechanisms at the interfaces. Charge transport physics at the semiconductor/dielectric interface are discussed in detail. The book describes the remarkable effect of SAM modification on the semiconductor film morphology and thus the electrical performance. In particular, valuable analysis of charge trapping/detrapping engineering at the interface to realize new functions are summarized. Finally, the sensing mechanisms that occur at the semiconductor/environment interfaces of OFETs and the unique detection methods capable of interfacing organic electronics with biology are discussed. Specific sample topics covered in Interface Engineering in Organic Field-Effect Transistors include: Noncovalent modification methods, charge insertion layer at the electrode surface, dielectric surface passivation methods, and covalent modification methods Charge transport mechanism in bulk semiconductors, influence of additives on materials’ nucleation and morphology, solvent additives, and nucleation agents Nanoconfinement effect, enhancing the performance through semiconductor heterojunctions, planar bilayer heterostructure, ambipolar charge-transfer complex, and supramolecular arrangement of heterojunctions Dielectric effect in OFETs, dielectric modification to tune semiconductor morphology, surface energy control, microstructure design, solution shearing, eliminating interfacial traps, and SAM/SiO2 dielectrics A timely resource providing the latest developments in the field and emphasizing new insights for building reliable organic electronic devices, Interface Engineering in Organic Field-Effect Transistors is essential for researchers, scientists, and other interface-related professionals in the fields of organic electronics, nanoelectronics, surface science, solar cells, and sensors.

Introduction to Physical Polymer Science

Introduction to Physical Polymer Science
Author: Leslie H. Sperling
Publisher: John Wiley & Sons
Total Pages: 815
Release: 2015-02-02
Genre: Technology & Engineering
ISBN: 1119103746

An Updated Edition of the Classic Text Polymers constitute the basis for the plastics, rubber, adhesives, fiber, and coating industries. The Fourth Edition of Introduction to Physical Polymer Science acknowledges the industrial success of polymers and the advancements made in the field while continuing to deliver the comprehensive introduction to polymer science that made its predecessors classic texts. The Fourth Edition continues its coverage of amorphous and crystalline materials, glass transitions, rubber elasticity, and mechanical behavior, and offers updated discussions of polymer blends, composites, and interfaces, as well as such basics as molecular weight determination. Thus, interrelationships among molecular structure, morphology, and mechanical behavior of polymers continue to provide much of the value of the book. Newly introduced topics include: Nanocomposites, including carbon nanotubes and exfoliated montmorillonite clays The structure, motions, and functions of DNA and proteins, as well as the interfaces of polymeric biomaterials with living organisms The glass transition behavior of nano-thin plastic films In addition, new sections have been included on fire retardancy, friction and wear, optical tweezers, and more. Introduction to Physical Polymer Science, Fourth Edition provides both an essential introduction to the field as well as an entry point to the latest research and developments in polymer science and engineering, making it an indispensable text for chemistry, chemical engineering, materials science and engineering, and polymer science and engineering students and professionals.

Colloid and Interface Science

Colloid and Interface Science
Author: Pallab Ghosh
Publisher: PHI Learning Pvt. Ltd.
Total Pages: 519
Release: 2009
Genre: Technology & Engineering
ISBN: 812033857X

Provides a thorough understanding of the fundamental concepts and applications of colloid and interface science. It deals with the colloid chemistry and interfacial phenomena at both fluid-fluid and solid-fluid interfaces. The emerging areas of colloid and interface science such as nanomaterials and nanotechnology are also discussed.

Reliability Physics and Engineering

Reliability Physics and Engineering
Author: J. W. McPherson
Publisher: Springer Science & Business Media
Total Pages: 324
Release: 2010-08-05
Genre: Technology & Engineering
ISBN: 1441963480

All engineers could bene?t from at least one course in reliability physics and engineering. It is very likely that, starting with your very ?rst engineering po- tion, you will be asked — how long is your newly developed device expected to last? This text was designed to help you to answer this fundamentally important question. All materials and devices are expected to degrade with time, so it is very natural to ask — how long will the product last? The evidence for material/device degradation is apparently everywhere in nature. A fresh coating of paint on a house will eventually crack and peel. Doors in a new home can become stuck due to the shifting of the foundation. The new ?nish on an automobile will oxidize with time. The tight tolerances associated with ?nely meshed gears will deteriorate with time. Critical parameters associated with hi- precision semiconductor devices (threshold voltages, drive currents, interconnect resistances, capacitor leakages, etc.) will degrade with time. In order to und- stand the lifetime of the material/device, it is important to understand the reliability physics (kinetics) for each of the potential failure mechanisms and then be able to develop the required reliability engineering methods that can be used to prevent, or at least minimize the occurrence of, device failure.

Computational Contact and Impact Mechanics

Computational Contact and Impact Mechanics
Author: Tod A. Laursen
Publisher: Springer Science & Business Media
Total Pages: 476
Release: 2003-05-12
Genre: Science
ISBN: 9783540429067

Many physical systems require the description of mechanical interaction across interfaces if they are to be successfully analyzed. Examples in the engineered world range from the design of prosthetics in biomedical engi neering (e. g. , hip replacements); to characterization of the response and durability of head/disk interfaces in computer magnetic storage devices; to development of pneumatic tires with better handling characteristics and increased longevity in automotive engineering; to description of the adhe sion and/or relative slip between concrete and reinforcing steel in structural engineering. Such mechanical interactions, often called contact/impact in teractions, usually necessitate at minimum the determination of areas over which compressive pressures must act to prevent interpenetration of the mechanical entities involved. Depending on the application, frictional be havior, transient interaction of interfaces with their surroundings (e. g. , in termittent stick/slip), thermo-mechanical coupling, interaction with an in tervening lubricant and/or fluid layer, and damage of the interface (i. e. , wear) may also be featured. When taken together (or even separately!), these features have the effect of making the equations of mechanical evolu tion not only highly nonlinear, but highly nonsmooth as well. While many modern engineering simulation packages possess impressive capabilities in the general area of nonlinear mechanics, it can be contended that methodologies typically utilized for contact interactions are relatively immature in comparison to other components of a nonlinear finite element package, such as large deformation kinematics, inelastic material modeling, nonlinear equation solving, or linear solver technology.