Fundamentals of Grain and Interphase Boundary Diffusion

Fundamentals of Grain and Interphase Boundary Diffusion
Author: Inderjeet Kaur
Publisher: Wiley
Total Pages: 0
Release: 1995-06-08
Genre: Technology & Engineering
ISBN: 9780471938194

This book is the first comprehensive treatise of one of the key physical processes occurring in various materials at elevated temperatures. The book provides essential background information for materials scientists, metallurgists, solid state physicists and semiconductor technologists carrying out research or development in this and related areas. The first and second editions of the book were published by the University of Stuttgart in 1988 and 1989. In the present third edition the book has been updated and essentially enlarged to cover all recent developments in the area of grain and interphase boundary diffusion. The reader will find more than 100 new text pages, 60 new figures and 100 new references. This unique book is strongly recommended as a textbook for students as well as a reference book for physicists, chemists, metallurgists and engineers.

Fundamentals of Materials Science

Fundamentals of Materials Science
Author: Eric J. Mittemeijer
Publisher: Springer Nature
Total Pages: 754
Release: 2022-01-01
Genre: Technology & Engineering
ISBN: 3030600564

This textbook offers a strong introduction to the fundamental concepts of materials science. It conveys the quintessence of this interdisciplinary field, distinguishing it from merely solid-state physics and solid-state chemistry, using metals as model systems to elucidate the relation between microstructure and materials properties. Mittemeijer's Fundamentals of Materials Science provides a consistent treatment of the subject matter with a special focus on the microstructure-property relationship. Richly illustrated and thoroughly referenced, it is the ideal adoption for an entire undergraduate, and even graduate, course of study in materials science and engineering. It delivers a solid background against which more specialized texts can be studied, covering the necessary breadth of key topics such as crystallography, structure defects, phase equilibria and transformations, diffusion and kinetics, and mechanical properties. The success of the first edition has led to this updated and extended second edition, featuring detailed discussion of electron microscopy, supermicroscopy and diffraction methods, an extended treatment of diffusion in solids, and a separate chapter on phase transformation kinetics. “In a lucid and masterly manner, the ways in which the microstructure can affect a host of basic phenomena in metals are described.... By consistently staying with the postulated topic of the microstructure - property relationship, this book occupies a singular position within the broad spectrum of comparable materials science literature .... it will also be of permanent value as a reference book for background refreshing, not least because of its unique annotated intermezzi; an ambitious, remarkable work.” G. Petzow in International Journal of Materials Research. “The biggest strength of the book is the discussion of the structure-property relationships, which the author has accomplished admirably.... In a nutshell, the book should not be looked at as a quick ‘cook book’ type text, but as a serious, critical treatise for some significant time to come.” G.S. Upadhyaya in Science of Sintering. “The role of lattice defects in deformation processes is clearly illustrated using excellent diagrams . Included are many footnotes, ‘Intermezzos’, ‘Epilogues’ and asides within the text from the author’s experience. This ..... soon becomes valued for the interesting insights into the subject and shows the human side of its history. Overall this book provides a refreshing treatment of this important subject and should prove a useful addition to the existing text books available to undergraduate and graduate students and researchers in the field of materials science.” M. Davies in Materials World.

Diffusion in Solids

Diffusion in Solids
Author: Helmut Mehrer
Publisher: Springer Science & Business Media
Total Pages: 645
Release: 2007-07-24
Genre: Technology & Engineering
ISBN: 354071488X

This book describes the central aspects of diffusion in solids, and goes on to provide easy access to important information about diffusion in metals, alloys, semiconductors, ion-conducting materials, glasses and nanomaterials. Coverage includes diffusion-controlled phenomena including ionic conduction, grain-boundary and dislocation pipe diffusion. This book will benefit graduate students in such disciplines as solid-state physics, physical metallurgy, materials science, and geophysics, as well as scientists in academic and industrial research laboratories.

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
Author: Yosi Shacham-Diamand
Publisher: Springer Science & Business Media
Total Pages: 545
Release: 2009-09-19
Genre: Science
ISBN: 0387958681

In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

Silicides: Fundamentals & Applications

Silicides: Fundamentals & Applications
Author: Francois D'heurle
Publisher: World Scientific
Total Pages: 390
Release: 2000-12-18
Genre: Science
ISBN: 9814492183

Silicides were introduced into the technology of electronic devices some thirty years ago; since then, they have been continuously used to form both ohmic and rectifying contacts to silicon. Silicides are also important for other applications (thermoelectric devices and structural applications, such as jet engines), but it is not easy to find an updated reference containing both their basic properties, either chemical or physical, and the latest applications.The 16th Course of the International School of Solid State Physics, held in Erice (Italy) in the late spring of 1999, was intended to break artificial barriers between disciplines, and to gather people concerned with the properties and applications of silicides, regardless of the formal fields to which they belong, or of the practical goals they pursue. This book is therefore concerned with theory as well as applications, metallurgy as well as physics, and materials science as well as microelectronics.

Grain Boundary Diffusion and Properties of Nanostructured Materials

Grain Boundary Diffusion and Properties of Nanostructured Materials
Author: Yu R. Kolobov
Publisher: Cambridge Int Science Publishing
Total Pages: 247
Release: 2007
Genre: Technology & Engineering
ISBN: 1904602177

The authors examine the main relationships of the process of grain boundary diffusion in bicrystals, coarse-grained polycrystals and nanostructured materials. The results of investigations of diffusion-related processes of recovery, recystallisation and development of plastic deformation in creep, static and cyclic loading in bulk nanostructured materials produced by high-intensity plastic deformation are presented.

Fundamentals of Ceramics

Fundamentals of Ceramics
Author: Michel Barsoum
Publisher: CRC Press
Total Pages: 567
Release: 2019-12-12
Genre: Science
ISBN: 1000397955

Fundamentals of Ceramics presents readers with an exceptionally clear and comprehensive introduction to ceramic science. This Second Edition updates problems and adds more worked examples, as well as adding new chapter sections on Computational Materials Science and Case Studies. The Computational Materials Science sections describe how today density functional theory and molecular dynamics calculations can shed valuable light on properties, especially ones that are not easy to measure or visualize otherwise such as surface energies, elastic constants, point defect energies, phonon modes, etc. The Case Studies sections focus more on applications, such as solid oxide fuel cells, optical fibers, alumina forming materials, ultra-strong and thin glasses, glass-ceramics, strong and tough ceramics, fiber-reinforced ceramic matrix composites, thermal barrier coatings, the space shuttle tiles, electrochemical impedance spectroscopy, two-dimensional solids, field-assisted and microwave sintering, colossal magnetoresistance, among others.

An Introduction to Aspects of Thermodynamics and Kinetics Relevant to Materials Science

An Introduction to Aspects of Thermodynamics and Kinetics Relevant to Materials Science
Author: Eugene Machlin
Publisher: Elsevier
Total Pages: 478
Release: 2010-07-07
Genre: Science
ISBN: 0080549683

This book is based on a set of notes developed over many years for an introductory course taught to seniors and entering graduate students in materials science. An Introduction to Aspects of Thermodynamics and Kinetics Relevant to Materials Science is about the application of thermodynamics and kinetics to solve problems within Materials Science. Emphasis is to provide a physical understanding of the phenomenon under discussion, with the mathematics presented as a guide. The problems are used to provide practice in quantitative application of principles, and also to give examples of applications of the general subject matter to problems having current interest and to emphasize the important physical concepts. End of chapter problems are included, as are references, and bibliography to reinforce the text. This book provides students with the theory and mathematics to understand the important physical understanding of phenomena. - Based on a set of notes developed over many years for an introductory course taught to seniors and entering graduate students in materials science - Provides students with the theory and mathematics to understand the important physical understanding of phenomena - Includes end of chapter problems, references, and bibliography to reinforce the text