Fourteenth Annual Ieee Semiconductor Thermal Measurement And Management Symposium
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Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium
Author | : |
Publisher | : Institute of Electrical & Electronics Engineers(IEEE) |
Total Pages | : 272 |
Release | : 1996 |
Genre | : Technology & Engineering |
ISBN | : |
Thermal and Electro-thermal System Simulation 2020
Author | : Márta Rencz |
Publisher | : MDPI |
Total Pages | : 310 |
Release | : 2021-01-12 |
Genre | : Technology & Engineering |
ISBN | : 303943831X |
This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
The Industrial Electronics Handbook - Five Volume Set
Author | : Bogdan M. Wilamowski |
Publisher | : CRC Press |
Total Pages | : 6257 |
Release | : 2011-03-04 |
Genre | : Technology & Engineering |
ISBN | : 0429584776 |
Industrial electronics systems govern so many different functions that vary in complexity-from the operation of relatively simple applications, such as electric motors, to that of more complicated machines and systems, including robots and entire fabrication processes. The Industrial Electronics Handbook, Second Edition combines traditional and new
National Semiconductor Metrology Program
Author | : National Institute of Standards and Technology (U.S.) |
Publisher | : |
Total Pages | : 160 |
Release | : 2000 |
Genre | : Semiconductors |
ISBN | : |
National Semiconductor Metrology Program
Author | : National Semiconductor Metrology Program (U.S.) |
Publisher | : |
Total Pages | : 136 |
Release | : |
Genre | : Semiconductors |
ISBN | : |
Latest Advances in Electrothermal Models
Author | : Krzysztof Górecki |
Publisher | : MDPI |
Total Pages | : 140 |
Release | : 2021-03-17 |
Genre | : Technology & Engineering |
ISBN | : 303650334X |
This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode–transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale.
Handbook of 3D Integration, Volume 4
Author | : Paul D. Franzon |
Publisher | : John Wiley & Sons |
Total Pages | : 492 |
Release | : 2019-01-25 |
Genre | : Technology & Engineering |
ISBN | : 3527697047 |
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Advanced Driver Assistance Systems and Autonomous Vehicles
Author | : Yan Li |
Publisher | : Springer Nature |
Total Pages | : 628 |
Release | : 2022-10-28 |
Genre | : Technology & Engineering |
ISBN | : 9811950539 |
This book provides a comprehensive reference for both academia and industry on the fundamentals, technology details, and applications of Advanced Driver-Assistance Systems (ADAS) and autonomous driving, an emerging and rapidly growing area. The book written by experts covers the most recent research results and industry progress in the following areas: ADAS system design and test methodologies, advanced materials, modern automotive technologies, artificial intelligence, reliability concerns, and failure analysis in ADAS. Numerous images, tables, and didactic schematics are included throughout. This essential book equips readers with an in-depth understanding of all aspects of ADAS, providing insights into key areas for future research and development. • Provides comprehensive coverage of the state-of-the-art in ADAS • Covers advanced materials, deep learning, quality and reliability concerns, and fault isolation and failure analysis • Discusses ADAS system design and test methodologies, novel automotive technologies • Features contributions from both academic and industry authors, for a complete view of this important technology