Formation And Temperature Stability Of The Liquid Phase In Thin Film Systems
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| Author | : Serhii Dukarov |
| Publisher | : Springer Nature |
| Total Pages | : 145 |
| Release | : 2023-11-25 |
| Genre | : Technology & Engineering |
| ISBN | : 3031460618 |
This book presents a summary of the topic of supercooling during crystallization in condensed films. While recent findings are mainly published in English, the foundational classical results were originally published in Russian, with limited accessibility to general readers. The present work is based on a 2019 Ukrainian monograph, "Temperature Stability of the Supercooled Liquid Phase in Condensed Films," which has been extensively revised and expanded. The book includes a detailed analysis of the thermodynamics of supercooled fluids, with updated and expanded sections. Additionally, new results on the supercooling of indium-lead (In-Pb) alloys in contact with amorphous molybdenum and fusible metals in contact with nanocrystalline layers are presented. These layers occupy a middle ground between amorphous (carbon, molybdenum, as-deposited germanium films) and polycrystalline (copper, silver, aluminum) substrates. The book gives particular attention to the peculiarities of contracted geometry conditions, which are natural for multilayered structures and can occur through fusible component segregation at grain boundaries. The analysis of new data has prompted a rethinking of the role of the more refractory layer's microstructure on the crystallization processes of metastable melts. The book includes a thorough discussion of these findings, highlighting the crucial role of the microstructure in the crystallization process. This book is a valuable resource for researchers and students interested in crystallization in thin-film metallic systems. This comprehensive study provides a detailed and authoritative analysis of the thermodynamics of supercooled fluids, and the impact of microstructure on the crystallization processes of metastable melts, making it an essential addition to any academic library.
| Author | : Serhii Dukarov |
| Publisher | : Springer |
| Total Pages | : 0 |
| Release | : 2023-12-24 |
| Genre | : Technology & Engineering |
| ISBN | : 9783031460609 |
This book presents a summary of the topic of supercooling during crystallization in condensed films. While recent findings are mainly published in English, the foundational classical results were originally published in Russian, with limited accessibility to general readers. The present work is based on a 2019 Ukrainian monograph, "Temperature Stability of the Supercooled Liquid Phase in Condensed Films," which has been extensively revised and expanded. The book includes a detailed analysis of the thermodynamics of supercooled fluids, with updated and expanded sections. Additionally, new results on the supercooling of indium-lead (In-Pb) alloys in contact with amorphous molybdenum and fusible metals in contact with nanocrystalline layers are presented. These layers occupy a middle ground between amorphous (carbon, molybdenum, as-deposited germanium films) and polycrystalline (copper, silver, aluminum) substrates. The book gives particular attention to the peculiarities of contracted geometry conditions, which are natural for multilayered structures and can occur through fusible component segregation at grain boundaries. The analysis of new data has prompted a rethinking of the role of the more refractory layer's microstructure on the crystallization processes of metastable melts. The book includes a thorough discussion of these findings, highlighting the crucial role of the microstructure in the crystallization process. This book is a valuable resource for researchers and students interested in crystallization in thin-film metallic systems. This comprehensive study provides a detailed and authoritative analysis of the thermodynamics of supercooled fluids, and the impact of microstructure on the crystallization processes of metastable melts, making it an essential addition to any academic library.
| Author | : Krishna Seshan |
| Publisher | : CRC Press |
| Total Pages | : 658 |
| Release | : 2002-02-01 |
| Genre | : Science |
| ISBN | : 1482269686 |
The Handbook of Thin Film Deposition Techniques: Principles, Methods, Equipment and Applications, Second Edition explores the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition tec
| Author | : Wei-Heng Shih |
| Publisher | : John Wiley & Sons |
| Total Pages | : 148 |
| Release | : 2012-04-11 |
| Genre | : Technology & Engineering |
| ISBN | : 1118406850 |
Colloidal processing has always been a major processing method. It facilitates control of particle interactions through a wide variety of schemes, which include surface coating, dispersion additives, and solvent control, among others. Controlling particle interactions also permits better resultant rheology and controlled green microstructures via a wide range of forming methods. In recent years, the particle size involved has been broadened into both the nanometer and the larger than micrometer ranges. This book covers fundamental issues encountered in colloidal processing nano-(less than 0.1 micron), micro-(from 0.1 to 5 micron) and macro-(larger than 5 micron) particulate systems and at the same time explore applications for these developments. Proceedings of the symposium held at the 105th Annual Meeting of The American Ceramic Society, April 27-30, in Nashville, Tennessee; Ceramic Transactions, Volume 152.
| Author | : Krishna Seshan |
| Publisher | : William Andrew |
| Total Pages | : 659 |
| Release | : 2001-02-01 |
| Genre | : Technology & Engineering |
| ISBN | : 0815517785 |
New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issues—as feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques.Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
| Author | : P. Somasundaran |
| Publisher | : CRC Press |
| Total Pages | : 962 |
| Release | : 2006 |
| Genre | : Science |
| ISBN | : 9780849396076 |
| Author | : Professor K.S. K.S Sree Harsha |
| Publisher | : Elsevier |
| Total Pages | : 1173 |
| Release | : 2005-12-16 |
| Genre | : Technology & Engineering |
| ISBN | : 0080480314 |
The goal of producing devices that are smaller, faster, more functional, reproducible, reliable and economical has given thin film processing a unique role in technology.Principles of Vapor Deposition of Thin Films brings in to one place a diverse amount of scientific background that is considered essential to become knowledgeable in thin film depostition techniques. Its ultimate goal as a reference is to provide the foundation upon which thin film science and technological innovation are possible.* Offers detailed derivation of important formulae.* Thoroughly covers the basic principles of materials science that are important to any thin film preparation.* Careful attention to terminologies, concepts and definitions, as well as abundance of illustrations offer clear support for the text.
| Author | : Jürn W. P. Schmelzer |
| Publisher | : Walter de Gruyter GmbH & Co KG |
| Total Pages | : 578 |
| Release | : 2014-05-21 |
| Genre | : Technology & Engineering |
| ISBN | : 3110368102 |
“This book contains overviews on technologically important classes of glasses, their treatment to achieve desired properties, theoretical approaches for the description of structure-property relationships, and new concepts in the theoretical treatment of crystallization in glass-forming systems. It contains overviews about the state of the art and about specific features for the analysis and application of important classes of glass-forming systems, and describes new developments in theoretical interpretation by well-known glass scientists. Thus, the book offers comprehensive and abundant information that is difficult to come by or has not yet been made public.” Edgar Dutra Zanotto (Center for Research, Technology and Education in Vitreous Materials, Brazil) Glass, written by a team of renowned researchers and experienced book authors in the field, presents general features of glasses and glass transitions. Different classes of glassforming systems, such as silicate glasses, metallic glasses, and polymers, are exemplified. In addition, the wide field of phase formation processes and their effect on glasses and their properties is studied both from a theoretical and experimental point of view.
| Author | : Thomas M. Christensen |
| Publisher | : CRC Press |
| Total Pages | : 373 |
| Release | : 2022-12-08 |
| Genre | : Science |
| ISBN | : 1482233061 |
This book is a conceptual overview of surface and thin film science, providing a basic and straightforward understanding of the most common ideas and methods used in these fields. Fundamental scientific ideas, deposition methods, and characterization methods are all examined. Relying on simple, conceptual models and figures, fundamental scientific ideas are introduced and then applied to surfaces and thin films in the first half of the book. Topics include vacuum and plasma environments, crystal structure, atomic motion, thermodynamics, electrical and magnetic properties, optical and thermal properties, and adsorbed atoms on surfaces. Common methods of gas-phase thin film deposition are then introduced, starting with an overview of the film growth process and then a discussion of both physical and chemical vapor deposition methods. This is followed by an overview of a wide range of characterization techniques including imaging, structural, chemical, electrical, magnetic, optical, thermal, and mechanical techniques. Thin film science is a natural extension of surface science, especially as applications involve thinner and thinner films; distinct from other literature in the field, this book combines the two topics in a single volume. Simple, conceptual models and figures are used, supported by some mathematical expressions, to convey key ideas to students as well as practicing engineers, scientists, and technicians.
| Author | : R.A. Levy |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 444 |
| Release | : 2012-12-06 |
| Genre | : Science |
| ISBN | : 1461305411 |
As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such restrictions extend to the fabrication of multilevel structures that are now essential in increasing packing density of interconnect lines. The fabrication of ultra large scale integrated (ULSI) devices under thermal budget restrictions requires the reassessment of existing and the development of new microelectronic materials and processes. This book addresses three broad but interrelated areas. The first area focuses on the subject of rapid thermal processing (RTP), a technology that allows minimization of processing time while relaxing the constraints on high temperature. Initially developed to limit dopant redistribution, current applications of RTP are shown here to encompass annealing, oxidation, nitridation, silicidation, glass reflow, and contact sintering. In a second but complementary area, advances in equipment design and performance of rapid thermal processing equipment are presented in conjunction with associated issues of temperature measurement and control. Defect mechanisms are assessed together with the resulting properties of rapidly deposited and processed films. The concept of RTP integration for a full CMOS device process is also examined together with its impact on device characteristics.
