Flip Chip Technologies And Global Markets
Download Flip Chip Technologies And Global Markets full books in PDF, epub, and Kindle. Read online free Flip Chip Technologies And Global Markets ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
FCIP and Expanding Markets for Flip Chip
| Author | : Thomas W. Goodman |
| Publisher | : |
| Total Pages | : 231 |
| Release | : 1997 |
| Genre | : Multichip modules (Microelectronics) |
| ISBN | : |
Low Cost Flip Chip Technologies
| Author | : John H. Lau |
| Publisher | : McGraw-Hill Professional Publishing |
| Total Pages | : 616 |
| Release | : 2000 |
| Genre | : Business & Economics |
| ISBN | : |
Of the Standard NuBGA Packages -- Thinner Substrate and Nonuniform Heat Spreader NuBGA -- Thermal Performance of the New NuBGA Package -- Temperature Distribution -- Thermal Resistance -- Cooling Power -- Wind Tunnel Experimental Analysis -- Solder Joint Reliability of the New NuBGA Package -- Electrical Performance of the New NuBGA Package -- Capacitance -- Inductance -- Summary of the New NuBGA Package -- Solder-Bumped Flip Chip in PBGA Packages -- Intel's OLGA Package Technology -- OLGA Package Design -- OLGA Wafer Bumping -- OLGA Substrate Technology -- OLGA Package Assembly -- OLGA Package Reliability -- Mitsubishi's FC-BGA Package -- Wafer Bumping -- Mitsubishi's SBU Substrate -- PC-BGA Assembly Process -- Thermal Management -- Electrical Performance -- Qualification Tests and Results -- IBM's FC-PBGA Package -- CFD Analysis for Thermal Boundary Conditions -- Nonlinear Finite Element Stress Analysis -- Simulation Results -- Solder Joint Thermal Fatigue Life Prediction -- Motorola's FC-PBGA Packages -- Thermal Management of FC-PBGA Assemblies with E3 Bumps -- Solder Joint Reliability of FC-PBGA Assemblies with C4 Bumps -- Failure Analysis of Flip Chip on Low-Cost Substrates -- Failure Analysis of FCOB with Imperfect Underfills -- Test Chip -- Test Board -- Flip Chip Assembly -- Preconditions, Reflows, and Qualification Tests -- Failure Modes and Discussions -- Die Cracking -- Interfacial Shear Strength -- Interfacial Shear Strength Between Solder Mask and Underfill.
Global Perspectives on Technology Transfer and Commercialization
| Author | : John Sibley Butler |
| Publisher | : Edward Elgar Publishing |
| Total Pages | : 433 |
| Release | : 2011-01-01 |
| Genre | : Technology & Engineering |
| ISBN | : 184980978X |
As we move further into the 21st century, increasing emphasis is being placed on the importance of technology transfer. Through new research and practices, scholars, practitioners and policymakers have made great strides in broadening our understanding and ability to implement technology transfer and commercialization processes. The fruit of that research is collected in this timely volume. Technology transfer is a dynamic area of study that examines traditional topics such as intellectual property management, the management of risk, market identification, the role of public and private labs, and the role of universities. This volume reflects on how government, business and academia influence technology transfer in different countries and how the infrastructure of a country enhances technology and contributes to each country s overall economy. Interpreting and adopting the processes of technology transfer and commercialization or, building innovative ecosystems is critical to seeing success in this digital age. Those leading the surge toward building innovative ecosystems for technology transfer are the fellows of the Institute for Innovation Creativity and Capital (IC2 Institute) at The University of Texas at Austin. Global in its scope of solving market economy problems, for this volume the Institute has focused its lens on accelerated knowledge-based development. Here, scholars from 13 countries come together to critique technology transfer from each of their respective nations. The results of their contributions lend innovative insight to exactly how different nations are working to maximize technology transfer and commercialization in uncertain times. Those with an interest in commercialization and technology transfer, from students to scholars, practitioners to policymakers, will find this important collection of great value.
Flip Chip Technologies
| Author | : John H. Lau |
| Publisher | : McGraw-Hill Professional Publishing |
| Total Pages | : 600 |
| Release | : 1996 |
| Genre | : Technology & Engineering |
| ISBN | : |
A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and manufacturing processes for electronic packaging and interconnect systems. Discusses economic, design, material, quality, and reliability issues of flip chip technologies, and details aspects of classical solder-bumped flip chip interconnect technologies; the next generations of flip chip technologies; and known-good-die testing for multiple module applications. Annotation copyright by Book News, Inc., Portland, OR
Advanced Flip Chip Packaging
| Author | : Ho-Ming Tong |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 562 |
| Release | : 2013-03-20 |
| Genre | : Technology & Engineering |
| ISBN | : 1441957685 |
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Parts Selection and Management
| Author | : Michael Pecht |
| Publisher | : John Wiley & Sons |
| Total Pages | : 351 |
| Release | : 2005-03-11 |
| Genre | : Technology & Engineering |
| ISBN | : 0471723878 |
Increase profitability and reduce risk through effective parts selection and management Corporations recognize that technology can be the key to fueling product design and development. But just as crucial-if not more-to a company's success are the decisions about when, what, and how a technology will be used. Few companies have failed because the right technology was not available; many have failed when a technology was not effectively selected and managed. Parts Selection and Management is a guide to increasing company profitability and reducing the time-to-profit through the efficient management of the process of parts selection and management. Taking an "eyes-on, hands-off" approach to parts selection, this guidebook addresses risk-assessment, decision-making steps, and subsequent management activities. The book covers everything from methodologies for parts selection and management, product requirements and specifications, and manufacturer assessment procedures to ways to track part changes through the supply chain, reliability assessment, and environmental, legislative, and legal issues. Written by a seasoned professional, teacher, and author in the field, the book enables companies to: * Employ effective risk assessment and mitigation techniques * Make an informed company-wide decision about parts selection and management * Choose parts to fit the functionality of the product and other constraints * Maximize system supportability by preparing for parts obsolescence * Improve supply-chain interactions and communications with customers and regulatory agencies to minimize time-to-profit Shedding light on a neglected but essential aspect of product development, Parts Selection and Management will give your organization the tools you need to avoid the risks associated with product use while promoting flexibility, innovation, and creativity in your product development.
Made by Taiwan
| Author | : Po-Lung Yu |
| Publisher | : World Scientific |
| Total Pages | : 406 |
| Release | : 2001 |
| Genre | : Business & Economics |
| ISBN | : 9812799613 |
Many nations and states have tried to build successful technological industries, but failed. Taiwan is an exception. Indeed, it is the third-largest production center for integrated circuits and personal computers. How has Taiwan made it, and how to do business successfully with Taiwan? This book aims to provide answers to those questions and to share the successful experience of Taiwan with others. If Taiwan could make it, then other nations, by learning from its experiences and patterns of development, can also make it, or even excel Taiwan. The book presents historical and analytical views covering most aspects of Taiwan''s development patterns, including innovations of management and technology, production and business infrastructures, capital and human resources, education and government policies, and competitive characteristics of people and cultures. Contents: Overview: The Development of Taiwan''s IC Industry: An Overview (C-Y Chang & P-L Yu); Management Innovation: The Three Vs of Global Competitiveness (H-L Li & J-J Shuai); Employee Profit Sharing and Stock Ownership Attracts World-Class Employees (A-P Chen & S-W Wang); IC/PC Industries: The Integrated Circuit Industry: A Technological Powerhouse (C V Trappey & H Chen); IC Foundries: A Booming Industry (M-C Wu); Taiwan''s IC Packaging Industry: A Local Success Story Goes International (P-L Chang & C-T Tsai); The Notebook Niche (J-H Huang); Desktop PCs: A Project Management Revolution (C Yang); Technical and Capital Innovation: Competing in the Knowledge Game: Intellectual Property Rights (S-J Liu); Investment: The Life Blood of Growth (C-Y Hung); Education and Government Policy: The Industrial Park: Government''s Gift to Industrial Development (P-L Chang & C-W Hsu); Intellectual Capital in the Information Industry (G-H Tzeng & M-Y Lee); Culture and People: Five Life Experiences That Shape Taiwan''s Character (P-L Yu & C-Y ChiangLin). Readership: Students and researchers in economics and business management, as well as business leaders and economic planners.
Area Array Interconnection Handbook
| Author | : Karl J. Puttlitz |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 1250 |
| Release | : 2012-12-06 |
| Genre | : Technology & Engineering |
| ISBN | : 1461513898 |
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
