Flexible Electronic Packaging And Encapsulationtechnology
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| Author | : Hong Meng |
| Publisher | : John Wiley & Sons |
| Total Pages | : 389 |
| Release | : 2024-03-25 |
| Genre | : Technology & Engineering |
| ISBN | : 3527845712 |
Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.
| Author | : Wei Huang |
| Publisher | : John Wiley & Sons |
| Total Pages | : 389 |
| Release | : 2024-06-04 |
| Genre | : Technology & Engineering |
| ISBN | : 3527353593 |
A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.
| Author | : Haleh Ardebili |
| Publisher | : William Andrew |
| Total Pages | : 508 |
| Release | : 2018-10-23 |
| Genre | : Technology & Engineering |
| ISBN | : 0128119799 |
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them
| Author | : Colin Tong |
| Publisher | : Springer Nature |
| Total Pages | : 641 |
| Release | : 2021-10-04 |
| Genre | : Technology & Engineering |
| ISBN | : 3030798046 |
This book provides a comprehensive introduction to printed flexible electronics and their applications, including the basics of modern printing technologies, printable inks, performance characterization, device design, modeling, and fabrication processes. A wide range of materials used for printed flexible electronics are also covered in depth. Bridging the gap between the creation of structure and function, printed flexible electronics have been explored for manufacturing of flexible, stretchable, wearable, and conformal electronics device with conventional, 3D, and hybrid printing technologies. Advanced materials such as polymers, ceramics, nanoparticles, 2D materials, and nanocomposites have enabled a wide variety of applications, such as transparent conductive films, thin film transistors, printable solar cells, flexible energy harvesting and storage devices, electroluminescent devices, and wearable sensors. This book provides students, researchers and engineers with the information to understand the current status and future trends in printed flexible electronics, and acquire skills for selecting and using materials and additive manufacturing processes in the design of printed flexible electronics.
| Author | : YongAn Huang |
| Publisher | : Springer |
| Total Pages | : 287 |
| Release | : 2019-04-23 |
| Genre | : Technology & Engineering |
| ISBN | : 981133627X |
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
| Author | : National Research Council (U.S.). Committee on Best Practice in National Innovation Programs for Flexible Electronics |
| Publisher | : National Academies Press |
| Total Pages | : 0 |
| Release | : 2014 |
| Genre | : Electronic industries |
| ISBN | : 9780309305914 |
Flexible electronics describes circuits that can bend and stretch, enabling significant versatility in applications and the prospect of low-cost manufacturing processes. They represent an important technological advance, in terms of their performance characteristics and potential range of applications, ranging from medical care, packaging, lighting and signage, consumer electronics and alternative energy (especially solar energy.) What these technologies have in common is a dependence on efficient manufacturing that currently requires improved technology, processes, tooling, and materials, as well as ongoing research. Seeking to capture the global market opportunity in flexible electronics, major U.S. competitors have initiated dedicated programs that are large in scope and supported with significant government funding to develop and acquire these new technologies, refine them, and ultimately manufacture them within their national borders. These national and regional investments are significantly larger than U.S. investment and more weighted toward later stage applied research and development. The Flexible Electronics Opportunity examines and compares selected innovation programs both foreign and domestic, and their potential to advance the production of flexible electronics technology in the United States. This report reviews the goals, concept, structure, operation, funding levels, and evaluation of foreign programs similar to major U.S. programs, e.g., innovation awards, S&T parks, and consortia. The report describes the transition of flexible electronics research into products and to makes recommendations to improve and to develop U.S. programs. Through an examination of the role of research consortia around the world to advance flexible electronics technology, the report makes recommendations for steps that the U.S. might consider to develop a robust industry in the United States. Significant U.S. expansion in the market for flexible electronics technologies is not likely to occur in the absence of mechanisms to address investment risks, the sharing of intellectual property, and the diverse technology requirements associated with developing and manufacturing flexible electronics technologies. The Flexible Electronics Opportunity makes recommendations for collaboration among industry, universities, and government to achieve the critical levels of investment and the acceleration of new technology development that are needed to catalyze a vibrant flexible electronics industry.
| Author | : Liangliang Chen |
| Publisher | : |
| Total Pages | : 0 |
| Release | : 2015-05 |
| Genre | : Electronics |
| ISBN | : 9783038354369 |
Flexible and printed electronics are rather new fields in China. In particular, the term of "printed electronics" was almost unheard of in China five years ago when Professor Cui setup the first research center dedicated to the R&D of this technology. The collection includes selected peer reviewed papers form the 5th International Conference on Flexible and Printed Electronics (ICFPE) was successfully held in Beijing on 21-23 October 2014. The 39 papers share the newest ideas in the fields of followed: Synthesis and characterization of organic and inorganic electronics materials for printed electronics; Ink formulation of nanomaterials and applications in printed electronics; Solution-processing and/or printing of organic and inorganic thin film transistors, solar cells and light emitting devices; Organic and inorganic flexible electronic devices and displays; Flexible and plastic sensors and their applications; Processes, techniques and equipment for printed electronics; Design of flexible and printable electronic systems; Manufacturing of printed circuit (PCB) boards and RFID antennas; Packaging and encapsulation of OLED/OPV and printed electronic devices.
| Author | : Stergios Logothetidis |
| Publisher | : Elsevier |
| Total Pages | : 483 |
| Release | : 2014-12-03 |
| Genre | : Technology & Engineering |
| ISBN | : 1782420436 |
Organic flexible electronics represent a highly promising technology that will provide increased functionality and the potential to meet future challenges of scalability, flexibility, low power consumption, light weight, and reduced cost. They will find new applications because they can be used with curved surfaces and incorporated in to a number of products that could not support traditional electronics. The book covers device physics, processing and manufacturing technologies, circuits and packaging, metrology and diagnostic tools, architectures, and systems engineering. Part one covers the production, properties and characterisation of flexible organic materials and part two looks at applications for flexible organic devices. Reviews the properties and production of various flexible organic materials. Describes the integration technologies of flexible organic electronics and their manufacturing methods. Looks at the application of flexible organic materials in smart integrated systems and circuits, chemical sensors, microfluidic devices, organic non-volatile memory devices, and printed batteries and other power storage devices.
| Author | : Yufeng Jin |
| Publisher | : CRC Press |
| Total Pages | : 233 |
| Release | : 2017-12-19 |
| Genre | : Technology & Engineering |
| ISBN | : 1351832972 |
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
| Author | : Asimina Kiourti |
| Publisher | : Artech House |
| Total Pages | : 316 |
| Release | : 2022-01-31 |
| Genre | : Technology & Engineering |
| ISBN | : 1630818240 |
This book presents a practical and comprehensive guide to game-changing and state-of-the-art wearable antennas and RF electronics and their applications. Written by leading experts, the book details how to weave clothing into functional antennas and sensors to serve as unobtrusive devices for medical monitoring, athletic performance tracking, body-area network communications, and a host of other applications. You will learn about the latest advances in materials and electronics along with new and unexplored opportunities in functionalizing fabrics for sensing and wireless connectivity; understand materials selection for diverse wearable applications; gain practical insight into the newest class of embroidered e-textiles; and learn how to engineer flexible and wearable sensors. Wearable Antennas and Electronics covers basic approaches for wearable technology and their applications. You will also get an expert preview of promising future directions and paths for research opportunities. This is a must-have resource for anyone working in the growing industry of wearables and body-area devices, including engineers, researchers, faculty, and graduate students.
