Semiconductor Thermal Measurement and Management Symposium

Semiconductor Thermal Measurement and Management Symposium
Author:
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
Total Pages: 299
Release: 1999
Genre: Technology & Engineering
ISBN: 9780780352643

This collection of essays from the 15th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Semi-Therm) provides a forum for the exchange of information between industrial and academic communities on topics related to semiconductor thermal measurement, modelling and management.

Proceedings of International Conference on Thermofluids

Proceedings of International Conference on Thermofluids
Author: Shripad Revankar
Publisher: Springer Nature
Total Pages: 676
Release: 2020-11-21
Genre: Technology & Engineering
ISBN: 9811578311

This book presents selected and peer-reviewed proceedings of the International Conference on Thermofluids (KIIT Thermo 2020). It focuses on the latest studies and findings in the areas of fluid dynamics, heat transfer, thermodynamics, and combustion. Some of the topics covered in the book include electronic cooling, HVAC system analysis, inverse heat transfer, combustion, nano-fluids, multiphase flow, high-speed flow, and shock waves. The book includes both experimental and numerical studies along with a few review chapters from experienced researchers, and is expected to lead to new research in this important area. This book is of interest to students, researchers as well as practitioners working in the areas of fluid dynamics, thermodynamics, and combustion.

Thermal Energy

Thermal Energy
Author: Yatish T. Shah
Publisher: CRC Press
Total Pages: 1112
Release: 2018-01-12
Genre: Technology & Engineering
ISBN: 1315305933

The book details sources of thermal energy, methods of capture, and applications. It describes the basics of thermal energy, including measuring thermal energy, laws of thermodynamics that govern its use and transformation, modes of thermal energy, conventional processes, devices and materials, and the methods by which it is transferred. It covers 8 sources of thermal energy: combustion, fusion (solar) fission (nuclear), geothermal, microwave, plasma, waste heat, and thermal energy storage. In each case, the methods of production and capture and its uses are described in detail. It also discusses novel processes and devices used to improve transfer and transformation processes.

Recent Asian Research on Thermal and Fluid Sciences

Recent Asian Research on Thermal and Fluid Sciences
Author: Abhilash Suryan
Publisher: Springer Nature
Total Pages: 693
Release: 2020-02-18
Genre: Technology & Engineering
ISBN: 9811518920

This book presents a collection of the best papers from the Seventh Asian Joint Workshop on Thermophysics and Fluid Science (AJWTF7 2018), which was held in Trivandrum, India, in November 2018. The papers highlight research outputs from India, China, Japan, Korea and Bangladesh, and many of them report on collaborative efforts by researchers from these countries. The topics covered include Aero-Acoustics, Aerodynamics, Aerospace Engineering, Bio-Fluidics, Combustion, Flow Measurement, Control and Instrumentation, Fluid Dynamics, Heat and Mass Transfer, Thermodynamics, Mixing and Chemically Reacting Flows, Multiphase Flows, Micro/Nano Flows, Noise/NOx/SOx Reduction, Propulsion, Transonic and Supersonic Flows, and Turbomachinery. The book is one of the first on the topic to gather contributions from some of the leading countries in Asia. Given its scope, it will benefit researchers and students working on research problems in the thermal and fluid sciences.

The 10th International Conference on Computer Engineering and Networks

The 10th International Conference on Computer Engineering and Networks
Author: Qi Liu
Publisher: Springer Nature
Total Pages: 1770
Release: 2020-10-05
Genre: Technology & Engineering
ISBN: 9811584621

This book contains a collection of the papers accepted by the CENet2020 – the 10th International Conference on Computer Engineering and Networks held on October 16-18, 2020 in Xi’an, China. The topics focus but are not limited to Internet of Things and Smart Systems, Artificial Intelligence and Applications, Communication System Detection, Analysis and Application, and Medical Engineering and Information Systems. Each part can be used as an excellent reference by industry practitioners, university faculties, research fellows and undergraduates as well as graduate students who need to build a knowledge base of the most current advances and state-of-practice in the topics covered by this conference proceedings. This will enable them to produce, maintain, and manage systems with high levels of trustworthiness and complexity.

Design and comparison of two brushless DC drives for an electric propulsion system of solar-power unmanned aerial vehicles

Design and comparison of two brushless DC drives for an electric propulsion system of solar-power unmanned aerial vehicles
Author: Dong, Rong
Publisher: Universitätsverlag der TU Berlin
Total Pages: 130
Release: 2020-08-26
Genre: Technology & Engineering
ISBN: 379833126X

The electrical propulsion system as the core component of solar-power Unmanned Aerial Vehicles (UAVs) for long duration flight requires high power density and stable drive technology. Brushless DC motors (BLDCM) with high power and torque density and control algorithms suitable for drive system are given preference for the application in UAVs. This dissertation is aimed at designing an improved BLDCM using only 4 interior magnet blocks to realize 8 poles compared to the conventional 8 magnet blocks structure. The performances of both BLDCM designs have been analytically determined and the motor models were verified through finite element software in ANSYS. Design and construction of the demonstrators of BLDCMs with the proposed and the conventional magnet structure have been carried out and a test bench for extensive performance comparison has been set up. Since the proposed magnet structure leads to a particularity of the magnetic circuit, the behavior of absolute and differential synchronous direct and quadrature inductances have been investigated by finite element model analysis and experiments. Efficiency maps were generated and thermal characteristics have been measured to gain a comprehensive understanding of the two motors. To reduce the uncertainty of sensor control for BLDCM, a high speed, good linearity analog isolation circuit to measure the voltages of 270 V DC voltage to realize sensorless control strategy has been designed. The circuit combines a PI controller with fast operational amplifiers with a built-in linearizing feedback photodiode loop of a linear optocoupler. A 3D stator model was built to analyse the mechanical resonance frequencies and possible excitation by the electromagnetic radial force leading to vibration and noise for the proposed and conventional rotor structure. Analytical calculation of natural mode frequencies has also been conducted to compare and validate the accuracy of FEM simulations and impact hammer testing experimental results. Das elektrische Antriebssystem als Kernkomponente von unbemannten Solarflugzeugen (UAVs, Unmanned Aerial Vehicles) für Langzeitflüge erfordert eine hohe Leistungsdichte und robuste Antriebstechnik. Bürstenlose Gleichstrommotoren (BLDCM) mit hoher Leistungs- und Drehmomentdichte sowie dafür angepasste Regelalgorithmen werden daher bevorzugt in UAVs eingesetzt. Diese Dissertation zielt darauf ab, einen verbesserten BLDCM mit nur 4 eingebetteten Magnetblöcken zu entwerfen, um 8 Pole zu realisieren im Vergleich zu der herkömmlichen Struktur mit 8 Magnetblöcken. Das Verhalten beider BLDCM-Designs wurde analytisch ermittelt und die Motormodelle mit Hilfe von Finite-Elemente-Software in ANSYS verifiziert. Design und Konstruktion der Prototypen mit der vorgeschlagenen und der herkömmlichen Magnetstruktur wurden durchgeführt und es wurde ein Prüfstand für einen umfassenden Leistungsvergleich aufgebaut. Da die vorgeschlagene Magnetstruktur zu einem Magnetkreis führt, bei dem die entgegengesetzten Pole keine Spiegelsymmetrie aufweisen, wurden die Längs- und Querinduktivität durch Finite-Elemente-Modellanalyse und Experimente absolut und differentiell untersucht. Weiterhin wurden Wirkungsgradkennfelder erstellt und das thermische Verhalten untersucht, um ein umfassendes Verständnis der beiden Motoren zu erhalten. Um das sensorbedingte Ausfallrisiko zu eliminieren, wurde eine schnelle analoge Isolationsschaltung mit hoher Linearität und Stabilität zur Messung der gepulsten Spannungen bei 270V Gleichspannung entwickelt, um eine sensorlose Steuerungsstrategie zu realisieren. Die Schaltung verwendet einen linearen Optokoppler mit integrierter Rückkopplungsfotodiode, sowie einen PI-Regler mit schnellen Operationsverstärkern im Rückkopplungspfad. Ein 3D-Statormodell wurde erstellt, um die mechanischen Resonanzfrequenzen und die mögliche Anregung durch die elektromagnetische Radialkraft zu analysieren, die zu Vibrationen und Geräuschen bei der vorgeschlagenen und herkömmlichen Rotorstruktur führt. Es wurde auch eine analytische Modalanalyse durchgeführt, um die Genauigkeit von FEM-Simulationen und experimentellen Ergebnissen mit dem Impulshammer zu vergleichen und zu validieren.

Antenna-in-Package Technology and Applications

Antenna-in-Package Technology and Applications
Author: Duixian Liu
Publisher: John Wiley & Sons
Total Pages: 416
Release: 2020-03-31
Genre: Technology & Engineering
ISBN: 1119556635

A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.