Extreme Environment Electronics
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| Author | : John D. Cressler |
| Publisher | : CRC Press |
| Total Pages | : 1041 |
| Release | : 2017-12-19 |
| Genre | : Technology & Engineering |
| ISBN | : 143987431X |
Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.
| Author | : Ahmed Sharif |
| Publisher | : John Wiley & Sons |
| Total Pages | : 398 |
| Release | : 2019-08-05 |
| Genre | : Technology & Engineering |
| ISBN | : 3527344195 |
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
| Author | : Vinod Kumar Khanna |
| Publisher | : |
| Total Pages | : 0 |
| Release | : 2017 |
| Genre | : Circuits |
| ISBN | : 9780750311571 |
"Electronic devices and circuits are employed by a range of industries in testing conditions from extremes of high- or low-temperature, in chemically corrosive environments, subject to shock and vibration or exposure to radiation. This book describes the diverse measures necessary to make electronics capable of coping with such situations as well as to gainfully exploit any new phenomena that take place only under these conditions."--Prové de l'editor.
| Author | : Juan Cepeda-Rizo |
| Publisher | : CRC Press |
| Total Pages | : 278 |
| Release | : 2021-12-29 |
| Genre | : Technology & Engineering |
| ISBN | : 1000511081 |
Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example. Features: Includes case studies from NASA’s Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flyting the first cubeSAT to Mars. Enables spacecraft designer engineers to create a design that is structurally and thermally sound, and reliable, in the quickest time afforded. Examines innovative low-cost thermal and power systems. Explains how to design to survive rocket launch, the surfaces of Mars and Venus. Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, and analyze, and test in the fast-paced and low-cost small satellite environment and learn techniques to reduce the design and test cycles without compromising reliability. It serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space.
| Author | : Kirsten Weide-Zaage |
| Publisher | : CRC Press |
| Total Pages | : 257 |
| Release | : 2016-11-25 |
| Genre | : Technology & Engineering |
| ISBN | : 149874382X |
This book introduces the reader to a number of challenges for the operation of electronic devices in various harsh environmental conditions. While some chapters focus on measuring and understanding the effects of these environments on electronic components, many also propose design solutions, whether in choice of material, innovative structures, or strategies for amelioration and repair. Many applications need electronics designed to operate in harsh environments. Readers will find, in this collection of topics, tools and ideas useful in their own pursuits and of interest to their intellectual curiosity. With a focus on radiation, operating conditions, sensor systems, package, and system design, the book is divided into three parts. The first part deals with sensing devices designed for operating in the presence of radiation, commercials of the shelf (COTS) products for space computing, and influences of single event upset. The second covers system and package design for harsh operating conditions. The third presents devices for biomedical applications under moisture and temperature loads in the frame of sensor systems and operating conditions.
| Author | : F. Patrick McCluskey |
| Publisher | : CRC Press |
| Total Pages | : 354 |
| Release | : 1996-12-13 |
| Genre | : Technology & Engineering |
| ISBN | : 9780849396236 |
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
| Author | : Hanns-Christian Gunga |
| Publisher | : Elsevier |
| Total Pages | : 336 |
| Release | : 2014-11-26 |
| Genre | : Science |
| ISBN | : 0123869986 |
Human Physiology in Extreme Environments is the one publication that offers how human biology and physiology is affected by extreme environments while highlighting technological innovations that allow us to adapt and regulate environments. Covering a broad range of extreme environments, including high altitude, underwater, tropical climates, and desert and arctic climates as well as space travel, this book will include case studies for practical application. Graduate students, medical students and researchers will find Human Physiology in Extreme Environments an interesting, informative and useful resource for human physiology, environmental physiology and medical studies. - Presents human physiological challenges in Extreme Environments combined in one single resource - Provides an excellent source of information regarding paleontological and anthropological aspects - Offers practical medical and scientific use of current concepts
| Author | : Emma Barrett |
| Publisher | : Oxford University Press, USA |
| Total Pages | : 289 |
| Release | : 2014 |
| Genre | : Psychology |
| ISBN | : 0199668582 |
Why do some people risk their lives regularly by placing themselves in extreme and challenging situations? For some, such as astronauts, the extreme environments are a requirement of the job. For others, they involve the thrill and competition of extreme sports, or the achievement of what seem like unimaginable goals to some - such as being the first to reach the South Pole or climb Mount Everest. Whether for sport or a career, these people have made the personal choice to put themselves in places where there is a significant risk. What drives such people? What skills and personality traits enable the best to succeed? Does a successful mountaineer, astronaut, and cave explorer share the same abilities? Are there lessons the rest of us can learn from them? In Extreme, Emma Barrett and Paul Martin explore the challenges that people in extreme environments face, including pain, physical hardship, loneliness, disagreements, and the approaches taken to overcome them. Using many fascinating examples and personal accounts, they take a close look at the psychological impact on those who face these challenges, the traits that enable some people to succeed, and what we can take away from their experiences.
| Author | : William G. Fahrenholtz |
| Publisher | : John Wiley & Sons |
| Total Pages | : 601 |
| Release | : 2014-10-10 |
| Genre | : Technology & Engineering |
| ISBN | : 111892441X |
The first comprehensive book to focus on ultra-high temperature ceramic materials in more than 20 years Ultra-High Temperature Ceramics are a family of compounds that display an unusual combination of properties, including extremely high melting temperatures (>3000°C), high hardness, and good chemical stability and strength at high temperatures. Typical UHTC materials are the carbides, nitrides, and borides of transition metals, but the Group IV compounds (Ti, Zr, Hf) plus TaC are generally considered to be the main focus of research due to the superior melting temperatures and stable high-melting temperature oxide that forms in situ. Rather than focusing on the latest scientific results, Ultra-High Temperature Ceramics: Materials for Extreme Environment Applications broadly and critically combines the historical aspects and the state-of-the-art on the processing, densification, properties, and performance of boride and carbide ceramics. In reviewing the historic studies and recent progress in the field, Ultra-High Temperature Ceramics: Materials for Extreme Environment Applications provides: Original reviews of research conducted in the 1960s and 70s Content on electronic structure, synthesis, powder processing, densification, property measurement, and characterization of boride and carbide ceramics. Emphasis on materials for hypersonic aerospace applications such as wing leading edges and propulsion components for vehicles traveling faster than Mach 5 Information on materials used in the extreme environments associated with high speed cutting tools and nuclear power generation Contributions are based on presentations by leading research groups at the conference "Ultra-High Temperature Ceramics: Materials for Extreme Environment Applications II" held May 13-19, 2012 in Hernstein, Austria. Bringing together disparate researchers from academia, government, and industry in a singular forum, the meeting cultivated didactic discussions and efforts between bench researchers, designers and engineers in assaying results in a broader context and moving the technology forward toward near- and long-term use. This book is useful for furnace manufacturers, aerospace manufacturers that may be pursuing hypersonic technology, researchers studying any aspect of boride and carbide ceramics, and practitioners of high-temperature structural ceramics.
| Author | : Majeti Narasimha Vara Prasad |
| Publisher | : Butterworth-Heinemann |
| Total Pages | : 408 |
| Release | : 2019-03-14 |
| Genre | : Technology & Engineering |
| ISBN | : 012816591X |
Electronic Waste Management and Treatment Technology applies the latest research for designing waste treatment and disposal strategies. Written for researchers who are exploring this emerging topic, the book begins with a short, but rigorous, discussion of electric waste management that outlines common hazardous materials. such as mercury, lead, silver and flame-retardants. The book also discusses the fate of metals contained in waste electrical and electronic equipment in municipal waste treatment. Materials and methods for the remediation, recycling and treatment of plastic waste collected from waste electrical and electronic equipment (WEEE) are also covered. Finally, the book covers the depollution benchmarks for capacitors, batteries and printed circuit boards from waste electrical and electronic equipment (WEEE) and the recovery of waste printed circuit boards through pyrometallurgy. - Describes depollution benchmarks for capacitors, batteries and printed wiring boards from waste electronics - Covers metals contained in waste electrical and electronic equipment in municipal waste - Provides tactics for the recycling of mixed plastic waste from electrical and electronic equipment
