Environmental Testing Techniques for Electronics and Materials

Environmental Testing Techniques for Electronics and Materials
Author: Geoffrey W. A. Dummer
Publisher: Elsevier
Total Pages: 473
Release: 2013-10-22
Genre: Technology & Engineering
ISBN: 1483135918

Environmental Testing Techniques for Electronics and Materials reviews environmental testing techniques for evaluating the performance of electronic equipment, components, and materials. Environmental test planning, test methods, and instrumentation are described, along with the general environmental conditions under which equipment must operate. This book is comprised of 15 chapters and begins by explaining why environmental testing is necessary and describing the environment in which electronics must operate. The next chapter considers how an environmental test plan is designed; the methods for the environmental testing of components and materials; instrumentation and control of test chambers; shock and vibration test instrumentation; and requirements for specification writing. The reader is then introduced to factors that might affect the reliability of equipment, including high humidity environment; galvanic corrosion problems; high- and low-temperature environments; mechanical and associated hazards; transport hazards; and long-term storage. Problems posed by high altitude and space environments, nuclear radiation, and acoustic noise are also discussed. The final chapter is devoted to environmental protection techniques and looks at the effects of climatic environments on radio interference as well as the effects of the environment on the human operator. This monograph will be of value to materials scientists and electronics engineers as well as those engaged in the design, development, and production of professional and military equipment.

MEMS and Nanotechnology, Volume 5

MEMS and Nanotechnology, Volume 5
Author: Barton C. Prorok
Publisher: Springer
Total Pages: 113
Release: 2015-10-30
Genre: Technology & Engineering
ISBN: 3319224581

The 16thInternational Symposium on MEMS and Nanotechnology, Volume 5 of the Proceedings of the 2015SEM Annual Conference& Exposition on Experimental and Applied Mechanics, the fifth volume of nine from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including: Microscale and Microstructural Effects on Mechanical Behavior Dynamic Micro/Nanomechanics In-situ Techniques Mechanics of Graphene Indentation and Small Scale Testing MEMS

Electronic Materials Handbook

Electronic Materials Handbook
Author:
Publisher: ASM International
Total Pages: 1234
Release: 1989-11-01
Genre: Technology & Engineering
ISBN: 9780871702852

Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.