Energy Efficient High Speed Integrated Circuits For Emerging Computing And Sensing Applications
Download Energy Efficient High Speed Integrated Circuits For Emerging Computing And Sensing Applications full books in PDF, epub, and Kindle. Read online free Energy Efficient High Speed Integrated Circuits For Emerging Computing And Sensing Applications ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Author | : Santosh K. Kurinec |
Publisher | : CRC Press |
Total Pages | : 452 |
Release | : 2019-01-31 |
Genre | : Computers |
ISBN | : 1351779869 |
In our abundant computing infrastructure, performance improvements across most all application spaces are now severely limited by the energy dissipation involved in processing, storing, and moving data. The exponential increase in the volume of data to be handled by our computational infrastructure is driven in large part by unstructured data from countless sources. This book explores revolutionary device concepts, associated circuits, and architectures that will greatly extend the practical engineering limits of energy-efficient computation from device to circuit to system level. With chapters written by international experts in their corresponding field, the text investigates new approaches to lower energy requirements in computing. Features • Has a comprehensive coverage of various technologies • Written by international experts in their corresponding field • Covers revolutionary concepts at the device, circuit, and system levels
Author | : Santosh K. Kurinec |
Publisher | : CRC Press |
Total Pages | : 433 |
Release | : 2019-01-31 |
Genre | : Computers |
ISBN | : 1351779850 |
In our abundant computing infrastructure, performance improvements across most all application spaces are now severely limited by the energy dissipation involved in processing, storing, and moving data. The exponential increase in the volume of data to be handled by our computational infrastructure is driven in large part by unstructured data from countless sources. This book explores revolutionary device concepts, associated circuits, and architectures that will greatly extend the practical engineering limits of energy-efficient computation from device to circuit to system level. With chapters written by international experts in their corresponding field, the text investigates new approaches to lower energy requirements in computing. Features • Has a comprehensive coverage of various technologies • Written by international experts in their corresponding field • Covers revolutionary concepts at the device, circuit, and system levels
Author | : Katsuyuki Sakuma |
Publisher | : CRC Press |
Total Pages | : 211 |
Release | : 2018-04-17 |
Genre | : Technology & Engineering |
ISBN | : 1351779826 |
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
Author | : Massimo Alioto |
Publisher | : Springer |
Total Pages | : 527 |
Release | : 2017-01-23 |
Genre | : Technology & Engineering |
ISBN | : 3319514822 |
This book offers the first comprehensive view on integrated circuit and system design for the Internet of Things (IoT), and in particular for the tiny nodes at its edge. The authors provide a fresh perspective on how the IoT will evolve based on recent and foreseeable trends in the semiconductor industry, highlighting the key challenges, as well as the opportunities for circuit and system innovation to address them. This book describes what the IoT really means from the design point of view, and how the constraints imposed by applications translate into integrated circuit requirements and design guidelines. Chapter contributions equally come from industry and academia. After providing a system perspective on IoT nodes, this book focuses on state-of-the-art design techniques for IoT applications, encompassing the fundamental sub-systems encountered in Systems on Chip for IoT: ultra-low power digital architectures and circuits low- and zero-leakage memories (including emerging technologies) circuits for hardware security and authentication System on Chip design methodologies on-chip power management and energy harvesting ultra-low power analog interfaces and analog-digital conversion short-range radios miniaturized battery technologies packaging and assembly of IoT integrated systems (on silicon and non-silicon substrates). As a common thread, all chapters conclude with a prospective view on the foreseeable evolution of the related technologies for IoT. The concepts developed throughout the book are exemplified by two IoT node system demonstrations from industry. The unique balance between breadth and depth of this book: enables expert readers quickly to develop an understanding of the specific challenges and state-of-the-art solutions for IoT, as well as their evolution in the foreseeable future provides non-experts with a comprehensive introduction to integrated circuit design for IoT, and serves as an excellent starting point for further learning, thanks to the broad coverage of topics and selected references makes it very well suited for practicing engineers and scientists working in the hardware and chip design for IoT, and as textbook for senior undergraduate, graduate and postgraduate students ( familiar with analog and digital circuits).
Author | : Navneet Gupta |
Publisher | : Springer Nature |
Total Pages | : 139 |
Release | : 2020-11-06 |
Genre | : Technology & Engineering |
ISBN | : 3030551199 |
This book describes the physical operation of the Tunnel Field-effect Transistor (TFET) and circuits built with this device. Whereas the majority of publications on TFETs describe in detail the device, its characteristics, variants and performance, this will be the first book addressing TFET integrated circuits (TFET ICs). The authors describe the peculiarities of TFET ICs and their differences with MOSFETs. They also develop and analyze a number of logic circuits and memories. The discussion also includes complex circuits combining CMOS and TFET, as well as a potential fabrication process in Silicon.
Author | : Chandan Giri |
Publisher | : Springer Nature |
Total Pages | : 465 |
Release | : 2023-06-01 |
Genre | : Technology & Engineering |
ISBN | : 9819900557 |
The book constitutes peer-reviewed proceedings of a workshop on Emerging Electronics Devices, Circuits, and Systems (EEDCS) held in conjunction with International Symposium on Devices, Circuits, and Systems (ISDCS 2022). The book focuses on the recent development in devices, circuits, and systems. It also discusses innovations, trends, practical challenges, and solutions adopted in device design, modeling, fabrication, characterization, and their circuit implementation with pertinent system applications. It will be useful for researchers, developers, engineers, academicians, and students.
Author | : Erika Covi |
Publisher | : Frontiers Media SA |
Total Pages | : 244 |
Release | : 2022-04-26 |
Genre | : Science |
ISBN | : 2889760006 |
Author | : |
Publisher | : |
Total Pages | : 544 |
Release | : 1994-06 |
Genre | : Power resources |
ISBN | : |
Author | : National Research Council |
Publisher | : National Academies Press |
Total Pages | : 330 |
Release | : 1992-02-01 |
Genre | : Technology & Engineering |
ISBN | : 0309046297 |
Dramatic political and economic changes throughout the world, coupled with rapid advances in technology, pose an important question for the U.S. Army: What technologies are best suited to defending U.S. interests against tomorrow's military threats? STAR 21 provides an expert analysis of how the Army can prepare itself for the battlefield of the futureâ€"where soldiers will wear "smart" helmets and combat chemical warfare with vaccines produced in days to counter new threats. This book summarizes emerging developments in robotics, "brillant" munitions, medical support, laser sensors, biotechnolgy, novel materials, and other key areas. Taking into account reliability, deployability, and other values that all military systems will need, the volume identifies new systems and emerging technologies that offer the greatest payoff for the Army. The volume addresses a host of important military issues, including the importance of mobile, rapidly deployable forces, the changing role of the helicopter, and how commercial technology may help the Army stay ahead of potential opponents. Alternative Selection, Doubleday's Military Book Club
Author | : Simon Deleonibus |
Publisher | : CRC Press |
Total Pages | : 284 |
Release | : 2018-12-13 |
Genre | : Science |
ISBN | : 0429858612 |
The history of information and communications technologies (ICT) has been paved by both evolutive paths and challenging alternatives, so-called emerging devices and architectures. Their introduction poses the issues of state variable definition, information processing, and process integration in 2D, above IC, and in 3D. This book reviews the capabilities of integrated nanosystems to match low power and high performance either by hybrid and heterogeneous CMOS in 2D/3D or by emerging devices for alternative sensing, actuating, data storage, and processing. The choice of future ICTs will need to take into account not only their energy efficiency but also their sustainability in the global ecosystem.