Electronic Thin-Film Reliability

Electronic Thin-Film Reliability
Author: King-Ning Tu
Publisher: Cambridge University Press
Total Pages: 412
Release: 2010-11-25
Genre: Technology & Engineering
ISBN: 9780521516136
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Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.

Electronic Thin-Film Reliability

Electronic Thin-Film Reliability
Author: King-Ning Tu
Publisher: Cambridge University Press
Total Pages: 413
Release: 2010-11-25
Genre: Technology & Engineering
ISBN: 1139492705
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Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.

The Materials Science of Thin Films

The Materials Science of Thin Films
Author: Milton Ohring
Publisher: Academic Press
Total Pages: 744
Release: 1992
Genre: Science
ISBN: 9780125249904
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Prepared as a textbook complete with problems after each chapter, specifically intended for classroom use in universities.

Materials Science of Thin Films

Materials Science of Thin Films
Author: Milton Ohring
Publisher: Academic Press
Total Pages: 817
Release: 2002
Genre: Science
ISBN: 0125249756
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This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.

Reliability and Failure of Electronic Materials and Devices

Reliability and Failure of Electronic Materials and Devices
Author: Milton Ohring
Publisher: Academic Press
Total Pages: 759
Release: 2014-10-14
Genre: Technology & Engineering
ISBN: 0080575528
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Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites

The Mechanics and Reliability of Films, Multilayers and Coatings

The Mechanics and Reliability of Films, Multilayers and Coatings
Author: Matthew R. Begley
Publisher: Cambridge University Press
Total Pages: 289
Release: 2017-03-24
Genre: Science
ISBN: 1108132731
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A wide variety of applications ranging from microelectronics to turbines for propulsion and power generation rely on films, coatings, and multilayers to improve performance. As such, the ability to predict coating failure - such as delamination (debonding), mud-cracking, blistering, crack kinking, and the like - is critical to component design and development. This work compiles and organizes decades of research that established the theoretical foundation for predicting such failure mechanisms, and clearly outlines the methodology needed to predict performance. Detailed coverage of cracking in multilayers is provided, with an emphasis on the role of differences in thermoelastic properties between the layers. The comprehensive theoretical foundation of the book is complemented by easy-to-use analysis codes designed to empower novices with the tools needed to simulate cracking; these codes enable not only precise quantitative reproduction of results presented graphically in the literature, but also the generation of new results for more complex multilayered systems.

Understanding the Reliability Technology Based on Entropy Production, and Other Researches

Understanding the Reliability Technology Based on Entropy Production, and Other Researches
Author: King-Ning Tu
Publisher:
Total Pages: 132
Release: 2021-05-15
Genre:
ISBN:
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King-Ning Tu was born on 30 December 1937 in Canton, China is a professor in the Department of Materials Science and Engineering and the Department of Electrical Engineering at UCLA. King has over 500 journal publications with citations over 24,000 and an h-factor of 88 (web-Google). He received the TMS John Bardeen Award in 2013. He has co-authored the textbook Electronic Thin Film Scienceand authored the books Solder Joint Technology: Materials, Properties, and Reliability, and Electronic Thin-Film Reliability. His research is centered on metal-silicon reactions, solder joint reactions, point-contact reactions in nanowires, polarity effect of electromigration on interfacial reactions, and kinetic theories of interfacial reactions. King Tu was an honor as American Physical Society -Fellow, 1981, The Metallurgical Society-Fellow, 1988, Materials Research Society -President, 1981, Fellow 2014, Churchill College -Overseas Fellow, 1990. He received The Metallurgical Society -Application to Practice Award, 1981, Acta/Scripta Metallurgical Lecturer, 1990 -1992, Humboldt Research Award for Senior US scientists, 1996, Member of Academia Sinica, ROC, 2002, TMS-EMPM Division Distinguished Scientist/Engineer Award in 2006, TMS John Bardeen Award in2011, and IEEE Division of Components, Packaging, and Manufacturing Technology Award in 2017.King Tu has been awarded numerous fellowships and letter of appreciation for his tremendous works and research in different fields. ●American Physical Society -Fellow, 1981●The Metallurgical Society -Fellow, 1988●Churchill College -Overseas Fellow, 1990●Materials Research Society -President, 1981●The Metallurgical Society -Application to Practice Award, 1988●Alpha Sigma Mu Lecturer of American Society for Metals, 1986●Acta/Scripta Metallurgica Lecturer, 1990 -1992●Humboldt Research Award for Senior US scientists, 1996●Honorary Member of The Korean Institute of Metals and Materials, 1996●Certificate of Appreciation from SEMATECH for flip-chip study, 1998●Member of Academia Sinica, ROC, 2002King-Ning Tu has published almost 56 articles, research papers on Diffusion and Reactions in Solder Alloys, and around 100 research papers on Silicide Formation. He also has 39 research paper on Electrical Properties and Schottky Barrier of Silicides, 38 papers on Diffusion and Reactions in Metallic Thin Films, and 31 papers on Diffusion and Reactions in Si, SiO2, and Low k Materials. Including these, King has published two books over the title, K. N. Tu, "Electronic Thin-Film Reliability", Cambridge University Press, (2011) and K. N. Tu, J. W. Mayer, and L. C. Feldman, "Electronic Thin Film Science -for Electrical Engineers and Materials Scientists", Macmillan, NY (1992).