Electromigration In Thin Films
Download Electromigration In Thin Films full books in PDF, epub, and Kindle. Read online free Electromigration In Thin Films ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Author | : Choong-Un Kim |
Publisher | : Elsevier |
Total Pages | : 353 |
Release | : 2011-08-28 |
Genre | : Technology & Engineering |
ISBN | : 0857093754 |
Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Finally, part three covers electromigration in solder, with chapters discussing topics such as electromigration-induced microstructural evolution and electromigration in flip-chip solder joints.With its distinguished editor and international team of contributors, Electromigration in thin films and electronic devices is an essential reference for materials scientists and engineers in the microelectronics, packaging and interconnects industries, as well as all those with an academic research interest in the field. Provides up-to-date coverage of the continued development of advanced copper interconnects for integrated circuits Comprehensively reviews modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation, and x-ray microbeam studies of electromigration Deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure
Author | : Hans Martin Breitling |
Publisher | : |
Total Pages | : 210 |
Release | : 1971 |
Genre | : Thin films |
ISBN | : |
Author | : Mohan Mahadevan |
Publisher | : |
Total Pages | : 226 |
Release | : 1998 |
Genre | : Thin films |
ISBN | : |
Author | : Tian Xie |
Publisher | : |
Total Pages | : |
Release | : 1994 |
Genre | : |
ISBN | : |
Author | : S. Roberts |
Publisher | : |
Total Pages | : |
Release | : 1982 |
Genre | : |
ISBN | : |
Author | : Jens Lienig |
Publisher | : Springer |
Total Pages | : 171 |
Release | : 2018-02-23 |
Genre | : Technology & Engineering |
ISBN | : 3319735586 |
The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
Author | : Shanyan Bai |
Publisher | : |
Total Pages | : 418 |
Release | : 1998 |
Genre | : |
ISBN | : |
Author | : King-Ning Tu |
Publisher | : Cambridge University Press |
Total Pages | : 413 |
Release | : 2010-11-25 |
Genre | : Technology & Engineering |
ISBN | : 1139492705 |
Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.
Author | : James N. Bisnett |
Publisher | : |
Total Pages | : 46 |
Release | : 1986 |
Genre | : |
ISBN | : |
Author | : John Espinoza Sanchez (Jr) |
Publisher | : |
Total Pages | : 276 |
Release | : 1991 |
Genre | : |
ISBN | : |