Electromagnetic Materials Proceedings Of The International Conference On Materials For Advanced Technologies Symposium P
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| Author | : Hock Lim |
| Publisher | : World Scientific |
| Total Pages | : 238 |
| Release | : 2007-06-20 |
| Genre | : Technology & Engineering |
| ISBN | : 9814474525 |
The contributions to this volume deliberate the electrical and magnetic properties of materials relevant to the design of unconventional antennas, microwave circuits/components, anti-reflection media and coatings, EMI shielding structures, radomes, etc. Though a classical research topic, some recent advancements in technology have led to new capabilities to create and control fine-scale structures. This has inspired scientists to develop new materials with exceptionally high permittivity or permeability, as well as metamaterials (or negative index materials) with unusual electromagnetic properties. Novel materials based on the use of active devices to control their electromagnetic performance have also been proposed. The multi-disciplinary nature of these new materials has brought together researchers from materials science, physics and electrical engineering to explore and deepen our current understanding of electromagnetic wave propagation. A wide range of new commercial/defence applications of these materials is expected to emerge in the near future.
| Author | : Hock Lim |
| Publisher | : World Scientific |
| Total Pages | : 238 |
| Release | : 2007 |
| Genre | : Science |
| ISBN | : 9812709541 |
The contributions to this volume deliberate the electrical and magnetic properties of materials relevant to the design of unconventional antennas, microwave circuits/components, anti-reflection media and coatings, EMI shielding structures, radomes, etc. Though a classical research topic, some recent advancements in technology have led to new capabilities to create and control fine-scale structures. This has inspired scientists to develop new materials with exceptionally high permittivity or permeability, as well as metamaterials (or negative index materials) with unusual electromagnetic properties. Novel materials based on the use of active devices to control their electromagnetic performance have also been proposed. The multi-disciplinary nature of these new materials has brought together researchers from materials science, physics and electrical engineering to explore and deepen our current understanding of electromagnetic wave propagation. A wide range of new commercial/defence applications of these materials is expected to emerge in the near future.
| Author | : Mahmood Aliofkhazraei |
| Publisher | : John Wiley & Sons |
| Total Pages | : 816 |
| Release | : 2015-02-10 |
| Genre | : Technology & Engineering |
| ISBN | : 3527674977 |
Providing in-depth information on how to obtain high-performance materials by controlling their nanostructures, this ready reference covers both the bottom-up and the top-down approaches to the synthesis and processing of nanostructured materials. The focus is on advanced methods of mechanical nanostructuring such as severe plastic deformation, including high pressure torsion, equal channel angular processing, cyclic extrusion compression, accumulative roll bonding, and surface mechanical attrition treatment. As such, the contents are inherently application-oriented, with the methods presented able to be easily integrated into existing production processes. In addition, the structure-property relationships and ways of influencing the nanostructure in order to exhibit a desired functionality are reviewed in detail. The whole is rounded off by a look at future directions, followed by an overview of applications in various fields of structural and mechanical engineering. With its solutions for successful processing of complex-shaped workpieces and large-scale specimens with desired properties, this is an indispensable tool for purposeful materials design.
| Author | : M.S.J. Hashmi |
| Publisher | : Elsevier |
| Total Pages | : 1467 |
| Release | : 2016-08-29 |
| Genre | : Technology & Engineering |
| ISBN | : 0128032502 |
Finish Manufacturing Processes are those final stage processing techniques which are deployed to bring a product to readiness for marketing and putting in service. Over recent decades a number of finish manufacturing processes have been newly developed by researchers and technologists. Many of these developments have been reported and illustrated in existing literature in a piecemeal manner or in relation only to specific applications. For the first time, Comprehensive Materials Finishing, Three Volume Set integrates a wide body of this knowledge and understanding into a single, comprehensive work. Containing a mixture of review articles, case studies and research findings resulting from R & D activities in industrial and academic domains, this reference work focuses on how some finish manufacturing processes are advantageous for a broad range of technologies. These include applicability, energy and technological costs as well as practicability of implementation. The work covers a wide range of materials such as ferrous, non-ferrous and polymeric materials. There are three main distinct types of finishing processes: Surface Treatment by which the properties of the material are modified without generally changing the physical dimensions of the surface; Finish Machining Processes by which a small layer of material is removed from the surface by various machining processes to render improved surface characteristics; and Surface Coating Processes by which the surface properties are improved by adding fine layer(s) of materials with superior surface characteristics. Each of these primary finishing processes is presented in its own volume for ease of use, making Comprehensive Materials Finishing an essential reference source for researchers and professionals at all career stages in academia and industry. Provides an interdisciplinary focus, allowing readers to become familiar with the broad range of uses for materials finishing Brings together all known research in materials finishing in a single reference for the first time Includes case studies that illustrate theory and show how it is applied in practice
| Author | : Hock Lim |
| Publisher | : World Scientific Publishing Company |
| Total Pages | : 272 |
| Release | : 2003 |
| Genre | : Materials |
| ISBN | : 9789812383723 |
Annotation Proceedings of the International Conference on Materials for Advanced Technologies (ICMAT), Symposium F: Electromagnetic Materials, held in Singapore from December 7-12, 2003.
| Author | : |
| Publisher | : |
| Total Pages | : 456 |
| Release | : 1995 |
| Genre | : Aeronautics |
| ISBN | : |
Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
| Author | : Raveendranath U. Nair |
| Publisher | : Springer |
| Total Pages | : 64 |
| Release | : 2017-09-21 |
| Genre | : Technology & Engineering |
| ISBN | : 9811065179 |
This book presents a review of techniques based on waveguide systems, striplines, freespace systems and more, discussing the salient features of each method in detail. Since metamaterials are typically inhomogeneous and anisotropic, the experimental techniques for electromagnetic (EM) material characterization of metamaterial structures need to tackle several challenges. Furthermore, the modes supported by metamaterial structures are extremely sensitive to external perturbations. As such the measurement fixtures for EM material characterization have to be modified to account for such effects. The book provides a valuable resource for researchers working in the field of metamaterials
| Author | : Steven H. Voldman |
| Publisher | : John Wiley & Sons |
| Total Pages | : 411 |
| Release | : 2009-07-01 |
| Genre | : Technology & Engineering |
| ISBN | : 0470747269 |
Electrostatic discharge (ESD) failure mechanisms continue to impact semiconductor components and systems as technologies scale from micro- to nano-electronics. This book studies electrical overstress, ESD, and latchup from a failure analysis and case-study approach. It provides a clear insight into the physics of failure from a generalist perspective, followed by investigation of failure mechanisms in specific technologies, circuits, and systems. The book is unique in covering both the failure mechanism and the practical solutions to fix the problem from either a technology or circuit methodology. Look inside for extensive coverage on: failure analysis tools, EOS and ESD failure sources and failure models of semiconductor technology, and how to use failure analysis to design more robust semiconductor components and systems; electro-thermal models and technologies; the state-of-the-art technologies discussed include CMOS, BiCMOS, silicon on insulator (SOI), bipolar technology, high voltage CMOS (HVCMOS), RF CMOS, smart power, gallium arsenide (GaAs), gallium nitride (GaN), magneto-resistive (MR) , giant magneto-resistors (GMR), tunneling magneto-resistor (TMR), devices; micro electro-mechanical (MEM) systems, and photo-masks and reticles; practical methods to use failure analysis for the understanding of ESD circuit operation, temperature analysis, power distribution, ground rule development, internal bus distribution, current path analysis, quality metrics, (connecting the theoretical to the practical analysis); the failure of each key element of a technology from passives, active elements to the circuit, sub-system to package, highlighted by case studies of the elements, circuits and system-on-chip (SOC) in today’s products. ESD: Failure Mechanisms and Models is a continuation of the author’s series of books on ESD protection. It is an essential reference and a useful insight into the issues that confront modern technology as we enter the Nano-electronic era.
| Author | : |
| Publisher | : |
| Total Pages | : 326 |
| Release | : 1988 |
| Genre | : Large space structures (Astronautics) |
| ISBN | : |
| Author | : |
| Publisher | : |
| Total Pages | : 410 |
| Release | : 1987 |
| Genre | : Aeronautics |
| ISBN | : |
