Eighth Annual Ieee Semiconductor Thermal Measurement And Management Symposium
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Proceedings
Author | : |
Publisher | : |
Total Pages | : 1306 |
Release | : 1999 |
Genre | : Electronic apparatus and appliances |
ISBN | : |
Advanced Nanoelectronics
Author | : Muhammad Mustafa Hussain |
Publisher | : John Wiley & Sons |
Total Pages | : 254 |
Release | : 2018-10-01 |
Genre | : Technology & Engineering |
ISBN | : 3527811850 |
Brings novel insights to a vibrant research area with high application potential?covering materials, physics, architecture, and integration aspects of future generation CMOS electronics technology Over the last four decades we have seen tremendous growth in semiconductor electronics. This growth has been fueled by the matured complementary metal oxide semiconductor (CMOS) technology. This comprehensive book captures the novel device options in CMOS technology that can be realized using non-silicon semiconductors. It discusses germanium, III-V materials, carbon nanotubes and graphene as semiconducting materials for three-dimensional field-effect transistors. It also covers non-conventional materials such as nanowires and nanotubes. Additionally, nanoelectromechanical switches-based mechanical relays and wide bandgap semiconductor-based terahertz electronics are reviewed as essential add-on electronics for enhanced communication and computational capabilities. Advanced Nanoelectronics: Post-Silicon Materials and Devices begins with a discussion of the future of CMOS. It continues with comprehensive chapter coverage of: nanowire field effect transistors; two-dimensional materials for electronic applications; the challenges and breakthroughs of the integration of germanium into modern CMOS; carbon nanotube logic technology; tunnel field effect transistors; energy efficient computing with negative capacitance; spin-based devices for logic, memory and non-Boolean architectures; and terahertz properties and applications of GaN. -Puts forward novel approaches for future, state-of-the-art, nanoelectronic devices -Discusses emerging materials and architectures such as alternate channel material like germanium, gallium nitride, 1D nanowires/tubes, 2D graphene, and other dichalcogenide materials and ferroelectrics -Examines new physics such as spintronics, negative capacitance, quantum computing, and 3D-IC technology -Brings together the latest developments in the field for easy reference -Enables academic and R&D researchers in semiconductors to "think outside the box" and explore beyond silica An important resource for future generation CMOS electronics technology, Advanced Nanoelectronics: Post-Silicon Materials and Devices will appeal to materials scientists, semiconductor physicists, semiconductor industry, and electrical engineers.
Encyclopedia of Packaging Materials, Processes, and Mechanics
Author | : Avram Bar-Cohen |
Publisher | : World Scientific |
Total Pages | : 1079 |
Release | : 2019 |
Genre | : Packaging |
ISBN | : 9811209634 |
"Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories. The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications"--Publisher's website
Evolutionary Based Solutions for Green Computing
Author | : Samee Ullah Khan |
Publisher | : Springer |
Total Pages | : 268 |
Release | : 2012-08-14 |
Genre | : Technology & Engineering |
ISBN | : 3642306594 |
Today’s highly parameterized large-scale distributed computing systems may be composed of a large number of various components (computers, databases, etc) and must provide a wide range of services. The users of such systems, located at different (geographical or managerial) network cluster may have a limited access to the system’s services and resources, and different, often conflicting, expectations and requirements. Moreover, the information and data processed in such dynamic environments may be incomplete, imprecise, fragmentary, and overloading. All of the above mentioned issues require some intelligent scalable methodologies for the management of the whole complex structure, which unfortunately may increase the energy consumption of such systems. An optimal energy utilization has reached to a point that many information technology (IT) managers and corporate executives are all up in arms to identify scalable solution that can reduce electricity consumption (so that the total cost of operation is minimized) of their respective large-scale computing systems and simultaneously improve upon or maintain the current throughput of the system. This book in its eight chapters, addresses the fundamental issues related to the energy usage and the optimal low-cost system design in high performance ``green computing’’ systems. The recent evolutionary and general metaheuristic-based solutions for energy optimization in data processing, scheduling, resource allocation, and communication in modern computational grids, could and network computing are presented along with several important conventional technologies to cover the hot topics from the fundamental theory of the ‘’green computing’’ concept and to describe the basic architectures of systems. This book points out the potential application areas and provides detailed examples of application case studies in low-energy computational systems. The development trends and open research issues are also outlined. All of those technologies have formed the foundation for the green computing that we know of today.
Heat Transfer
Author | : Hafiz Muhammad Ali |
Publisher | : BoD – Books on Demand |
Total Pages | : 200 |
Release | : 2024-02-14 |
Genre | : Science |
ISBN | : 1803566396 |
Heat Transfer - Advances in Fundamentals and Applications explores new knowledge in the domain of fundamental and applied advances in heat transfer. This book specifically emphasizes advanced topics of heat transfer. Professionals, researchers, and academics working in various areas of heat transfer will find this a useful reference for finding new solutions to heat transfer problems. The book is organized into two sections on the fundamental advances in heat transfer and advances in applications of heat transfer. Chapters address inverse conduction problems, heat transfer enhancement during internal flows, shell-and-tube heat exchangers, heat transfer mechanisms in petroleum and geothermal wellbores, and other topics in the field.
Antenna-in-Package Technology and Applications
Author | : Duixian Liu |
Publisher | : John Wiley & Sons |
Total Pages | : 420 |
Release | : 2020-03-10 |
Genre | : Technology & Engineering |
ISBN | : 1119556643 |
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Architecture of Computing Systems -- ARCS 2013
Author | : Hana Kubatova |
Publisher | : Springer |
Total Pages | : 365 |
Release | : 2013-02-12 |
Genre | : Computers |
ISBN | : 3642364241 |
This book constitutes the refereed proceedings of the 26th International Conference on Architecture of Computing Systems, ARCS 2013, held in Prague, Czech Republic, in February 2013. The 29 papers presented were carefully reviewed and selected from 73 submissions. The topics covered are computer architecture topics such as multi-cores, memory systems, and parallel computing, adaptive system architectures such as reconfigurable systems in hardware and software, customization and application specific accelerators in heterogeneous architectures, organic and autonomic computing including both theoretical and practical results on self-organization, self-configuration, self-optimization, self-healing, and self-protection techniques, operating systems including but not limited to scheduling, memory management, power management, RTOS, energy-awareness, and green computing.
Thermal Computations for Electronics
Author | : Gordon N. Ellison |
Publisher | : CRC Press |
Total Pages | : 296 |
Release | : 2020-05-13 |
Genre | : Technology & Engineering |
ISBN | : 1000047466 |
The first edition of Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling was based on the author's lecture notes that he developed over the course of nearly 40 years of thermal design and analysis activity, the last 15 years of which included teaching a university course at the senior undergraduate and graduate levels. The subject material was developed from publications of respected researchers and includes topics and methods original to this author. Numerous students have contributed to both the first and second editions, the latter corrected, sections rewritten (e.g., radiation spatial effects, Green's function properties for thermal spreading, 1-D FEA theory and application), and some new material added. The flavor and organization of the first edition have been retained, whereby the reader is guided through the analysis process for systems and then components. Important new material has been added regarding altitude effects on forced and buoyancy driven airflow and heat transfer. The first 20% of the book is devoted to the prediction of airflow and well-mixed air temperatures in systems, circuit board channels, and heat sinks, followed by convective (PCB-mounted components included), radiative, and conductive heat transfer and the resultant temperatures in electronic equipment. Detailed application examples illustrate a variety of problems. Downloads (from the CRC website) include: MathcadTM text examples, exercise solutions (adopting professors only) plus PDF lecture aids (professors only), and a tutorial (Chapter 14) using free FEA software to solve a thermal spreading problem. This book is a valuable professional resource for self-study and is ideal for use in a course on electronics cooling. It is well-suited for a first course in heat transfer where applications are as important as theory.