A One-Semester Course in Modeling of VSLI Interconnections

A One-Semester Course in Modeling of VSLI Interconnections
Author: Ashok Goel
Publisher: Momentum Press
Total Pages: 394
Release: 2014-12-29
Genre: Technology & Engineering
ISBN: 1606505130

Quantitative understanding of the parasitic capacitances and inductances, and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits. More than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-induced failure associated with the interconnections in the realistic high-density environment on a chip will be discussed. A One-Semester Course in Modeling of VLSI Interconnections also includes an overview of the future interconnection technologies for the nanotechnology circuits.

The Physical Properties of Thin Metal Films

The Physical Properties of Thin Metal Films
Author: G.P. Zhigal'skii
Publisher: CRC Press
Total Pages: 234
Release: 2003-07-10
Genre: Technology & Engineering
ISBN: 9781420024074

Thin films of conducting materials, such as metals, alloys and semiconductors are currently in use in many areas of science and technology, particularly in modern integrated circuit microelectronics that require high quality thin films for the manufacture of connection layers, resistors and ohmic contacts. These conducting films are also important for fundamental investigations in physics, radio-physics and physical chemistry. Physical Properties of Thin Metal Films provides a clear presentation of the complex physical properties particular to thin conducting films and includes the necessary theory, confirming experiments and applications. The volume will be an invaluable reference for graduates, engineers and scientists working in the electronics industry and fields of pure and applied science.

Masters Theses in the Pure and Applied Sciences

Masters Theses in the Pure and Applied Sciences
Author: Wade H. Shafer
Publisher: Springer Science & Business Media
Total Pages: 407
Release: 2012-12-06
Genre: Science
ISBN: 1468451979

Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS) * at Purdue University in 1 957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dissemination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all con cerned if the printing and distribution of the volumes were handled by an interna tional publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Cor poration of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 29 (thesis year 1984) a total of 12,637 theses titles from 23 Canadian and 202 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this important annual reference work. While Volume 29 reports theses submitted in 1984, on occasion, certain univer sities do report theses submitted in previous years but not reported at the time.

High-Speed VLSI Interconnections

High-Speed VLSI Interconnections
Author: Ashok K. Goel
Publisher: John Wiley & Sons
Total Pages: 433
Release: 2007-10-19
Genre: Technology & Engineering
ISBN: 0470165960

This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.

Noise In Physical Systems And 1/f Fluctuations - Proceedings Of The 14th International Conference

Noise In Physical Systems And 1/f Fluctuations - Proceedings Of The 14th International Conference
Author: C Claeys
Publisher: World Scientific
Total Pages: 702
Release: 1997-06-01
Genre:
ISBN: 9814546143

The recent conferences in this series were organised in Montreal (1987), Budapest (1989), Kyoto (1991), St Louis (1993) and Palanga (1995). The aim of the conference was to bring together specialists in fluctuation phenomena from different fields and to make a bridge between theoretical scientists and more applied or engineering oriented researchers. Therefore a broad variety of topics covering the fundamental aspects of noise and fluctuations as well as applications in various fields are addressed. Noise in materials, components, circuits and electronic, biological and other physical systems are discussed.