Diagnostic for Plasma Enhanced Chemical Vapor Deposition and Etch Systems

Diagnostic for Plasma Enhanced Chemical Vapor Deposition and Etch Systems
Author: National Aeronautics and Space Administration (NASA)
Publisher: Createspace Independent Publishing Platform
Total Pages: 28
Release: 2018-06-15
Genre:
ISBN: 9781721186020
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In order to meet NASA's requirements for the rapid development and validation of future generation electronic devices as well as associated materials and processes, enabling technologies ion the processing of semiconductor materials arising from understanding etch chemistries are being developed through a research collaboration between Stanford University and NASA-Ames Research Center, Although a great deal of laboratory-scale research has been performed on many of materials processing plasmas, little is known about the gas-phase and surface chemical reactions that are critical in many etch and deposition processes, and how these reactions are influenced by the variation in operating conditions. In addition, many plasma-based processes suffer from stability and reliability problems leading to a compromise in performance and a potentially increased cost for the semiconductor manufacturing industry. Such a lack of understanding has hindered the development of process models that can aid in the scaling and improvement of plasma etch and deposition systems. The research described involves the study of plasmas used in semiconductor processes. An inductively coupled plasma (ICP) source in place of the standard upper electrode assembly of the Gaseous Electronics Conference (GEC) radio-frequency (RF) Reference Cell is used to investigate the discharge characteristics and chemistries. This ICP source generates plasmas with higher electron densities (approximately 10(exp 12)/cu cm) and lower operating pressures (approximately 7 mTorr) than obtainable with the original parallel-plate version of the GEC Cell. This expanded operating regime is more relevant to new generations of industrial plasma systems being used by the microelectronics industry. The motivation for this study is to develop an understanding of the physical phenomena involved in plasma processing and to measure much needed fundamental parameters, such as gas-phase and surface reaction rates. species concentratio

Plasma Diagnostics

Plasma Diagnostics
Author: Orlando Auciello
Publisher: Academic Press
Total Pages: 349
Release: 2013-10-22
Genre: Science
ISBN: 1483288072
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Plasmas and their interaction with materials have become subjects of major interest because of their importance in modern forefront technologies such as microelectronics, fusion energy, and space. Plasmas are used in microelectronics to process semiconductors (etching of patterns for microcircuits, plasma-induced deposition of thin films, etc.); plasmas produce deleterious erosion effects on surfaces of materials used for fusion devices and spaceships exposed to the low earth environment.Diagnostics of plasmas and materials exposed to them are fundamental to the understanding of the physical and chemical phenomena involved. Plasma Diagnostics provides a comprehensive treatment of the subject.short version, TJE_Plasmas and their interaction with materials have become subjects of major interest because of their importance in modern forefront technologies such as microelectronics, fusion energy, and space. Diagnostics of plasmas and materials exposed to them are fundamental to the understanding of the physical and chemical phenomena involved. Plasma Diagnostics provides a comprehensive treatment of the subject.

Fundamentals of Semiconductor Manufacturing and Process Control

Fundamentals of Semiconductor Manufacturing and Process Control
Author: Gary S. May
Publisher: John Wiley & Sons
Total Pages: 428
Release: 2006-05-26
Genre: Technology & Engineering
ISBN: 0471790273
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A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.

Plasma Deposition, Treatment, and Etching of Polymers

Plasma Deposition, Treatment, and Etching of Polymers
Author: Riccardo d'Agostino
Publisher: Elsevier
Total Pages: 544
Release: 2012-12-02
Genre: Technology & Engineering
ISBN: 0323139086
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Plasma Deposition, Treatment, and Etching of Polymers takes a broad look at the basic principles, the chemical processes, and the diagnostic procedures in the interaction of plasmas with polymer surfaces. This recent technology has yielded a large class of new materials offering many applications, including their use as coatings for chemical fibers and films. Additional applications include uses for the passivation of metals, the surface hardening of tools, increased biocompatibility of biomedical materials, chemical and physical sensors, and a variety of micro- and optoelectronic devices. - Appeals to a broad range of industries from microelectronics to space technology - Discusses a wide array of new uses for plasma polymers - Provides a tutorial introduction to the field - Surveys various classes of plasma polymers, their chemical and morphological properties, effects of plasma process parameters on the growth and structure of these synthetic materials, and techniques for characterization - Interests scientists, engineers, and students alike

Handbook of Advanced Plasma Processing Techniques

Handbook of Advanced Plasma Processing Techniques
Author: R.J. Shul
Publisher: Springer Science & Business Media
Total Pages: 664
Release: 2011-06-28
Genre: Technology & Engineering
ISBN: 3642569897
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Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.