Development of Advanced Technologies for the Fabrication of III-V High Electron Mobility Transistors
Author | : Euan James Boyd |
Publisher | : |
Total Pages | : 219 |
Release | : 2004 |
Genre | : Modulation-doped field-effect transistors |
ISBN | : |
Download Development Of Advanced Technologies For The Fabrication Of Iii V High Electron Mobility Transistors full books in PDF, epub, and Kindle. Read online free Development Of Advanced Technologies For The Fabrication Of Iii V High Electron Mobility Transistors ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Author | : Euan James Boyd |
Publisher | : |
Total Pages | : 219 |
Release | : 2004 |
Genre | : Modulation-doped field-effect transistors |
ISBN | : |
Author | : D. Nirmal |
Publisher | : CRC Press |
Total Pages | : 446 |
Release | : 2019-05-14 |
Genre | : Science |
ISBN | : 0429862520 |
This book focusses on III-V high electron mobility transistors (HEMTs) including basic physics, material used, fabrications details, modeling, simulation, and other important aspects. It initiates by describing principle of operation, material systems and material technologies followed by description of the structure, I-V characteristics, modeling of DC and RF parameters of AlGaN/GaN HEMTs. The book also provides information about source/drain engineering, gate engineering and channel engineering techniques used to improve the DC-RF and breakdown performance of HEMTs. Finally, the book also highlights the importance of metal oxide semiconductor high electron mobility transistors (MOS-HEMT). Key Features Combines III-As/P/N HEMTs with reliability and current status in single volume Includes AC/DC modelling and (sub)millimeter wave devices with reliability analysis Covers all theoretical and experimental aspects of HEMTs Discusses AlGaN/GaN transistors Presents DC, RF and breakdown characteristics of HEMTs on various material systems using graphs and plots
Author | : S. J. Pearton |
Publisher | : World Scientific |
Total Pages | : 568 |
Release | : 1996 |
Genre | : Technology & Engineering |
ISBN | : 9789810218843 |
This book describes advanced epitaxial growth and self-aligned processing techniques for the fabrication of III-V semiconductor devices such as heterojunction bipolar transistors and high electron mobility transistors. It is the first book to describe the use of carbon-doping and low damage dry etching techniques that have proved indispensable in making reliable, high performance devices. These devices are used in many applications such as cordless telephones and high speed lightwave communication systems.
Author | : Zhaojun Liu |
Publisher | : Springer Nature |
Total Pages | : 65 |
Release | : 2022-06-01 |
Genre | : Technology & Engineering |
ISBN | : 3031020286 |
Ever since its invention in the 1980s, the compound semiconductor heterojunction-based high electron mobility transistor (HEMT) has been widely used in radio frequency (RF) applications. This book provides readers with broad coverage on techniques and new trends of HEMT, employing leading compound semiconductors, III-N and III-V materials. The content includes an overview of GaN HEMT device-scaling technologies and experimental research breakthroughs in fabricating various GaN MOSHEMT transistors. Readers are offered an inspiring example of monolithic integration of HEMT with LEDs, too. The authors compile the most relevant aspects of III-V HEMT, including the current status of state-of-art HEMTs, their possibility of replacing the Si CMOS transistor channel, and growth opportunities of III-V materials on an Si substrate. With detailed exploration and explanations, the book is a helpful source suitable for anyone learning about and working on compound semiconductor devices.
Author | : Steven Bentley |
Publisher | : |
Total Pages | : |
Release | : 2009 |
Genre | : |
ISBN | : |
High Electron Mobility Transistors (HEMTs) are crucially important devices in microwave circuit applications. As the technology has matured, new applications have arisen, particularly at millimetre-wave and sub-millimetre wave frequencies. There now exists great demand for low-visibility, security and medical imaging in addition to telecommunications applications operating at frequencies well above 100 GHz. These new applications have driven demand for high frequency, low noise device operation; key areas in which HEMTs excel. As a consequence, there is growing incentive to explore the ultimate performance available from such devices. As with all FETs, the key to HEMT performance optimisation is the reduction of gate length, whilst optimally scaling the rest of the device and minimising parasitic extrinsic influences on device performance. Although HEMTs have been under development for many years, key performance metrics have latterly slowed in their evolution, largely due to the difficulty of fabricating devices at increasingly nanometric gate lengths and maintaining satisfactory scaling and device performance. At Glasgow, the world-leading 50 nm HEMT process developed in 2003 had not since been improved in the intervening five years. This work describes the fabrication of sub-25 nm HEMTs in a robust and repeatable manner by the use of advanced processing techniques: in particular, electron beam lithography and reactive ion etching. This thesis describes firstly the development of robust gate lithography for sub-25 nm patterning, and its incorporation into a complete device process flow. Secondly, processes and techniques for the optimisation of the complete device are described. This work has led to the successful fabrication of functional 22 nm HEMTs and the development of 10 nm scale gate pattern transfer: simultaneously some of the shortest gate length devices reported and amongst the smallest scale structures ever lithographically defined on III-V substrates. The first successful fabrication of implant-isolated planar high-indium HEMTs is also reported amongst other novel secondary processes.
Author | : D. Nirmal |
Publisher | : CRC Press |
Total Pages | : 430 |
Release | : 2019-05-14 |
Genre | : Science |
ISBN | : 0429862539 |
This book focusses on III-V high electron mobility transistors (HEMTs) including basic physics, material used, fabrications details, modeling, simulation, and other important aspects. It initiates by describing principle of operation, material systems and material technologies followed by description of the structure, I-V characteristics, modeling of DC and RF parameters of AlGaN/GaN HEMTs. The book also provides information about source/drain engineering, gate engineering and channel engineering techniques used to improve the DC-RF and breakdown performance of HEMTs. Finally, the book also highlights the importance of metal oxide semiconductor high electron mobility transistors (MOS-HEMT). Key Features Combines III-As/P/N HEMTs with reliability and current status in single volume Includes AC/DC modelling and (sub)millimeter wave devices with reliability analysis Covers all theoretical and experimental aspects of HEMTs Discusses AlGaN/GaN transistors Presents DC, RF and breakdown characteristics of HEMTs on various material systems using graphs and plots
Author | : Ravindiran Munusami |
Publisher | : |
Total Pages | : |
Release | : 2017 |
Genre | : Technology |
ISBN | : |
High electron mobility transistor (HEMT) is the futuristic development of the transistor in migration of the nm technology for integration of many devices in a single chip. Moving beyond the silicon-based devices to reach out the bottlenecks in the scaling and sizing of transistors has become an interesting topic of research. This research area includes the novel approach towards new materials and device structures. Materials focus is on composites made of binary, ternary and quaternary elements. Nanostructures made of two-dimensional electron gas (2DEG), quantum well and tunnel barrier make the electron transport in devices interesting. A similar approach is adopted in the present work to make the device more suitable for faster device operation with high frequency.
Author | : Suman Lata Tripathi |
Publisher | : John Wiley & Sons |
Total Pages | : 608 |
Release | : 2021-03-24 |
Genre | : Technology & Engineering |
ISBN | : 1119755085 |
The increasing demand for electronic devices for private and industrial purposes lead designers and researchers to explore new electronic devices and circuits that can perform several tasks efficiently with low IC area and low power consumption. In addition, the increasing demand for portable devices intensifies the call from industry to design sensor elements, an efficient storage cell, and large capacity memory elements. Several industry-related issues have also forced a redesign of basic electronic components for certain specific applications. The researchers, designers, and students working in the area of electronic devices, circuits, and materials sometimesneed standard examples with certain specifications. This breakthrough work presents this knowledge of standard electronic device and circuit design analysis, including advanced technologies and materials. This outstanding new volume presents the basic concepts and fundamentals behind devices, circuits, and systems. It is a valuable reference for the veteran engineer and a learning tool for the student, the practicing engineer, or an engineer from another field crossing over into electrical engineering. It is a must-have for any library.
Author | : Geert Hellings |
Publisher | : Springer Science & Business Media |
Total Pages | : 154 |
Release | : 2013-03-25 |
Genre | : Technology & Engineering |
ISBN | : 9400763409 |
For many decades, the semiconductor industry has miniaturized transistors, delivering increased computing power to consumers at decreased cost. However, mere transistor downsizing does no longer provide the same improvements. One interesting option to further improve transistor characteristics is to use high mobility materials such as germanium and III-V materials. However, transistors have to be redesigned in order to fully benefit from these alternative materials. High Mobility and Quantum Well Transistors: Design and TCAD Simulation investigates planar bulk Germanium pFET technology in chapters 2-4, focusing on both the fabrication of such a technology and on the process and electrical TCAD simulation. Furthermore, this book shows that Quantum Well based transistors can leverage the benefits of these alternative materials, since they confine the charge carriers to the high-mobility material using a heterostructure. The design and fabrication of one particular transistor structure - the SiGe Implant-Free Quantum Well pFET – is discussed. Electrical testing shows remarkable short-channel performance and prototypes are found to be competitive with a state-of-the-art planar strained-silicon technology. High mobility channels, providing high drive current, and heterostructure confinement, providing good short-channel control, make a promising combination for future technology nodes.
Author | : Loi D. Nguyen |
Publisher | : |
Total Pages | : 3 |
Release | : 1992 |
Genre | : |
ISBN | : |
Recent advances in material growth and fabrication process have made possible the realization of a new class of ultra-fast High Electron Mobility Transistors (HEMTs) in the AlInAs/GaInAs material system (lattice-matched to InP). In the last three (3) years alone, through improvements in materials and shrinking of gate length, the speed of state-of-the-art AlInAs/GaInAs HEMTs has been increased at an astounding rate: from 80 GHz in 1987 to 250 GHz as of today. Such a pace of progress, however, cannot be maintained indefinitely. As the gate length approaches the 0.1 PM regime, it becomes increasingly more difficult to improve the device speed by simply reducing the gate length. In this gate length regime, parasitic delays, such as drain delay (due to the extension of the drain depletion region) and capacitance charging time (gate pad and fringe), represent a large portion of the total delay and will ultimately limit the device extrinsic speed.