Designing Electronic Product Enclosures
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| Author | : Tony Serksnis |
| Publisher | : Springer |
| Total Pages | : 226 |
| Release | : 2018-07-25 |
| Genre | : Technology & Engineering |
| ISBN | : 3319693956 |
This book explains the design and fabrication of any electronic enclosure that contains a printed circuit board, from original design through materials selection, building and testing, and ongoing design improvement. It presents a thorough and lucid treatment of material physical properties, engineering, and compliance considerations such that readers will understand concerns that exist with a design (structural, environmental, and regulatory) and what is needed to successfully enter the marketplace. To this end, a main thrust of this volume is on the “commercialization” of electronic products when an enclosure is needed. The book targets the broadest audience tasked with design and manufacture of an enclosure for an electronic product, from mechanical/industrial engineers to designers and technicians. Compiling a wealth of information on relevant physical phenomena (strength of materials, shock and vibration, heat transfer), the book stands as a ready reference on how and where these key properties may be considered in the design of most electronic enclosures.
| Author | : Yong Liu |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 606 |
| Release | : 2012-02-15 |
| Genre | : Technology & Engineering |
| ISBN | : 1461410533 |
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
| Author | : Frank Suli |
| Publisher | : Woodhead Publishing |
| Total Pages | : 490 |
| Release | : 2018-11-01 |
| Genre | : Technology & Engineering |
| ISBN | : 008102391X |
Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.
| Author | : Clayton R. Paul |
| Publisher | : John Wiley & Sons |
| Total Pages | : 852 |
| Release | : 2022-11-01 |
| Genre | : Science |
| ISBN | : 1119404347 |
INTRODUCTION TO ELECTROMAGNETIC COMPATIBILITY The revised new edition of the classic textbook is an essential resource for anyone working with today’s advancements in both digital and analog devices, communications systems, as well as power/energy generation and distribution. Introduction to Electromagnetic Compatibility provides thorough coverage of the techniques and methodologies used to design and analyze electronic systems that function acceptably in their electromagnetic environment. Assuming no prior familiarity with electromagnetic compatibility, this user-friendly textbook first explains fundamental EMC concepts and technologies before moving on to more advanced topics in EMC system design. This third edition reflects the results of an extensive detailed review of the entire second edition, embracing and maintaining the content that has “stood the test of time”, such as from the theory of electromagnetic phenomena and associated mathematics, to the practical background information on U.S. and international regulatory requirements. In addition to converting Dr. Paul’s original SPICE exercises to contemporary utilization of LTSPICE, there is new chapter material on antenna modeling and simulation. This edition will continue to provide invaluable information on computer modeling for EMC, circuit board and system-level EMC design, EMC test practices, EMC measurement procedures and equipment, and more such as: Features fully-worked examples, topic reviews, self-assessment questions, end-of-chapter exercises, and numerous high-quality images and illustrations Contains useful appendices of phasor analysis methods, electromagnetic field equations and waves. The ideal textbook for university courses on EMC, Introduction to Electromagnetic Compatibility, Third Edition is also an invaluable reference for practicing electrical engineers dealing with interference issues or those wanting to learn more about electromagnetic compatibility to become better product designers.
| Author | : John X. Wang |
| Publisher | : CRC Press |
| Total Pages | : 338 |
| Release | : 2017-02-03 |
| Genre | : Business & Economics |
| ISBN | : 1498709605 |
Designing new products and improving existing ones is a continual process. Industrial design engineering is an industrial engineering process applied to product designs that are to be manufactured through techniques of production operations. Excellent industrial design engineering programs are essential for the nation’s industry to succeed in selling useful and ecologically justifiable and usable products on a market flooded with goods and services. This unique text on industrial design engineering integrates basic knowledge, insight, and working methods from industrial engineering and product design subjects. Industrial Design Engineering: Inventive Problem Solving provides a combination of engineering thinking and design skills that give the researchers, practitioners, and students an excellent foundation for participation in product development projects and techniques for establishing and managing such projects. The design principles are presented around examples related to the designing of products, goods, and services. Case studies are developed around real problems and are based on the customer’s needs.
| Author | : Glenn R. Blackwell |
| Publisher | : CRC Press |
| Total Pages | : 648 |
| Release | : 2017-12-19 |
| Genre | : Technology & Engineering |
| ISBN | : 9781420049848 |
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
| Author | : Konrad Baumann |
| Publisher | : CRC Press |
| Total Pages | : 483 |
| Release | : 2001-04-05 |
| Genre | : Technology & Engineering |
| ISBN | : 1134544847 |
This simple and manageable guide to user interface design is written for the professional in industry working on product development and the decision process. It is directed not only to the human factors specialists, but also to technicians, designers, marketing and product managers and students. The book presents guidelines for user interface d
| Author | : Daniel L. Schodek |
| Publisher | : Butterworth-Heinemann |
| Total Pages | : 560 |
| Release | : 2009-03-24 |
| Genre | : Technology & Engineering |
| ISBN | : 0080941532 |
How could nanotechnology not perk the interest of any designer, engineer or architect? Exploring the intriguing new approaches to design that nanotechnologies offer, Nanomaterials, Nanotechnologies and Design is set against the sometimes fantastic sounding potential of this technology. Nanotechnology offers product engineers, designers, architects and consumers a vastly enhanced palette of materials and properties, ranging from the profound to the superficial. It is for engineering and design students and professionals who need to understand enough about the subject to apply it with real meaning to their own work. - World-renowned author team address the hot-topic of nanotechnology - The first book to address and explore the impacts and opportunities of nanotech for mainstream designers, engineers and architects - Full colour production and excellent design: guaranteed to appeal to everyone concerned with good design and the use of new materials
| Author | : Jack W. Plunkett |
| Publisher | : Plunkett Research, Ltd. |
| Total Pages | : 717 |
| Release | : 2007-05 |
| Genre | : Business & Economics |
| ISBN | : 1593920695 |
A guide to the trends and leading companies in the engineering, research, design, innovation and development business fields. This book contains most of the data you need on the American Engineering & Research Industry. It includes market analysis, R&D data and several statistical tables and nearly 400 profiles of Engineering and Research firms.
| Author | : Tim Williams |
| Publisher | : Newnes |
| Total Pages | : 276 |
| Release | : 2014-06-28 |
| Genre | : Technology & Engineering |
| ISBN | : 1483183882 |
EMC for Product Designers: Meeting the European EMC Directives is a six-chapter text that considers the by-product of the co-existence of all kinds of radio services, called electromagnetic compatibility (EMC). This book discusses the solution to the damaging frequency interference of EMC and the problem of EMC to electronic equipment. The opening chapter considers the effect of adapting the EMC Directives to decrease the economic damage being caused by electromagnetic interference, as well as the analysis, definition, and compliance of EMC and EMC Directives. The next chapters deal with the measurement of EMC; RF emission testing; features of circuits, layout, and grounding; digital and analogue circuit design; and description of interfaces, filtering, and shielding. These topics are followed by discussion of the equipment for mains harmonic emission, the facilities and equipment for measuring RF susceptibility, and the transient susceptibility to ESD. The concluding chapters examine the use of performance criteria in measuring EMC. These chapters describe the features and application of the Fourier spectrum. The book can provide useful information to economists, engineers, radio technicians, students, and researchers.
