Masters Theses in the Pure and Applied Sciences

Masters Theses in the Pure and Applied Sciences
Author: Wade H. Shafer
Publisher: Springer Science & Business Media
Total Pages: 426
Release: 2012-12-06
Genre: Science
ISBN: 1461519691

Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS)* at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dis semination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all concerned if the printing and distribution of the volumes were handled by an international publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Corporation of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 38 (thesis year 1993) a total of 13,787 thesis titles from 22 Canadian and 164 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this impor tant annual reference work. While Volume 38 reports theses submitted in 1993, on occasion, certain uni versities do report theses submitted in previous years but not reported at the time.

Masters Theses in the Pure and Applied Sciences

Masters Theses in the Pure and Applied Sciences
Author: Sade H Shafer
Publisher: Springer Science & Business Media
Total Pages: 440
Release: 1995
Genre: Education
ISBN:

Cited in Sheehy, Chen, and Hurt . Volume 38 (thesis year 1993) reports a total of 13,787 thesis titles from 22 Canadian and 164 US universities. As in previous volumes, thesis titles are arranged by discipline and by university within each discipline. Any accredited university or college with a grad

Index to IEEE Periodicals

Index to IEEE Periodicals
Author: Institute of Electrical and Electronics Engineers
Publisher:
Total Pages: 578
Release: 1971
Genre: Electrical engineering
ISBN:

Proceedings of the IEEE, IEEE Transactions, IEEE Journals, IEEE Spectrum.

III–V Compound Semiconductors

III–V Compound Semiconductors
Author: Tingkai Li
Publisher: CRC Press
Total Pages: 606
Release: 2010-12-02
Genre: Science
ISBN: 1439815224

Silicon-based microelectronics has steadily improved in various performance-to-cost metrics. But after decades of processor scaling, fundamental limitations and considerable new challenges have emerged. The integration of compound semiconductors is the leading candidate to address many of these issues and to continue the relentless pursuit of more powerful, cost-effective processors. III-V Compound Semiconductors: Integration with Silicon-Based Microelectronics covers recent progress in this area, addressing the two major revolutions occurring in the semiconductor industry: integration of compound semiconductors into Si microelectronics, and their fabrication on large-area Si substrates. The authors present a scientific and technological exploration of GaN, GaAs, and III-V compound semiconductor devices within Si microelectronics, building a fundamental foundation to help readers deal with relevant design and application issues. Explores silicon-based CMOS applications developed within the cutting-edge DARPA program Providing an overview of systems, devices, and their component materials, this book: Describes structure, phase diagrams, and physical and chemical properties of III-V and Si materials, as well as integration challenges Focuses on the key merits of GaN, including its importance in commercializing a new class of power diodes and transistors Analyzes more traditional III-V materials, discussing their merits and drawbacks for device integration with Si microelectronics Elucidates properties of III-V semiconductors and describes approaches to evaluate and characterize their attributes Introduces novel technologies for the measurement and evaluation of material quality and device properties Investigates state-of-the-art optical devices, LEDs, Si photonics, high-speed, high-power III-V materials and devices, III-V solar cell devices, and more Assembling the work of renowned experts, this is a reference for scientists and engineers working at the intersection of Si and compound semiconductor technology. Its comprehensive coverage is valuable for both students and experts in this burgeoning field.

Compound Semiconductor Integrated Circuits

Compound Semiconductor Integrated Circuits
Author: Tho T. Vu
Publisher: World Scientific
Total Pages: 363
Release: 2003
Genre: Technology & Engineering
ISBN: 9812383115

This is the book version of a special issue of the International Journal of High Speed Electronics and Systems, reviewing recent work in the field of compound semiconductor integrated circuits. There are fourteen invited papers covering a wide range of applications, frequencies and materials. These papers deal with digital, analog, microwave and millimeter-wave technologies, devices and integrated circuits for wireline fiber-optic lightwave transmissions, and wireless radio-frequency microwave and millimeter-wave communications. In each case, the market is young and experiencing rapid growth for both commercial and millitary applications. Many new semiconductor technologies compete for these new markets, leading to an alphabet soup of semiconductor materials described in these papers. Contents: Present and Future of High-Speed Compound Semiconductor IC's (T Otsuji); Transforming MMIC (E J Martinez); Distributed Amplifier for Fiber-Optic Communication Systems (H Shigematsu et al.); Microwave GaN-Based Power Transistors on Large-Scale Silicon Wafers (S Manohar et al.); Radiation Effects in High Speed III-V Integrated Circuits (T R Weatherford); Radiation Effects in III-V Semiconductor Electronics (B D Weaver et al.); Reliability and Radiation Hardness of Compound Semiconductors (S A Kayali & A H Johnston); and other papers. Readership: Engineers, scientists and graduate students working on high speed electronics and systems, and in the area of compound semiconductor integrated circuits.

High-Frequency Analog Integrated Circuit Design

High-Frequency Analog Integrated Circuit Design
Author: Ravender Goyal
Publisher: Wiley-Interscience
Total Pages: 432
Release: 1995
Genre: Technology & Engineering
ISBN:

. Offering comprehensive coverage of state-of-the-art GaAs MESFET technology and design techniques for analog ICs, this book features detailed, step-by-step guidance on everything from basic concepts such as biasing network, current source, current mirrors, and differential circuits; to more complex designs, such as amplifiers, mixers, oscillators, and operational amplifier designs; and finally, high-level functions such as A/D and D/A converters and their implementation in GaAs technology.