Contributions From The 13th Semiconductor Thermal Measurement And Management Semi Therm Symposium
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| Author | : Institute of Electrical and Electronics Engineers |
| Publisher | : Institute of Electrical & Electronics Engineers(IEEE) |
| Total Pages | : 312 |
| Release | : 1997 |
| Genre | : Technology & Engineering |
| ISBN | : |
This volume features coverage of new developments in and applications relating to generation and removal of heat within semiconductor devices, and measurement of junction temperatures under various application and environmental conditions.
| Author | : |
| Publisher | : |
| Total Pages | : 320 |
| Release | : 2000 |
| Genre | : Amorphous semiconductors |
| ISBN | : |
| Author | : Márta Rencz |
| Publisher | : MDPI |
| Total Pages | : 310 |
| Release | : 2021-01-12 |
| Genre | : Technology & Engineering |
| ISBN | : 303943831X |
This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
| Author | : Institute of Electrical and Electronics Engineers |
| Publisher | : |
| Total Pages | : 1462 |
| Release | : 1997 |
| Genre | : Electric engineering |
| ISBN | : |
Issues for 1973- cover the entire IEEE technical literature.
| Author | : |
| Publisher | : |
| Total Pages | : 1150 |
| Release | : 2002 |
| Genre | : Electronic apparatus and appliances |
| ISBN | : |
| Author | : Cristina H. Amon |
| Publisher | : |
| Total Pages | : 1148 |
| Release | : 2002 |
| Genre | : Science |
| ISBN | : |
| Author | : |
| Publisher | : |
| Total Pages | : 2576 |
| Release | : 2002 |
| Genre | : American literature |
| ISBN | : |
| Author | : Frede Blaabjerg |
| Publisher | : MDPI |
| Total Pages | : 476 |
| Release | : 2019-06-24 |
| Genre | : Technology & Engineering |
| ISBN | : 3038979740 |
Power electronics technology is still an emerging technology, and it has found its way into many applications, from renewable energy generation (i.e., wind power and solar power) to electrical vehicles (EVs), biomedical devices, and small appliances, such as laptop chargers. In the near future, electrical energy will be provided and handled by power electronics and consumed through power electronics; this not only will intensify the role of power electronics technology in power conversion processes, but also implies that power systems are undergoing a paradigm shift, from centralized distribution to distributed generation. Today, more than 1000 GW of renewable energy generation sources (photovoltaic (PV) and wind) have been installed, all of which are handled by power electronics technology. The main aim of this book is to highlight and address recent breakthroughs in the range of emerging applications in power electronics and in harmonic and electromagnetic interference (EMI) issues at device and system levels as discussed in robust and reliable power electronics technologies, including fault prognosis and diagnosis technique stability of grid-connected converters and smart control of power electronics in devices, microgrids, and at system levels.
| Author | : S. M. Sohel Murshed |
| Publisher | : BoD – Books on Demand |
| Total Pages | : 184 |
| Release | : 2016-06-15 |
| Genre | : Computers |
| ISBN | : 9535124056 |
Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
| Author | : Ho-Ming Tong |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 562 |
| Release | : 2013-03-20 |
| Genre | : Technology & Engineering |
| ISBN | : 1441957685 |
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
