Chemical Mechanical And Materials Engineering
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| Author | : Wole Soboyejo |
| Publisher | : CRC Press |
| Total Pages | : 610 |
| Release | : 2002-11-20 |
| Genre | : Technology & Engineering |
| ISBN | : 9780203910399 |
Featuring in-depth discussions on tensile and compressive properties, shear properties, strength, hardness, environmental effects, and creep crack growth, "Mechanical Properties of Engineered Materials" considers computation of principal stresses and strains, mechanical testing, plasticity in ceramics, metals, intermetallics, and polymers, materials selection for thermal shock resistance, the analysis of failure mechanisms such as fatigue, fracture, and creep, and fatigue life prediction. It is a top-shelf reference for professionals and students in materials, chemical, mechanical, corrosion, industrial, civil, and maintenance engineering; and surface chemistry.
| Author | : Joseph M. Steigerwald |
| Publisher | : John Wiley & Sons |
| Total Pages | : 337 |
| Release | : 2008-09-26 |
| Genre | : Science |
| ISBN | : 3527617752 |
Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.
| Author | : Koenraad George Frans Janssens |
| Publisher | : Academic Press |
| Total Pages | : 359 |
| Release | : 2010-07-26 |
| Genre | : Technology & Engineering |
| ISBN | : 0080555497 |
Computational Materials Engineering is an advanced introduction to the computer-aided modeling of essential material properties and behavior, including the physical, thermal and chemical parameters, as well as the mathematical tools used to perform simulations. Its emphasis will be on crystalline materials, which includes all metals. The basis of Computational Materials Engineering allows scientists and engineers to create virtual simulations of material behavior and properties, to better understand how a particular material works and performs and then use that knowledge to design improvements for particular material applications. The text displays knowledge of software designers, materials scientists and engineers, and those involved in materials applications like mechanical engineers, civil engineers, electrical engineers, and chemical engineers. Readers from students to practicing engineers to materials research scientists will find in this book a single source of the major elements that make up contemporary computer modeling of materials characteristics and behavior. The reader will gain an understanding of the underlying statistical and analytical tools that are the basis for modeling complex material interactions, including an understanding of computational thermodynamics and molecular kinetics; as well as various modeling systems. Finally, the book will offer the reader a variety of algorithms to use in solving typical modeling problems so that the theory presented herein can be put to real-world use. - Balanced coverage of fundamentals of materials modeling, as well as more advanced aspects of modeling, such as modeling at all scales from the atomic to the molecular to the macro-material - Concise, yet rigorous mathematical coverage of such analytical tools as the Potts type Monte Carlo method, cellular automata, phase field, dislocation dynamics and Finite Element Analysis in statistical and analytical modeling
| Author | : M.R. Oliver |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 444 |
| Release | : 2004-01-26 |
| Genre | : Technology & Engineering |
| ISBN | : 9783540431817 |
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
| Author | : Mark E. Davis |
| Publisher | : Courier Corporation |
| Total Pages | : 385 |
| Release | : 2013-05-27 |
| Genre | : Technology & Engineering |
| ISBN | : 0486291316 |
Appropriate for a one-semester undergraduate or first-year graduate course, this text introduces the quantitative treatment of chemical reaction engineering. It covers both homogeneous and heterogeneous reacting systems and examines chemical reaction engineering as well as chemical reactor engineering. Each chapter contains numerous worked-out problems and real-world vignettes involving commercial applications, a feature widely praised by reviewers and teachers. 2003 edition.
| Author | : National Research Council |
| Publisher | : National Academies Press |
| Total Pages | : 322 |
| Release | : 1989-02-01 |
| Genre | : Technology & Engineering |
| ISBN | : 0309039282 |
Materials science and engineering (MSE) contributes to our everyday lives by making possible technologies ranging from the automobiles we drive to the lasers our physicians use. Materials Science and Engineering for the 1990s charts the impact of MSE on the private and public sectors and identifies the research that must be conducted to help America remain competitive in the world arena. The authors discuss what current and future resources would be needed to conduct this research, as well as the role that industry, the federal government, and universities should play in this endeavor.
| Author | : |
| Publisher | : |
| Total Pages | : 536 |
| Release | : 1971 |
| Genre | : Education, Higher |
| ISBN | : |
| Author | : Brian S. Mitchell |
| Publisher | : John Wiley & Sons |
| Total Pages | : 976 |
| Release | : 2004-01-16 |
| Genre | : Technology & Engineering |
| ISBN | : 0471473367 |
An Introduction to Materials Engineering and Science for Chemical and Materials Engineers provides a solid background in materials engineering and science for chemical and materials engineering students. This book: Organizes topics on two levels; by engineering subject area and by materials class. Incorporates instructional objectives, active-learning principles, design-oriented problems, and web-based information and visualization to provide a unique educational experience for the student. Provides a foundation for understanding the structure and properties of materials such as ceramics/glass, polymers, composites, bio-materials, as well as metals and alloys. Takes an integrated approach to the subject, rather than a "metals first" approach.
| Author | : Yuzhuo Li |
| Publisher | : John Wiley & Sons |
| Total Pages | : 734 |
| Release | : 2008 |
| Genre | : Science |
| ISBN | : 9780471719199 |
An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: Provides in-depth coverage of a wide range of state-of-the-art technologies and applications Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
| Author | : Gavin Towler |
| Publisher | : Elsevier |
| Total Pages | : 1321 |
| Release | : 2012-01-25 |
| Genre | : Technology & Engineering |
| ISBN | : 0080966608 |
Chemical Engineering Design, Second Edition, deals with the application of chemical engineering principles to the design of chemical processes and equipment. Revised throughout, this edition has been specifically developed for the U.S. market. It provides the latest US codes and standards, including API, ASME and ISA design codes and ANSI standards. It contains new discussions of conceptual plant design, flowsheet development, and revamp design; extended coverage of capital cost estimation, process costing, and economics; and new chapters on equipment selection, reactor design, and solids handling processes. A rigorous pedagogy assists learning, with detailed worked examples, end of chapter exercises, plus supporting data, and Excel spreadsheet calculations, plus over 150 Patent References for downloading from the companion website. Extensive instructor resources, including 1170 lecture slides and a fully worked solutions manual are available to adopting instructors. This text is designed for chemical and biochemical engineering students (senior undergraduate year, plus appropriate for capstone design courses where taken, plus graduates) and lecturers/tutors, and professionals in industry (chemical process, biochemical, pharmaceutical, petrochemical sectors). New to this edition: - Revised organization into Part I: Process Design, and Part II: Plant Design. The broad themes of Part I are flowsheet development, economic analysis, safety and environmental impact and optimization. Part II contains chapters on equipment design and selection that can be used as supplements to a lecture course or as essential references for students or practicing engineers working on design projects. - New discussion of conceptual plant design, flowsheet development and revamp design - Significantly increased coverage of capital cost estimation, process costing and economics - New chapters on equipment selection, reactor design and solids handling processes - New sections on fermentation, adsorption, membrane separations, ion exchange and chromatography - Increased coverage of batch processing, food, pharmaceutical and biological processes - All equipment chapters in Part II revised and updated with current information - Updated throughout for latest US codes and standards, including API, ASME and ISA design codes and ANSI standards - Additional worked examples and homework problems - The most complete and up to date coverage of equipment selection - 108 realistic commercial design projects from diverse industries - A rigorous pedagogy assists learning, with detailed worked examples, end of chapter exercises, plus supporting data and Excel spreadsheet calculations plus over 150 Patent References, for downloading from the companion website - Extensive instructor resources: 1170 lecture slides plus fully worked solutions manual available to adopting instructors
