Bst Based Low Temperature Co Fired Ceramic Ltcc Modules For Microwave Tunable Components
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| Author | : Mailadil T. Sebastian |
| Publisher | : John Wiley & Sons |
| Total Pages | : 1021 |
| Release | : 2017-05-08 |
| Genre | : Technology & Engineering |
| ISBN | : 1119208521 |
The recent rapid progress in wireless telecommunication, including the Internet of Things, 5th generation wireless systems, satellite broadcasting, and intelligent transport systems has increased the need for low-loss dielectric materials and modern fabrication techniques. These materials have excellent electrical, dielectric, and thermal properties and have enormous potential, especially in wireless communication, flexible electronics, and printed electronics. Microwave Materials and Applications discusses the methods commonly employed for measuring microwave dielectric properties, the various attempts reported to solve problems of materials chemistry and crystal structure, doping, substitution, and composite formation, highlighting the processing techniques, morphology influences, and applications of microwave materials whilst summarizing many of the recent technical research accomplishments in the area of microwave dielectrics and applications Chapters examine: Oxide ceramics for dielectric resonators and substrates HTCC, LTCC and ULTCC tapes for substrates Polymer ceramic composites for printed circuit boards Elastomer-ceramic composites for flexible electronics Dielectric inks EMI shielding materials Microwave ferrites A comprehensive Appendix presents the fundamental properties for more than 4000 low-loss dielectric ceramics, their composition, crystal structure, and their microwave dielectric properties. Microwave Materials and Applications presents a comprehensive view of all aspects of microwave materials and applications, making it useful for scientists, industrialists, engineers, and students working on current and emerging applications of wireless communications and consumer electronics.
| Author | : John N. Sahalos |
| Publisher | : Springer Nature |
| Total Pages | : 228 |
| Release | : 2022-06-01 |
| Genre | : Technology & Engineering |
| ISBN | : 3031015428 |
Tunable Materials with Applications in Antennas and Microwaves is a stimulating topic in these modern times. With the explosion of the new generation of the wireless world, greater emphasis than ever before is being placed on the analysis and applications of modern materials. This book describes the characteristics of Ferrites and Ferroelectrics and introduces the reader to Multiferroics. Represents, in a simple manner, the solid state physics and explains the permittivity and permeability tensor characteristics for the tunable materials of infinite and finite dimensions. Gives the applications of tunable materials in resonators, filters, microstrips, striplines, antennas, phase shifters, capacitors, varactors, and frequency selective surfaces. Describes in detail the mathematical analysis for spin and magnetostatic waves for infinite medium, thin slab films, and finite circular discs. The analysis contains original work, which the reader may extend in the future. Provides multiferroics, which are ferrite and ferroelectric composites. Multiferroics are very promising tunable materials which are believed will offer many applications in the near future. Contains the planar transmission lines with analytic formulas for multilayer microstrips, transmission lines, and waveguides with isotropic as well as anisotropic dielectric and magnetic materials. Also, gives the formulas to analyze the layered category of transmission lines with multiferroics. This book is intended for antenna and microwave engineers as well as for graduate students of Materials Science and Engineering, Electrical & Computer Engineering, and Physics Departments.
| Author | : Anand K. Verma |
| Publisher | : John Wiley & Sons |
| Total Pages | : 946 |
| Release | : 2021-06-02 |
| Genre | : Technology & Engineering |
| ISBN | : 1119632471 |
Provides a comprehensive discussion of planar transmission lines and their applications, focusing on physical understanding, analytical approach, and circuit models Planar transmission lines form the core of the modern high-frequency communication, computer, and other related technology. This advanced text gives a complete overview of the technology and acts as a comprehensive tool for radio frequency (RF) engineers that reflects a linear discussion of the subject from fundamentals to more complex arguments. Introduction to Modern Planar Transmission Lines: Physical, Analytical, and Circuit Models Approach begins with a discussion of waves on transmission lines and waves in material medium, including a large number of illustrative examples from published results. After explaining the electrical properties of dielectric media, the book moves on to the details of various transmission lines including waveguide, microstrip line, co-planar waveguide, strip line, slot line, and coupled transmission lines. A number of special and advanced topics are discussed in later chapters, such as fabrication of planar transmission lines, static variational methods for planar transmission lines, multilayer planar transmission lines, spectral domain analysis, resonators, periodic lines and surfaces, and metamaterial realization and circuit models. Emphasizes modeling using physical concepts, circuit-models, closed-form expressions, and full derivation of a large number of expressions Explains advanced mathematical treatment, such as the variation method, conformal mapping method, and SDA Connects each section of the text with forward and backward cross-referencing to aid in personalized self-study Introduction to Modern Planar Transmission Lines is an ideal book for senior undergraduate and graduate students of the subject. It will also appeal to new researchers with the inter-disciplinary background, as well as to engineers and professionals in industries utilizing RF/microwave technologies.
| Author | : Tadashi Takenaka |
| Publisher | : Trans Tech Publications Ltd |
| Total Pages | : 569 |
| Release | : 2009-12-03 |
| Genre | : Technology & Engineering |
| ISBN | : 3038133663 |
Selected, peer reviewed papers from the 6th Asian Meeting on Electroceramics and the 28th Electronics Division Meeting of the Ceramic Society of Japan, Tsukuba, Japan, Oct. 22-24, 2008
| Author | : Mailadil T. Sebastian |
| Publisher | : John Wiley & Sons |
| Total Pages | : 997 |
| Release | : 2017-03-02 |
| Genre | : Technology & Engineering |
| ISBN | : 1119208564 |
Die jüngsten Fortschritte im Bereich der drahtlosen Telekommunikation und dem Internet der Dinge sorgen bei drahtlosen Systemen, beim Satellitenfernsehen und bei intelligenten Transportsystemen der 5. Generation für eine höhere Nachfrage nach dielektrischen Materialien und modernen Fertigungstechniken. Diese Materialien bieten ausgezeichnete elektrische, dielektrische und thermische Eigenschaften und verfügen über enormes Potenzial, vor allem bei der drahtlosen Kommunikation, bei flexibler Elektronik und gedruckter Elektronik. Microwave Materials and Applications erläutert die herkömmlichen Methoden zur Messung der dielektrischen Eigenschaften im Mikrowellenbereich, die verschiedenen Ansätze zur Lösung von Problemen der Materialchemie und von Kristallstrukturen, in den Bereichen Doping, Substitution und Aufbau von Verbundwerkstoffen. Besonderer Schwerpunkt liegt auf Verarbeitungstechniken, Einflüssen der Morphologie und der Anwendung von Materialien in der Mikrowellentechnik. Gleichzeitig werden viele der jüngsten Forschungserkenntnisse bei Mikrowellen-Dielektrika und -Anwendungen zusammengefasst. Die verschiedenen Kapitel untersuchen: Oxidkeramiken für dielektrische Resonatoren und Substrate, HTCC-, LTCC- und ULTCC-Bänder für Substrate, Polymer-Keramik-Verbundstoffe für Leiterplatten, Elastomer-Keramik-Verbundstoffe für flexible Elektronik, dielektrische Tinten, Materialien für die EMV-Abschirmung, Mikrowellen-Ferrite. Ein umfassender Anhang präsentiert die grundlegenden Eigenschaften von mehr als 4000 verlustarmen dielektrischen Keramiken, deren Zusammensetzung, kristalline Struktur und dielektrischen Eigenschaften für Mikrowellenanwendungen. Microwave Materials and Applications wirft einen Blick auf sämtliche Aspekte von Mikrowellenmaterialien und -anwendungen, ein nützliches Handbuch für Wissenschaftler, Unternehmen, Ingenieure und Studenten, die sich mit heutigen und neuen Anwendungen in den Bereichen drahtlose Kommunikation und Unterhaltungselektronik beschäftigen.
| Author | : Rainee N. Simons |
| Publisher | : John Wiley & Sons |
| Total Pages | : 461 |
| Release | : 2004-04-07 |
| Genre | : Technology & Engineering |
| ISBN | : 0471463930 |
Up-to-date coverage of the analysis and applications of coplanar waveguides to microwave circuits and antennas The unique feature of coplanar waveguides, as opposed to more conventional waveguides, is their uniplanar construction, in which all of the conductors are aligned on the same side of the substrate. This feature simplifies manufacturing and allows faster and less expensive characterization using on-wafer techniques. Coplanar Waveguide Circuits, Components, and Systems is an engineer's complete resource, collecting all of the available data on the subject. Rainee Simons thoroughly discusses propagation parameters for conventional coplanar waveguides and includes valuable details such as the derivation of the fundamental equations, physical explanations, and numerical examples. Coverage also includes: Discontinuities and circuit elements Transitions to other transmission media Directional couplers, hybrids, and magic T Microelectromechanical systems based switches and phase shifters Tunable devices using ferroelectric materials Photonic bandgap structures Printed circuit antennas
| Author | : |
| Publisher | : |
| Total Pages | : |
| Release | : 2016 |
| Genre | : Microwave devices |
| ISBN | : 9783981266870 |
| Author | : Duixian Liu |
| Publisher | : John Wiley & Sons |
| Total Pages | : 416 |
| Release | : 2020-03-31 |
| Genre | : Technology & Engineering |
| ISBN | : 1119556635 |
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
| Author | : Terry C. Edwards |
| Publisher | : John Wiley & Sons |
| Total Pages | : 688 |
| Release | : 2016-02-01 |
| Genre | : Technology & Engineering |
| ISBN | : 1118936175 |
Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.
| Author | : F. Patrick McCluskey |
| Publisher | : CRC Press |
| Total Pages | : 354 |
| Release | : 1996-12-13 |
| Genre | : Technology & Engineering |
| ISBN | : 9780849396236 |
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
