Bogatins Practical Guide To Transmission Line Design And Characterization For Signal Integrity Applications
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| Author | : Eric Bogatin |
| Publisher | : Artech House |
| Total Pages | : 603 |
| Release | : 2020-05-31 |
| Genre | : Technology & Engineering |
| ISBN | : 1630816922 |
This multimedia eBook establishes a solid foundation in the essential principles of how signals interact with transmission lines, how the physical design of interconnects affects transmission line properties, and how to interpret single-ended and differential time domain reflection (TDR) measurements to extract important figures of merits and avoid common mistakes. This book presents an intuitive understanding of transmission lines. Instructional videos are provided in every chapter that cover important aspects of the interconnect design and characterization process. This video eBook helps establish foundations for designing and characterizing the electrical properties of interconnects to explain in a simplified way how signals propagate and interact with interconnects and how the physical design of transmission structures will impact performance. Never be intimidated by impedance or differential pairs again.
| Author | : Eric Bogatin |
| Publisher | : Artech House |
| Total Pages | : 500 |
| Release | : 2021-09-30 |
| Genre | : Technology & Engineering |
| ISBN | : 1630818488 |
Printed circuit boards (PCB) are at the heart of every electronic product manufactured today. Yet, engineers rarely learn to design PCBs from a class or course. They learn it by doing, by reading app notes, watching YouTube videos and sitting by the side of an experienced engineer. This book is the foundation building book for all engineers starting out to design PCBs. It teaches good habits designing a PCB, first for connectivity, and secondly, introduces the four most important principles to reduce noise. A seven-step process is presented: developing a plan of record, creating a Bill of Materials, completing the schematic, completing the layout, completing the assembly, conducting bring up and troubleshooting and documenting the project. Each step is developed in detail. In particular, the emphasis in this book is on risk management: what can be done at each step of the process to reduce the risk of a hard-error which requires a complete re-spin, or a soft error, which requires some sort of on-the-fly repair. After connectivity is designed, it’s important to develop good habits to minimize the potential noise from ground bounce, power rail stitching noise, stack up design and reducing switching noise in signal paths. These techniques apply to all designs from 2-layer to 8-layer and more, for bandwidths below 200 MHz. The best practices for manual lead-free soldering are presented so that everyone can become a soldering expert. The best measurement practices using common lab instruments such as the DMM, the constant current/constant voltage power supply, and oscilloscopes are presented so that common artifacts are minimized. Features in the design that help you find design or assembly errors quickly and the troubleshooting techniques to find and fix problems are introduced. Applying the habits presented in this book will help every engineer design their next circuit board faster, with less chance of an unexpected problem, with the lowest noise. This textbook will also have embedded videos to visually demonstrate many of the hands-on processes introduced in this book.
| Author | : Mike Resso |
| Publisher | : Intl. Engineering Consortiu |
| Total Pages | : 812 |
| Release | : 2009 |
| Genre | : Science |
| ISBN | : 9781931695930 |
Cogently addressing the future of signal integrity and the effect it will have on the data transmission industry as a whole, this all-inclusive guide addresses a wide array of technologies, from traditional digital data transmission to microwave measurements, and accessibly examines the gap between the two. Focusing on real world applications and providing a wide array of case studies that show how each technology can be used—from backplane design challenges to advanced error correction techniques—this guide addresses many of today’s high-speed technologies while also providing excellent insight into their future direction. With numerous valuable lessons pertaining to the signal integrity industry, this resource is the ultimate must-read guide for any specialist in the design engineering field.
| Author | : Eric Bogatin |
| Publisher | : Pearson Education |
| Total Pages | : 793 |
| Release | : 2010 |
| Genre | : Technology & Engineering |
| ISBN | : 0132349795 |
With the inclusion of the two new hot topics in signal integrity, power integrity and high speed serial links, this book will be the most up to date complete guide to understanding and designing for signal integrity.
| Author | : Eric Bogatin |
| Publisher | : Prentice Hall Professional |
| Total Pages | : 612 |
| Release | : 2004 |
| Genre | : Technology & Engineering |
| ISBN | : 9780130669469 |
This thorough review of the fundamental principles associated with signal integrity provides engineering principles behind signal integrity effects, and applies this understanding to solving problems.
| Author | : Peter J. Pupalaikis |
| Publisher | : Cambridge University Press |
| Total Pages | : 667 |
| Release | : 2020-02-06 |
| Genre | : Technology & Engineering |
| ISBN | : 1108808344 |
Master the usage of s-parameters in signal integrity applications and gain full understanding of your simulation and measurement environment with this rigorous and practical guide. Solve specific signal integrity problems including calculation of the s-parameters of a network, linear simulation of circuits, de-embedding, and virtual probing, all with expert guidance. Learn about the interconnectedness of s-parameters, frequency responses, filters, and waveforms. This invaluable resource for signal integrity engineers is supplemented with the open-source software SignalIntegrity, a Python package for scripting solutions to signal integrity problems.
| Author | : Madhavan Swaminathan |
| Publisher | : Pearson Education |
| Total Pages | : 599 |
| Release | : 2007-11-19 |
| Genre | : Technology & Engineering |
| ISBN | : 0132797178 |
The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.
| Author | : Stephen H. Hall |
| Publisher | : Wiley-IEEE Press |
| Total Pages | : 376 |
| Release | : 2000-09-08 |
| Genre | : Computers |
| ISBN | : |
The importance of interconnect design - Ideal transmission line fundamentals - Crosstalk - Nonideal interconnect issues - Connectors, packages, and vias - Nonideal return paths, simultaneous switching noise, and power delivery - Buffer modeling - Digital timing analysis - Design methodologies - Radiated emissions compliance and system noise minimization - High-speed measurement techniques.
| Author | : Brian Young |
| Publisher | : Prentice Hall |
| Total Pages | : 570 |
| Release | : 2001 |
| Genre | : Computers |
| ISBN | : |
State-of-the-art techniques for predicting and achieving target performance levels Theory, practice, general signal integrity issues, and leading-edge experimental techniques Model and simulate high-speed digital systems for maximum performance Maximizing the performance of digital systems means optimizing their high-speed interconnections. Digital Signal Integrity gives engineers all the theory and practical methods they need to accurately model and simulate those interconnections and predict real-world performance. Whether you're modeling microprocessors, memories, DSPs, or ASICs, these techniques will get you to market faster with greater reliability. Coverage includes: In-depth reviews of inductance, capacitance, resistance, single and multiconductor transmission lines, generalized termination schemes, crosstalk, differential signaling, and other modeling/simulation issues Multiconductor interconnects: packages, sockets, connectors and buses Modal decomposition: understanding the outputs generated by commercial modeling software Layer peeling with time-domain reflectometry: its power and limitations Experimental techniques for characterizing interconnect parasitics In Digital Signal Integrity, Motorola senior engineer Brian Young presents broad coverage of modeling from data obtained through electromagnetic simulation, transmission line theory, frequency and time-domain modeling, analog circuit simulation, digital signaling, and architecture. Young offers a strong mathematical foundation for every technique, as well as over 100 end-of-chapter problems. If you're stretching the performance envelope, you must be able to rely on your models and simulations. With this book, you can.
| Author | : Larry D. Smith |
| Publisher | : Prentice Hall |
| Total Pages | : 831 |
| Release | : 2017-04-06 |
| Genre | : Technology & Engineering |
| ISBN | : 0132735628 |
Consistently Design PDNs That Deliver Reliable Performance at the Right Cost Too often, PDN designs work inconsistently, and techniques that work in some scenarios seem to fail inexplicably in others. This book explains why and presents realistic processes for getting PDN designs right in any new product. Drawing on 60+ years of signal and power integrity experience, Larry Smith and Eric Bogatin show how to manage noise and electrical performance, and complement intuition with analysis to balance cost, performance, risk, and schedule. Throughout, they distill the essence of complex real-world problems, quantify core principles via approximation, and apply them to specific examples. For easy usage, dozens of key concepts and observations are highlighted as tips and listed in quick, chapter-ending summaries. Coverage includes • A practical, start-to-finish approach to consistently meeting PDN performance goals • Understanding how signals interact with interconnects • Identifying root causes of common problems, so you can avoid them • Leveraging analysis tools to efficiently explore design space and optimize tradeoffs • Analyzing impedance-related properties of series and parallel RLC circuits • Measuring low impedance for components and entire PDN ecologies • Predicting loop inductance from physical design features • Reducing peak impedances from combinations of capacitors • Understanding power and ground plane properties in the PDN interconnect • Taming signal integrity problems when signals change return planes • Reducing peak impedance created by on-die capacitance and package lead inductance • Controlling transient current waveform interactions with PDN features • Simple spreadsheet-based analysis techniques for quickly creating first-pass designs This guide will be indispensable for all engineers involved in PDN design, including product, board, and chip designers; system, hardware, component, and package engineers; power supply designers, SI and EMI engineers, sales engineers, and their managers.
