Automation In Manufacturing And Miniaturization In Size New Challenges For Electronic Packaging
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Automation in Manufacturing and Miniaturization in Size
Author | : Semiconductor Equipment and Materials International |
Publisher | : |
Total Pages | : 62 |
Release | : 1998 |
Genre | : Microelectronic packaging |
ISBN | : |
Manufacturing Challenges in Electronic Packaging
Author | : Y.C. Lee |
Publisher | : Springer Science & Business Media |
Total Pages | : 270 |
Release | : 2012-12-06 |
Genre | : Science |
ISBN | : 1461558034 |
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.
System on Package : Miniaturization of the Entire System
Author | : Rao Tummala |
Publisher | : Mcgraw-hill |
Total Pages | : 0 |
Release | : 2008-04-15 |
Genre | : Technology |
ISBN | : 9780071459068 |
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
The Electronic Packaging Handbook
Author | : Glenn R. Blackwell |
Publisher | : CRC Press |
Total Pages | : 937 |
Release | : 2017-12-19 |
Genre | : Technology & Engineering |
ISBN | : 1351835548 |
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Manufacturing Challenges in Electronic Packaging
Author | : Y C Lee |
Publisher | : |
Total Pages | : 276 |
Release | : 1997-12-31 |
Genre | : |
ISBN | : 9781461558040 |
This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.
System on Package
Author | : Rao Tummala |
Publisher | : McGraw Hill Professional |
Total Pages | : 807 |
Release | : 2007-07-22 |
Genre | : Technology & Engineering |
ISBN | : 0071593322 |
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Electronic Packaging and Production
Author | : |
Publisher | : |
Total Pages | : 686 |
Release | : 1995 |
Genre | : Electronic apparatus and appliances |
ISBN | : |
Industrial Internet of Things
Author | : Sabina Jeschke |
Publisher | : Springer |
Total Pages | : 714 |
Release | : 2016-10-12 |
Genre | : Technology & Engineering |
ISBN | : 3319425595 |
This book develops the core system science needed to enable the development of a complex industrial internet of things/manufacturing cyber-physical systems (IIoT/M-CPS). Gathering contributions from leading experts in the field with years of experience in advancing manufacturing, it fosters a research community committed to advancing research and education in IIoT/M-CPS and to translating applicable science and technology into engineering practice. Presenting the current state of IIoT and the concept of cybermanufacturing, this book is at the nexus of research advances from the engineering and computer and information science domains. Readers will acquire the core system science needed to transform to cybermanufacturing that spans the full spectrum from ideation to physical realization.