Assessment Of Advanced Thermal Management Materials For Electronics
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| Author | : Xingcun Colin Tong |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 633 |
| Release | : 2011-01-05 |
| Genre | : Technology & Engineering |
| ISBN | : 1441977597 |
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
| Author | : Guosheng Jiang |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 163 |
| Release | : 2012-09-13 |
| Genre | : Technology & Engineering |
| ISBN | : 1461419638 |
Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.
| Author | : Ralph Remsburg |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 632 |
| Release | : 1998-02-28 |
| Genre | : Computers |
| ISBN | : 9780412122712 |
With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits on-time product introduction and reliability in the field. This book serves as a reference for engineers who must predict the thermal performance of a company's latest product as well as the technicians who must quickly solve the problem of an overheating chip in a product that is already on the shelves.
| Author | : Younes Shabany |
| Publisher | : CRC Press |
| Total Pages | : 526 |
| Release | : 2009-12-17 |
| Genre | : Science |
| ISBN | : 1439814686 |
The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
| Author | : Ralph Remsburg |
| Publisher | : CRC Press |
| Total Pages | : 440 |
| Release | : 2017-12-19 |
| Genre | : Technology & Engineering |
| ISBN | : 1351835912 |
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
| Author | : David Reay |
| Publisher | : Butterworth-Heinemann |
| Total Pages | : 280 |
| Release | : 2013-10-01 |
| Genre | : Technology & Engineering |
| ISBN | : 0080982794 |
Heat Pipes, Sixth Edition, takes a highly practical approach to the design and selection of heat pipes, making it an essential guide for practicing engineers and an ideal text for postgraduate students.This new edition has been revised to include new information on the underlying theory of heat pipes and heat transfer, and features fully updated applications, new data sections, and updated chapters on design and electronics cooling. The book is a useful reference for those with experience and an accessible introduction for those approaching the topic for the first time. - Contains all information required to design and manufacture a heat pipe - Suitable for use as a professional reference and graduate text - Revised with greater coverage of key electronic cooling applications
| Author | : Libor Pekar |
| Publisher | : Academic Press |
| Total Pages | : 522 |
| Release | : 2020-07-10 |
| Genre | : Technology & Engineering |
| ISBN | : 0128194235 |
Advanced Analytic Control Techniques for Thermal Systems with Heat Exchangers presents the latest research on sophisticated analytic and control techniques specific for Heat Exchangers (HXs) and heat Exchanger Networks (HXNs), such as Stability Analysis, Efficiency of HXs, Fouling Effect, Delay Phenomenon, Robust Control, Algebraic Control, Geometric Control, Optimal Control, Fuzzy Control and Artificial Intelligence techniques. Editor Libor Pekar and his team of global expert contributors combine their knowledge and experience of investigated and applied systems and processes in this thorough review of the most advanced networks, analyzing their dynamics, efficiency, transient features, physical properties, performance, feasibility, flexibility and controllability. The structural and dynamic analyses and control approaches of HXNs, as well as energy efficient manipulation techniques are discussed, in addition to the design of the control systems through the full life cycle. This equips the reader with an understanding of the relevant theory in a variety of settings and scenarios and the confidence to apply that knowledge to solve problems in an academic or professional setting.Graduate students and early-mid career professionals require a robust understanding of how to suitably design thermal systems with HXs and HXNs to achieve required performance levels, which this book offers in one consolidated reference. All examples and solved problems included have been tried and tested, and these combined with the research driven theory provides professionals, researchers and students with the most recent techniques to maximize the energy efficiency and sustainability of existing and new thermal power systems. - Analyses several advanced techniques, the theoretical background of these techniques and includes models, examples and results throughout - Focusses on advanced analytic and control techniques which have been investigated or applied to thermal systems with HXs and HXNs - Includes practical applications and advanced ideas from leading experts in the field, as well as case studies and tested problems and solutions
| Author | : S. M. Sohel Murshed |
| Publisher | : BoD – Books on Demand |
| Total Pages | : 184 |
| Release | : 2016-06-15 |
| Genre | : Computers |
| ISBN | : 9535124056 |
Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
| Author | : El-Zeiny Ebeid |
| Publisher | : Elsevier |
| Total Pages | : 324 |
| Release | : 2021-06-23 |
| Genre | : Science |
| ISBN | : 0323901921 |
Thermal Analysis: From Introductory Fundamentals to Advanced Applications presents an easy-to-understand introduction to Thermal Analysis (TA) principles alongside in-depth coverage of the wide variety of techniques currently in use across several industries. It covers differential scanning calorimetry (DSC), temperature modulated DSC (TMDSC), differential thermal analysis (DTA), thermogravimetry (TG) or thermogravimetric analysis (TGA), thermomechanical analysis (TMA), differential photo-calorimetry (DPC), dynamic mechanical analysis (DMA), thermodilatometry (TD), dielectric thermal analysis (DEA), thermally-stimulated current (TSC), emanation thermal analysis (ETA), thermoluminescence (TL), fast scanning calorimetry (FSC), and microcalorimetry. Chapters define the various TA techniques, report the Temperature-Modulated DSC (TMDSC) method and its applications, especially its use for studying the thermodynamic properties of polymers and pharmaceuticals, focus on the potential of TA in materials science with applications in chemistry and engineering, demonstrate, in detail, the various applications of TA in food, electronic industries, solid-state reactions, chemistry of polymers and large directing agents, kinetic studies, demonstrate the crystal structure and phase changes occurring upon heating by TA, and the potential of TA in recycling and waste management. - Gives a solid introduction to the scientific principles of TA for those who are new to these techniques or need a deeper understanding - Illustrates concepts with more than 100 schematic and analysis curves, several flow charts, process diagrams and photographs - Contains chapters that cover the user of TA in materials science and crystal structures
| Author | : Wade H. Shafer |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 427 |
| Release | : 2012-12-06 |
| Genre | : Science |
| ISBN | : 1461303931 |
Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS)* at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dis semination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all concerned if the printing and distribution of the volumes were handled by an international publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Corporation of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 39 (thesis year 1994) a total of 13,953 thesis titles from 21 Canadian and 159 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this impor tant annual reference work. While Volume 39 reports theses submitted in 1994, on occasion, certain uni versities do report theses submitted in previous years but not reported at the time.
