Proceedings
Author | : |
Publisher | : |
Total Pages | : 476 |
Release | : 1999 |
Genre | : Science |
ISBN | : |
This work contains the proceedings of the 1999 International Conference on High Density Packaging and MCMs.
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Author | : |
Publisher | : |
Total Pages | : 476 |
Release | : 1999 |
Genre | : Science |
ISBN | : |
This work contains the proceedings of the 1999 International Conference on High Density Packaging and MCMs.
Author | : Stephen H. Hall |
Publisher | : Wiley-IEEE Press |
Total Pages | : 376 |
Release | : 2000-09-08 |
Genre | : Computers |
ISBN | : |
The importance of interconnect design - Ideal transmission line fundamentals - Crosstalk - Nonideal interconnect issues - Connectors, packages, and vias - Nonideal return paths, simultaneous switching noise, and power delivery - Buffer modeling - Digital timing analysis - Design methodologies - Radiated emissions compliance and system noise minimization - High-speed measurement techniques.
Author | : Michel S. Nakhla |
Publisher | : Springer Science & Business Media |
Total Pages | : 104 |
Release | : 2011-06-28 |
Genre | : Technology & Engineering |
ISBN | : 146152718X |
Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.
Author | : Blaise Ravelo |
Publisher | : Springer Nature |
Total Pages | : 239 |
Release | : 2019-11-21 |
Genre | : Technology & Engineering |
ISBN | : 9811505527 |
This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.
Author | : Stephen C. Thierauf |
Publisher | : Artech House |
Total Pages | : 321 |
Release | : 2017-04-30 |
Genre | : Technology & Engineering |
ISBN | : 163081444X |
This thoroughly updated leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise the entire circuit design. This new edition demonstrates how to apply EM theory to solve signal integrity problems with a practical application-oriented approach. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for projects involving high-speed serial signaling on printed wiring boards. Step-by-step, this book goes from reviewing the essentials of linear circuit theory, to examining practical issues of pulse propagation along lossless and lossy transmission lines. It provides detailed guidelines for crosstalk, attenuation, power supply decoupling, and layer stackup tradeoffs (including pad/antipad tradeoffs). Other key topics include the construction of etched conductors, analysis of return paths and split planes, microstrip and stripline characteristics, and SMT capacitors. Filled with on-the-job-proven examples, this hands-on reference is the book that engineers can turn to time and again to design out and troubleshoot circuit signal loss and impedance problems.
Author | : Terry C. Edwards |
Publisher | : John Wiley & Sons |
Total Pages | : 688 |
Release | : 2016-02-01 |
Genre | : Technology & Engineering |
ISBN | : 1118936175 |
Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.
Author | : Lee W. Ritchey |
Publisher | : |
Total Pages | : 412 |
Release | : 1996 |
Genre | : Electronic circuit design |
ISBN | : 9781882812042 |
Author | : Stephen H. Hall |
Publisher | : John Wiley & Sons |
Total Pages | : 608 |
Release | : 2011-09-20 |
Genre | : Science |
ISBN | : 1118210689 |
A synergistic approach to signal integrity for high-speed digital design This book is designed to provide contemporary readers with an understanding of the emerging high-speed signal integrity issues that are creating roadblocks in digital design. Written by the foremost experts on the subject, it leverages concepts and techniques from non-related fields such as applied physics and microwave engineering and applies them to high-speed digital design—creating the optimal combination between theory and practical applications. Following an introduction to the importance of signal integrity, chapter coverage includes: Electromagnetic fundamentals for signal integrity Transmission line fundamentals Crosstalk Non-ideal conductor models, including surface roughness and frequency-dependent inductance Frequency-dependent properties of dielectrics Differential signaling Mathematical requirements of physical channels S-parameters for digital engineers Non-ideal return paths and via resonance I/O circuits and models Equalization Modeling and budgeting of timing jitter and noise System analysis using response surface modeling Each chapter includes many figures and numerous examples to help readers relate the concepts to everyday design and concludes with problems for readers to test their understanding of the material. Advanced Signal Integrity for High-Speed Digital Designs is suitable as a textbook for graduate-level courses on signal integrity, for programs taught in industry for professional engineers, and as a reference for the high-speed digital designer.