Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author: Ephraim Suhir
Publisher: Springer Science & Business Media
Total Pages: 1471
Release: 2007-05-26
Genre: Technology & Engineering
ISBN: 0387329897

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Advanced Electronic Packaging

Advanced Electronic Packaging
Author: Richard K. Ulrich
Publisher: John Wiley & Sons
Total Pages: 852
Release: 2006-02-24
Genre: Technology & Engineering
ISBN: 0471466093

As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

Semiconductor Packaging

Semiconductor Packaging
Author: Andrea Chen
Publisher: CRC Press
Total Pages: 216
Release: 2016-04-19
Genre: Technology & Engineering
ISBN: 1439862079

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

Advanced Materials for Thermal Management of Electronic Packaging

Advanced Materials for Thermal Management of Electronic Packaging
Author: Xingcun Colin Tong
Publisher: Springer Science & Business Media
Total Pages: 633
Release: 2011-01-05
Genre: Technology & Engineering
ISBN: 1441977597

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Handbook of Electronic Package Design

Handbook of Electronic Package Design
Author: Michael Pecht
Publisher: CRC Press
Total Pages: 904
Release: 2018-10-24
Genre: Technology & Engineering
ISBN: 1351838415

Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development

Handbook of Optoelectronics (Two-Volume Set)

Handbook of Optoelectronics (Two-Volume Set)
Author: John P. Dakin
Publisher: CRC Press
Total Pages: 1616
Release: 2010-12-12
Genre: Technology & Engineering
ISBN: 1420012010

A field as diverse as optoelectronics needs a reference that is equally versatile. From basic physics and light sources to devices and state-of-the-art applications, the Handbook of Optoelectronics provides comprehensive, self-contained coverage of fundamental concepts and practical applications across the entire spectrum of disciplines encompassed by optoelectronics. The handbook unifies a broad array of current research areas with a forward-looking focus on systems and applications. Beginning with an introduction to the relevant principles of physics, materials science, engineering, and optics, the book explores the details of optoelectronic devices and techniques including semiconductor lasers, optical detectors and receivers, optical fiber devices, modulators, amplifiers, integrated optics, LEDs, and engineered optical materials. Applications and systems then become the focus, with sections devoted to industrial, medical, and commercial applications, communications, imaging and displays, sensing and data processing, spectroscopic analysis, the art of practical optoelectronics, and future prospects. This extensive resource comprises the efforts of more than 70 world-renowned experts from leading industrial and academic institutions around the world and includes many references to contemporary works. Whether used as a field reference, as a research tool, or as a broad and self-contained introduction to the field, the Handbook of Optoelectronics places everything you need in a unified, conveniently organized format.

Materials for Advanced Packaging

Materials for Advanced Packaging
Author: Daniel Lu
Publisher: Springer
Total Pages: 974
Release: 2016-11-18
Genre: Technology & Engineering
ISBN: 3319450980

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Power Electronic Packaging

Power Electronic Packaging
Author: Yong Liu
Publisher: Springer Science & Business Media
Total Pages: 606
Release: 2012-02-15
Genre: Technology & Engineering
ISBN: 1461410533

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Data Center Handbook

Data Center Handbook
Author: Hwaiyu Geng
Publisher: John Wiley & Sons
Total Pages: 720
Release: 2014-12-01
Genre: Computers
ISBN: 1118937589

Provides the fundamentals, technologies, and best practices in designing, constructing and managing mission critical, energy efficient data centers Organizations in need of high-speed connectivity and nonstop systems operations depend upon data centers for a range of deployment solutions. A data center is a facility used to house computer systems and associated components, such as telecommunications and storage systems. It generally includes multiple power sources, redundant data communications connections, environmental controls (e.g., air conditioning, fire suppression) and security devices. With contributions from an international list of experts, The Data Center Handbook instructs readers to: Prepare strategic plan that includes location plan, site selection, roadmap and capacity planning Design and build "green" data centers, with mission critical and energy-efficient infrastructure Apply best practices to reduce energy consumption and carbon emissions Apply IT technologies such as cloud and virtualization Manage data centers in order to sustain operations with minimum costs Prepare and practice disaster reovery and business continuity plan The book imparts essential knowledge needed to implement data center design and construction, apply IT technologies, and continually improve data center operations.