Advanced Packaging Materials
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| Author | : Daniel Lu |
| Publisher | : Springer |
| Total Pages | : 974 |
| Release | : 2016-11-18 |
| Genre | : Technology & Engineering |
| ISBN | : 3319450980 |
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
| Author | : Roby Jose Ciiju |
| Publisher | : AGRIHORTICO |
| Total Pages | : 63 |
| Release | : 2021-03-18 |
| Genre | : Technology & Engineering |
| ISBN | : |
The book begins with a short narration of current packaging practices followed by present day horticulture industry. After pointing out the disadvantages of some of the current practices, the author categorically states that we do not need to religiously follow traditional packaging practices if we are serious about curtailing the supply chain loss of fruits and vegetables. The author goes on listing out various types of packaging materials that are available today before addressing the major theme of the book, i.e. ‘Modern Innovations in Packaging Materials and Packaging Technologies’. MAP films, MIP films and active and intelligent packing materials are described in detail under this topic. Manufacturing process of polymer-based packing materials is also described for the better understanding of the reader. The author then elaborates on how to select a suitable packing material for your horticultural produce. Major two parameters that are to be considered are packing material properties and product-specific properties. The author makes a reference of various packaging designs and packaging standards also for those who are interested in these topics. According to the author advanced packaging technologies such as modified atmosphere packaging, modified interactive packaging, active and intelligent packaging, TBG technology and packaging technology for microwaveable containers are going to make a big difference in the way how highly perishable fruits and vegetables are packed and consumed. Finally, the author gives a short narration of various types of packaging machines that are available today and also lists out major global suppliers of packaging solutions for horticulture industry.
| Author | : John H. Lau |
| Publisher | : Springer Nature |
| Total Pages | : 513 |
| Release | : 2021-05-17 |
| Genre | : Technology & Engineering |
| ISBN | : 9811613761 |
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
| Author | : Xingcun Colin Tong |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 633 |
| Release | : 2011-01-05 |
| Genre | : Technology & Engineering |
| ISBN | : 1441977597 |
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
| Author | : Shakeel Ahmed |
| Publisher | : Springer |
| Total Pages | : 305 |
| Release | : 2018-11-05 |
| Genre | : Technology & Engineering |
| ISBN | : 981131909X |
This book provides an overview of the lastest developments in biobased materials and their applications in food packaging. Written by experts in their respective research domain, its thirteen chapters discuss in detail fundamental knowledge on bio based materials. It is intended as a reference book for researchers, students, research scholars, academicians and scientists seeking biobased materials for food packaging applications.
| Author | : Andrea Chen |
| Publisher | : CRC Press |
| Total Pages | : 216 |
| Release | : 2016-04-19 |
| Genre | : Technology & Engineering |
| ISBN | : 1439862079 |
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
| Author | : Ho-Ming Tong |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 562 |
| Release | : 2013-03-20 |
| Genre | : Technology & Engineering |
| ISBN | : 1441957685 |
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
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| Total Pages | : |
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| Author | : Kit L. Yam |
| Publisher | : John Wiley & Sons |
| Total Pages | : 1368 |
| Release | : 2010-01-05 |
| Genre | : Technology & Engineering |
| ISBN | : 0470541385 |
The complete and authoritative guide to modern packaging technologies —updated and expanded From A to Z, The Wiley Encyclopedia of Packaging Technology, Third Edition covers all aspects of packaging technologies essential to the food and pharmaceutical industries, among others. This edition has been thoroughly updated and expanded to include important innovations and changes in materials, processes, and technologies that have occurred over the past decade. It is an invaluable resource for packaging technologists, scientists and engineers, students and educators, packaging material suppliers, packaging converters, packaging machinery manufacturers, processors, retailers, and regulatory agencies. In addition to updating and improving articles from the previous edition, new articles are also added to cover the recent advances and developments in packaging. Content new to this edition includes: Advanced packaging materials such as antimicrobial materials, biobased materials, nanocomposite materials, ceramic-coated films, and perforated films Advanced packaging technologies such as active and intelligent packaging, radio frequency identification (RFID), controlled release packaging, smart blending, nanotechnology, biosensor technology, and package integrity inspection Various aspects important to packaging such as sustainable packaging, migration, lipid oxidation, light protection, and intellectual property Contributions from experts in all-important aspects of packaging Extensive cross-referencing and easy-to-access information on all subjects Large, double-column format for easy reference
| Author | : Beth Keser |
| Publisher | : John Wiley & Sons |
| Total Pages | : 576 |
| Release | : 2019-02-12 |
| Genre | : Technology & Engineering |
| ISBN | : 1119314135 |
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
