Advanced Characterization Of Clear Chip Seals
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| Author | : Emiliano Pasquini |
| Publisher | : |
| Total Pages | : 16 |
| Release | : 2014 |
| Genre | : Aggregate retention |
| ISBN | : |
Chip seals are widely used throughout the world for the construction and preventive maintenance of asphalt pavements because they are recognized as cost-effective solutions able to improve skid resistance while creating a waterproof surface. On the other hand, chip seals are often affected by early stone loss because of several, not always easily manageable, material-related and traffic-related factors. It is, therefore, in the interest of researchers to develop scientific methods able to predict the aggregate retention performance of chip seals. Given this background, in the present paper, a performance-based evaluation of chip seals with regard to aggregate retention properties is carried out through a laboratory test based on the Ancona shear testing research and analysis equipment. In this study, a chip seal prepared with a clear emulsion derived by emulsifying a synthetic clear binder was analyzed and compared with two traditional chip seals manufactured with a plain cationic bituminous emulsion and a styrene butadiene styrene polymer-modified asphalt emulsion, respectively. Specifically, six chip seals obtained by combining the three selected emulsions with two types of aggregates (crushed limestone and basalt) were tested at three different temperatures. Moreover, a rheological characterization of emulsion residues was also carried out through the dynamic shear rheometer and the binder bond strength adhesion tester. Results mainly showed that the investigated clear synthetic emulsion can be successfully used for the construction of clear chip seals in combination with aggregates of different mineralogy.
| Author | : Francesco Canestrari |
| Publisher | : Springer |
| Total Pages | : 1024 |
| Release | : 2015-09-24 |
| Genre | : Technology & Engineering |
| ISBN | : 9401773424 |
This work presents the results of RILEM TC 237-SIB (Testing and characterization of sustainable innovative bituminous materials and systems). The papers have been selected for publication after a rigorous peer review process and will be an invaluable source to outline and clarify the main directions of present and future research and standardization for bituminous materials and pavements. The following topics are covered: - Characterization of binder-aggregate interaction - Innovative testing of bituminous binders, additives and modifiers - Durability and aging of asphalt pavements - Mixture design and compaction analysis - Environmentally sustainable materials and technologies - Advances in laboratory characterization of bituminous materials - Modeling of road materials and pavement performance prediction - Field measurement and in-situ characterization - Innovative materials for reinforcement and interlayer systems - Cracking and damage characterization of asphalt pavements - Recycling and re-use in road pavements This is the proceedings of the RILEM SIB2015 Symposium (Ancona, Italy, October 7-9, 2015).
| Author | : Douglas D. Gransberg |
| Publisher | : Transportation Research Board |
| Total Pages | : 120 |
| Release | : 2005 |
| Genre | : Asphalt emulsion mixtures |
| ISBN | : 0309097444 |
TRB's National Cooperative Highway Research Program (NCHRP) Synthesis 342: Chip Seal Best Practices examines ways to assist in the development and implementation of pavement preservation programs by identifying the benefits of using chip seal as part of a preventive maintenance program and by highlighting advanced chip seal programs in use around the world. The report includes approximately 40 best practices in the areas of chip seal design methods, contract administration, equipment practices, construction practices, and performance measures. According to the report, the increased use of chip seals for maintenance can be a successful, cost-effective way of using preventive maintenance to preserve both low-volume and higher-volume pavements.
| Author | : Kay Fitzpatrick |
| Publisher | : |
| Total Pages | : 246 |
| Release | : 2001 |
| Genre | : Low-volume roads |
| ISBN | : |
| Author | : Begül Bilgin |
| Publisher | : Springer |
| Total Pages | : 210 |
| Release | : 2019-03-06 |
| Genre | : Computers |
| ISBN | : 3030154629 |
This book constitutes the thoroughly refereed post-conference proceedings of the 17th International Conference on Smart Card Research and Advanced Applications, CARDIS 2018, held in Monpellier, France, in November 2018. The 13 revised full papers presented in this book were carefully reviewed and selected from 28 submissions. CARDIS has provided a space for security experts from industry and academia to exchange on security of smart cards and related applications.
| Author | : Richard K. Ulrich |
| Publisher | : John Wiley & Sons |
| Total Pages | : 852 |
| Release | : 2006-02-24 |
| Genre | : Technology & Engineering |
| ISBN | : 0471466093 |
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
| Author | : Dieter K. Schroder |
| Publisher | : John Wiley & Sons |
| Total Pages | : 800 |
| Release | : 2015-06-29 |
| Genre | : Technology & Engineering |
| ISBN | : 0471739065 |
This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Not only does the Third Edition set forth all the latest measurement techniques, but it also examines new interpretations and new applications of existing techniques. Semiconductor Material and Device Characterization remains the sole text dedicated to characterization techniques for measuring semiconductor materials and devices. Coverage includes the full range of electrical and optical characterization methods, including the more specialized chemical and physical techniques. Readers familiar with the previous two editions will discover a thoroughly revised and updated Third Edition, including: Updated and revised figures and examples reflecting the most current data and information 260 new references offering access to the latest research and discussions in specialized topics New problems and review questions at the end of each chapter to test readers' understanding of the material In addition, readers will find fully updated and revised sections in each chapter. Plus, two new chapters have been added: Charge-Based and Probe Characterization introduces charge-based measurement and Kelvin probes. This chapter also examines probe-based measurements, including scanning capacitance, scanning Kelvin force, scanning spreading resistance, and ballistic electron emission microscopy. Reliability and Failure Analysis examines failure times and distribution functions, and discusses electromigration, hot carriers, gate oxide integrity, negative bias temperature instability, stress-induced leakage current, and electrostatic discharge. Written by an internationally recognized authority in the field, Semiconductor Material and Device Characterization remains essential reading for graduate students as well as for professionals working in the field of semiconductor devices and materials. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department.
| Author | : Xingcun Colin Tong |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 633 |
| Release | : 2011-01-05 |
| Genre | : Technology & Engineering |
| ISBN | : 1441977597 |
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
| Author | : Stepan Lucyszyn |
| Publisher | : Cambridge University Press |
| Total Pages | : 441 |
| Release | : 2010-08-19 |
| Genre | : Technology & Engineering |
| ISBN | : 1139491660 |
An up-to-date guide to the theory and applications of RF MEMS. With detailed information about RF MEMS technology as well as its reliability and applications, this is a comprehensive resource for professionals, researchers, and students alike. • Reviews RF MEMS technologies • Illustrates new techniques that solve long-standing problems associated with reliability and packaging • Provides the information needed to incorporate RF MEMS into commercial products • Describes current and future trends in RF MEMS, providing perspective on industry growth • Ideal for those studying or working in RF and microwave circuits, systems, microfabrication and manufacturing, production management and metrology, and performance evaluation
| Author | : |
| Publisher | : Elsevier |
| Total Pages | : 555 |
| Release | : 2015-03-17 |
| Genre | : Technology & Engineering |
| ISBN | : 1782422358 |
Nano-scale materials have unique electronic, optical, and chemical properties which make them attractive for a new generation of devices. Part one of Modeling, Characterization, and Production of Nanomaterials: Electronics, Photonics and Energy Applications covers modeling techniques incorporating quantum mechanical effects to simulate nanomaterials and devices, such as multiscale modeling and density functional theory. Part two describes the characterization of nanomaterials using diffraction techniques and Raman spectroscopy. Part three looks at the structure and properties of nanomaterials, including their optical properties and atomic behaviour. Part four explores nanofabrication and nanodevices, including the growth of graphene, GaN-based nanorod heterostructures and colloidal quantum dots for applications in nanophotonics and metallic nanoparticles for catalysis applications. Comprehensive coverage of the close connection between modeling and experimental methods for studying a wide range of nanomaterials and nanostructures Focus on practical applications and industry needs, supported by a solid outlining of theoretical background Draws on the expertise of leading researchers in the field of nanomaterials from around the world
