A Computer Aided Design Methodology For Printed Circuit Boards
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| Author | : Simon Monk |
| Publisher | : McGraw Hill Professional |
| Total Pages | : 270 |
| Release | : 2014-08-05 |
| Genre | : Technology & Engineering |
| ISBN | : 0071819266 |
Design custom printed circuit boards with EAGLE Learn how to make double-sided professional-quality PCBs from the ground up using EAGLE--the powerful, flexible design software. In this step-by-step guide, electronics guru Simon Monk leads you through the process of designing a schematic, transforming it into a PCB layout, and submitting standard Gerber files to a manufacturing service to create your finished board. Filled with detailed illustrations, photos, and screenshots, Make Your Own PCBs with EAGLE features downloadable example projects so you can get started right away. Install EAGLE Light Edition and discover the views and screens that make up an EAGLE project Create the schematic and board files for a simple LED project Find the right components and libraries for your projects Work with the Schematic Editor Lay out PCBs with through-hole components and with surface mount technology Build a sound level meter with a small amplifier and ten LEDs Generate Gerber design files to submit for fabrication Solder through-hole PCBs and SMD boards Design a plug-in Arduino shield Build a Raspberry Pi expansion board Automate repetitive tasks using scripts and User Language Programs Create your own libraries and parts and modify existing components
| Author | : Chris Schroeder |
| Publisher | : Newnes |
| Total Pages | : 342 |
| Release | : 1998 |
| Genre | : Computers |
| ISBN | : 9780750698344 |
Introduction to PCB Design * Schematic Drafting * Single-Sided PCB Design * Double-Sided PCB Design * Surface Mount PCB Design * Importing Gerber Files for Manufacturing Documentation * Importing HPGL Files for Manufacturing Documentation * Importing Gerber Artwork Files for Viewing * Importing Excellon Format NC Drill Data * Converting HPGL to Gerber Format * Appendix A: Gerber Format * Appendix B: Excellon Format * Appendix C: HPGL Format * Appendix D: Information about the Disk Supplied with the Book * Index.
| Author | : Kraig Mitzner |
| Publisher | : Elsevier |
| Total Pages | : 529 |
| Release | : 2011-04-01 |
| Genre | : Technology & Engineering |
| ISBN | : 0080549209 |
Complete PCB Design Using OrCad Capture and Layout provides instruction on how to use the OrCAD design suite to design and manufacture printed circuit boards. The book is written for both students and practicing engineers who need a quick tutorial on how to use the software and who need in-depth knowledge of the capabilities and limitations of the software package. There are two goals the book aims to reach: The primary goal is to show the reader how to design a PCB using OrCAD Capture and OrCAD Layout. Capture is used to build the schematic diagram of the circuit, and Layout is used to design the circuit board so that it can be manufactured. The secondary goal is to show the reader how to add PSpice simulation capabilities to the design, and how to develop custom schematic parts, footprints and PSpice models. Often times separate designs are produced for documentation, simulation and board fabrication. This book shows how to perform all three functions from the same schematic design. This approach saves time and money and ensures continuity between the design and the manufactured product. - Information is presented in the exact order a circuit and PCB are designed - Straightforward, realistic examples present the how and why the designs work, providing a comprehensive toolset for understanding the OrCAD software - Introduction to the IPC, JEDEC, and IEEE standards relating to PCB design - Full-color interior and extensive illustrations allow readers to learn features of the product in the most realistic manner possible
| Author | : Kraig Mitzner |
| Publisher | : Newnes |
| Total Pages | : 488 |
| Release | : 2009-05-28 |
| Genre | : Computers |
| ISBN | : 0080943543 |
This book provides instruction on how to use the OrCAD design suite to design and manufacture printed circuit boards. The primary goal is to show the reader how to design a PCB using OrCAD Capture and OrCAD Editor. Capture is used to build the schematic diagram of the circuit, and Editor is used to design the circuit board so that it can be manufactured. The book is written for both students and practicing engineers who need in-depth instruction on how to use the software, and who need background knowledge of the PCB design process. - Beginning to end coverage of the printed circuit board design process. Information is presented in the exact order a circuit and PCB are designed - Over 400 full color illustrations, including extensive use of screen shots from the software, allow readers to learn features of the product in the most realistic manner possible - Straightforward, realistic examples present the how and why the designs work, providing a comprehensive toolset for understanding the OrCAD software - Introduces and follows IEEE, IPC, and JEDEC industry standards for PCB design. - Unique chapter on Design for Manufacture covers padstack and footprint design, and component placement, for the design of manufacturable PCB's - FREE CD containing the OrCAD demo version and design files
| Author | : Edward Chikuni |
| Publisher | : European Alliance for Innovation |
| Total Pages | : 486 |
| Release | : 2018-06-04 |
| Genre | : Education |
| ISBN | : 1631901605 |
The Conference Theme was: "Moving Africa forward through Engineering, Technology and Innovation". The conference brought together academics, researchers and industrialists from many disciplines, in particular those that have the most impact on Africa's Development. Most conferences on the continent have covered limited disciplines and therefore the opportunity has been lost sharing information, results and knowledge in a way which can solve the many contentious issues, most of which can be solved through a multidisciplinary approach.
| Author | : Frank Riley |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 576 |
| Release | : 2013-06-29 |
| Genre | : Technology & Engineering |
| ISBN | : 3662131617 |
The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.
| Author | : Raymond H. Clark |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 622 |
| Release | : 2012-12-06 |
| Genre | : Science |
| ISBN | : 9401170126 |
Of all the components that go into electronic equipment, the printed circuit probably requires more manufacturing operations-each of which must be per formed by a skilled person-than any other. As a shift supervisor early in my printed circuit career, I had to hire and train personnel for all job functions. The amount of responsibility delegated to my subordinates depended strictly on how well I had been able to train them. Training people can be a trying experience and is always a time-consuming one. It behooved me to help my workers obtain the highest degree of job under standing and skill that they and I were capable of. One hindrance to effective teaching is poor continuity of thought, for example, having to say to a trainee, "Wait a minute; forget what I just told you. We have to go back and do some thing else first. " It was in trying to avoid pitfalls such as this that I undertook a detailed examination of the processes involved, what I thought each trainee had to know, and what questions they would most frequently ask. From this analysis I developed the various process procedures. Only after I had done so was I able to train effectively and with the confidence that I was doing the best possible job. Answers had to be at hand for all of their questions and in what ever detail they needed to know.
| Author | : |
| Publisher | : |
| Total Pages | : 702 |
| Release | : 1995 |
| Genre | : Aeronautics |
| ISBN | : |
| Author | : |
| Publisher | : |
| Total Pages | : 410 |
| Release | : 1984-04-03 |
| Genre | : |
| ISBN | : |
PCMag.com is a leading authority on technology, delivering Labs-based, independent reviews of the latest products and services. Our expert industry analysis and practical solutions help you make better buying decisions and get more from technology.
| Author | : |
| Publisher | : ASM International |
| Total Pages | : 1234 |
| Release | : 1989-11-01 |
| Genre | : Technology & Engineering |
| ISBN | : 9780871702852 |
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
