3d Networks On Chip Architecture Optimization For Low Power Design
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| Author | : Opoku Agyeman Michael |
| Publisher | : LAP Lambert Academic Publishing |
| Total Pages | : 180 |
| Release | : 2015-07-13 |
| Genre | : |
| ISBN | : 9783659758133 |
Three dimensional Networks-on-Chip (3D NoCs) have attracted a growing interest to solve on-chip communication demands of future multi-core embedded systems. However, 3D NoCs have not been completely accepted into the mainstream due to issues such as the high cost and complexity of manufacturing 3D vertical wires, larger memory, area and power consumption of 3D NoC components than that of conventional 2D NoC. This thesis aims at optimizing 3D NoCs by modeling and evaluating alternate NoC topologies, routing algorithms and mapping techniques to achieve optimized area, power and performance parameters (latency and throughput). Particularly, novel 3D NoC router architectures and their possible combinations have been investigated with the aim of achieving lower area and power consumption of on-chip communication components with a minimal performance trade-off. This book investigates different heterogeneous 3D NoC architectures which combine 2D and 3D routers to improve area and energy efficiency of 3D NoCs with minimal performance degradation.
| Author | : Konstantinos Tatas |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 271 |
| Release | : 2013-10-08 |
| Genre | : Technology & Engineering |
| ISBN | : 1461442745 |
This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.
| Author | : Cristina Silvano |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 301 |
| Release | : 2010-09-24 |
| Genre | : Technology & Engineering |
| ISBN | : 144196911X |
In recent years, both Networks-on-Chip, as an architectural solution for high-speed interconnect, and power consumption, as a key design constraint, have continued to gain interest in the design and research communities. This book offers a single-source reference to some of the most important design techniques proposed in the context of low-power design for networks-on-chip architectures.
| Author | : Sung Kyu Lim |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 573 |
| Release | : 2012-11-27 |
| Genre | : Technology & Engineering |
| ISBN | : 1441995420 |
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.
| Author | : Santanu Kundu |
| Publisher | : CRC Press |
| Total Pages | : 392 |
| Release | : 2018-09-03 |
| Genre | : Technology & Engineering |
| ISBN | : 1351831968 |
Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems.
| Author | : Lennart Bamberg |
| Publisher | : Springer Nature |
| Total Pages | : 403 |
| Release | : 2022-06-27 |
| Genre | : Technology & Engineering |
| ISBN | : 3030982297 |
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.
| Author | : Michael Opoku Agyeman |
| Publisher | : |
| Total Pages | : |
| Release | : 2014 |
| Genre | : |
| ISBN | : |
| Author | : Dongjin Lee |
| Publisher | : |
| Total Pages | : 132 |
| Release | : 2018 |
| Genre | : Networks on a chip |
| ISBN | : |
High-performance and energy-efficient Network-on-Chip (NoC) architecture is one of the crucial components of the manycore processing platforms. A very promising NoC architecture recently proposed in the literature is the three-dimensional small-world NoC (3D SWNoC). Due to short vertical links in 3D integration and the robustness of small-world networks, the 3D SWNoC architecture outperforms its other 3D counterparts. However, the performance of 3D SWNoC is highly dependent on the placement of the links and associated routers. In this dissertation, we propose a sensitivity-based link placement algorithm (SEN) to optimize the performance of 3D SWNoC. The sensitivity of a link in a NoC measures the importance of the link. The SEN algorithm optimizes the performance of 3D SWNoC by calculating the sensitivities of all the links in the NoC and removing the least important link repeatedly. We compare the performance of SEN algorithm with simulated annealing and machine learning-based optimization algorithm. 3D NoC architectures suffer from high power density and the resultant thermal hotspots leading to functionality and reliability concerns over time. The power consumption and thermal profiles of 3D NoCs can be improved by incorporating a Voltage-Frequency Island (VFI)-based power management and Reciprocal Design Symmetry (RDS)-based floor planning. We undertake a detailed design space exploration for 3D NoC by considering power-thermal-performance trade-offs. We consider a small-world network-enabled 3D NoC in this performance evaluation due to its superior performance and energy-efficiency compared to other existing 3D NoC. For TSV-based systems, high power density and the resultant thermal hotspot remain major concerns from the perspectives of chip functionality and overall reliability. Due to inherent thermal constraints of a TSV-based 3D system, we are unable to fully exploit the benefits offered by the power management methodology. In this context, emergence of monolithic 3D (M3D) integration has opened new possibility of designing ultra-low-power and high-performance circuits and systems. The smaller dimensions of the inter-layer dielectric and monolithic inter-tier vias offer high-density integration, flexibility of partitioning logic blocks across multiple tiers, and significant reduction of total wire-length. We present a comparative performance evaluation of M3D NoCs with respect to their conventional TSV-based counterparts.
| Author | : Umit Y. Ogras |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 182 |
| Release | : 2013-03-12 |
| Genre | : Technology & Engineering |
| ISBN | : 9400739583 |
Traditionally, design space exploration for Systems-on-Chip (SoCs) has focused on the computational aspects of the problem at hand. However, as the number of components on a single chip and their performance continue to increase, the communication architecture plays a major role in the area, performance and energy consumption of the overall system. As a result, a shift from computation-based to communication-based design becomes mandatory. Towards this end, network-on-chip (NoC) communication architectures have emerged recently as a promising alternative to classical bus and point-to-point communication architectures. In this dissertation, we study outstanding research problems related to modeling, analysis and optimization of NoC communication architectures. More precisely, we present novel design methodologies, software tools and FPGA prototypes to aid the design of application-specific NoCs.
| Author | : Chrysostomos Nicopoulos |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 237 |
| Release | : 2009-09-18 |
| Genre | : Technology & Engineering |
| ISBN | : 904813031X |
[2]. The Cell Processor from Sony, Toshiba and IBM (STI) [3], and the Sun UltraSPARC T1 (formerly codenamed Niagara) [4] signal the growing popularity of such systems. Furthermore, Intel’s very recently announced 80-core TeraFLOP chip [5] exemplifies the irreversible march toward many-core systems with tens or even hundreds of processing elements. 1.2 The Dawn of the Communication-Centric Revolution The multi-core thrust has ushered the gradual displacement of the computati- centric design model by a more communication-centric approach [6]. The large, sophisticated monolithic modules are giving way to several smaller, simpler p- cessing elements working in tandem. This trend has led to a surge in the popularity of multi-core systems, which typically manifest themselves in two distinct incarnations: heterogeneous Multi-Processor Systems-on-Chip (MPSoC) and homogeneous Chip Multi-Processors (CMP). The SoC philosophy revolves around the technique of Platform-Based Design (PBD) [7], which advocates the reuse of Intellectual Property (IP) cores in flexible design templates that can be customized accordingly to satisfy the demands of particular implementations. The appeal of such a modular approach lies in the substantially reduced Time-To- Market (TTM) incubation period, which is a direct outcome of lower circuit complexity and reduced design effort. The whole system can now be viewed as a diverse collection of pre-existing IP components integrated on a single die.
