2nd International Conference On Industrial Applications Of Adhesives 2022
Download 2nd International Conference On Industrial Applications Of Adhesives 2022 full books in PDF, epub, and Kindle. Read online free 2nd International Conference On Industrial Applications Of Adhesives 2022 ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Author | : Lucas F. M. da Silva |
Publisher | : Springer Nature |
Total Pages | : 155 |
Release | : 2022-11-15 |
Genre | : Technology & Engineering |
ISBN | : 3031111508 |
This book provides selected papers presented at the 2nd International Conference on Industrial Applications of Adhesives 2022, held in Carvoeiro, Portugal, 3-4 March 2022. The volume focuses on applications of adhesive bonding in the industry such as automotive, aeronautic, railway, marine, energy, and electronics. A wide range of topics like adhesion assessment between polymers and metals, pressure sensitive adhesives, adhesive bonding process optimization, civil applications, adhesive joints in composite materials and elastic adhesives are covered. The book presents the latest results and innovations in this field, useful for adhesive producers and adhesive users.
Author | : Lucas F. M. da Silva |
Publisher | : Springer Nature |
Total Pages | : 127 |
Release | : |
Genre | : |
ISBN | : 3031695038 |
Author | : Shin Horiuchi |
Publisher | : Springer Nature |
Total Pages | : 368 |
Release | : 2023-10-26 |
Genre | : Technology & Engineering |
ISBN | : 9819944562 |
This open access book reviews the recent research achievements of the investigation of interfacial phenomena in polymer/polymer and polymer/metal joint interfaces with the state-of-the-art analytical techniques not previously used in the field of adhesion and bonding. Adhesion performance is determined not only by the two-dimensional interfaces but also by a three-dimensional (3D) region having different properties and structural characteristics that extends into the bulk materials. In this book, the authors also discuss in detail the bonding mechanism by characterizing such 3D regions called “interphase”. The book is of great interest to researchers and engineers devoted to adhesion science and technology. Videos via app: download the SN More Media app for free, scan an image or a link with play button, and access videos directly on your smartphone or tablet.
Author | : Mohammad Jawaid |
Publisher | : Springer Nature |
Total Pages | : 201 |
Release | : 2022-11-24 |
Genre | : Science |
ISBN | : 9811961956 |
This book presents the selected papers presented at the 2nd World Conference on Byproducts of Palms and their Applications (ByPalma 2021), held as a virtual conference on September 28–30, 2021. The conference focused on the byproducts of palm plantations around the globe and their current and potential applications. It provided an interdisciplinary platform for leading academic scientists, researchers, artisans, entrepreneurs and industry professionals as well as palm growers to exchange recent developments, technologies, innovations, trends, concerns, challenges, and opportunities, related to palm by-products R&D, manufacturing, and crafts. As a reference, it will be of interest to students, scientists, engineers, government officials, and industrial practitioners.
Author | : Sanjay Misra |
Publisher | : Springer Nature |
Total Pages | : 341 |
Release | : 2022-01-22 |
Genre | : Computers |
ISBN | : 303095630X |
This volume constitutes selected papers presented at the First International Conference on Informatics and Intelligent Applications, ICIIA 2021, held in Ota, Nigeria, in November 2021. The 22 full papers were thoroughly reviewed and selected from 108 submissions. The papers are organized in the following topical sections: AI applications; information security; emerging technologies in informatics.
Author | : Lucas F. M. da Silva |
Publisher | : Springer Nature |
Total Pages | : 150 |
Release | : 2023-03-24 |
Genre | : Education |
ISBN | : 3031254015 |
This volume of the series Proceedings in Engineering Mechanics - Research, Technology and Education provides selected papers presented at the 3rd International Conference on Science and Technology Education, held in Porto, Portugal, October 6-7, 2022. From the various topics covered at this conference, individual contributions have been selected for this book. These contributions focus on learning mechanisms, learning systems and assessment. The book presents the latest trends, new methods and ideas in science and technology education. An essential resource for lecturers and tutors working in this field.
Author | : Lucas F. M. da Silva |
Publisher | : Springer Nature |
Total Pages | : 149 |
Release | : 2023-12-11 |
Genre | : Science |
ISBN | : 3031483634 |
This book gathers selected contributions of the 7th international conference on structural adhesive bonding AB 2023, held in Porto, Portugal, July 13–14, 2023. The book provides the latest trends and developments related to structural bonding. Topics like adhesive formulation and properties, adhesion and surface treatments, joint design, and durability of structural adhesive joints are covered. This book offers a wealth of information for researchers, students and engineers in industry.
Author | : Lucas F. M. da Silva |
Publisher | : Springer Nature |
Total Pages | : 144 |
Release | : 2020-07-22 |
Genre | : Science |
ISBN | : 9811567670 |
This book gathers selected papers presented at the 1st International Conference on Industrial Applications of Adhesives 2020 (IAA 2020). It covers a wide range of topics, including adhesive curing for electronic and automotive industries; adhesive testing with a torsion machine for rigorous mechanical properties determination; joint design using innovative techniques such as the meshless method; design methodologies in the automotive industry for joints under impact; temperature effects in joints typically found in civil engineering; and advanced nondestructive techniques such as terahertz spectroscopy to assess the durability of adhesive joints. Providing a review of the state-of the art in industrial applications of adhesives, the book serves as a valuable reference resource for researchers and graduate students interested in adhesive bonding.
Author | : A. Nayyar |
Publisher | : IOS Press |
Total Pages | : 278 |
Release | : 2022-11-29 |
Genre | : Technology & Engineering |
ISBN | : 1643683519 |
Smart manufacturing is a broad category of manufacturing that employs computer-integration, high levels of adaptability and rapid design changes, together with digital information technology and a technically-trained workforce. This book presents the proceedings of SMMP2022, the 2022 International Conference on Smart Manufacturing and Material Processing, held on 12 and 13 August 2022 as a virtual event due to continuing restrictions related to the COVID-19 pandemic, and hosted from Shanghai, China. The conference provides a platform for researchers and scientists from smart manufacturing and material sciences to come together with researchers from various other application areas to discuss problems and solutions, identify new issues, and shape future directions for research. The conference received 60 submissions. These were submitted to a rigorous peer review process by a committee of experts from various disciplines, after which, 23 were accepted for presentation at the conference and publication here. The topics covered include materials processing and product manufacture, sensors and smart material systems, functional materials, industrial automation and process control, and discussion of the state-of-the-art and future direction of smart manufacturing and material sciences. Providing an overview of current developments in smart manufacturing and material processing, the book will be of interest to all those working in the field.
Author | : Filippo Sanfilippo |
Publisher | : Springer Nature |
Total Pages | : 436 |
Release | : 2022-07-22 |
Genre | : Computers |
ISBN | : 3031105257 |
This book constitutes the refereed proceedings of the 4th International Conference on Intelligent Technologies and Applications, INTAP 2021, held in Grimstad, Norway, October 11–13, 2021. The 33 full papers included in this book were carefully reviewed and selected from 243 submissions. They were organized in topical sections as follows: Intelligence, Decision support systems, IoT; Robotics; ML and AI for Intelligent Health, Applications of intelligent technologies in Emergency Management; Smart Electrical Energy Systems, AI and ML in Security; ML and AI for sensing technologies, Social Media Analytics; ML in energy sectors and materials; and Miscellaneous.