2017 33rd Thermal Measurement Modeling And Management Symposium Semi Therm
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Author | : IEEE Staff |
Publisher | : |
Total Pages | : |
Release | : 2017-03-13 |
Genre | : |
ISBN | : 9781538615324 |
SEMI THERM provides a forum for engineers, academics, and executives to learn, exchange ideas, and display the latest in thermal management techniques, products and services Attendees include anyone interested in thermal design, management and characterization of electronic systems and components
Author | : Paul Wesling |
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Total Pages | : |
Release | : 2017 |
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ISBN | : 9781538615317 |
Author | : IEEE Staff |
Publisher | : |
Total Pages | : |
Release | : 2018-03-19 |
Genre | : |
ISBN | : 9781538644034 |
Semiconductor thermal management and modeling
Author | : Marta Rencz |
Publisher | : Springer Nature |
Total Pages | : 389 |
Release | : 2023-01-23 |
Genre | : Technology & Engineering |
ISBN | : 3030861740 |
This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.
Author | : IEEE Staff |
Publisher | : |
Total Pages | : |
Release | : 2016-03-14 |
Genre | : |
ISBN | : 9781509023370 |
Dedicated topics include 3D electronic packaging, CFD modeling, Data Centers, energy harvesting, high heat flux cooling, LEDs, thermal measurement & characterization, thermal reliability, medical & consumer electronics, and more
Author | : |
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Release | : 2015 |
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ISBN | : 9781479986002 |
Author | : |
Publisher | : |
Total Pages | : 251 |
Release | : 2014 |
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ISBN | : 9781479943746 |
Author | : |
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Release | : 1984 |
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Author | : Marko Tadjer |
Publisher | : Woodhead Publishing |
Total Pages | : 498 |
Release | : 2022-07-13 |
Genre | : Technology & Engineering |
ISBN | : 0128211059 |
Thermal Management of Gallium Nitride Electronics outlines the technical approaches undertaken by leaders in the community, the challenges they have faced, and the resulting advances in the field. This book serves as a one-stop reference for compound semiconductor device researchers tasked with solving this engineering challenge for future material systems based on ultra-wide bandgap semiconductors. A number of perspectives are included, such as the growth methods of nanocrystalline diamond, the materials integration of polycrystalline diamond through wafer bonding, and the new physics of thermal transport across heterogeneous interfaces. Over the past 10 years, the book's authors have performed pioneering experiments in the integration of nanocrystalline diamond capping layers into the fabrication process of compound semiconductor devices. Significant research efforts of integrating diamond and GaN have been reported by a number of groups since then, thus resulting in active thermal management options that do not necessarily lead to performance derating to avoid self-heating during radio frequency or power switching operation of these devices. Self-heating refers to the increased channel temperature caused by increased energy transfer from electrons to the lattice at high power. This book chronicles those breakthroughs. Includes the fundamentals of thermal management of wide-bandgap semiconductors, with historical context, a review of common heating issues, thermal transport physics, and characterization methods Reviews the latest strategies to overcome heating issues through materials modeling, growth and device design strategies Touches on emerging, real-world applications for thermal management strategies in power electronics
Author | : Seri Lee |
Publisher | : |
Total Pages | : 88 |
Release | : 1997 |
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