2003 International Symposium On Microelectronics
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author | : Ephraim Suhir |
Publisher | : Springer Science & Business Media |
Total Pages | : 1471 |
Release | : 2007-05-26 |
Genre | : Technology & Engineering |
ISBN | : 0387329897 |
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Ceramic Interconnect Technology Handbook
Author | : Fred D. Barlow, III |
Publisher | : CRC Press |
Total Pages | : 456 |
Release | : 2018-10-03 |
Genre | : Technology & Engineering |
ISBN | : 1420018965 |
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Low Temperature Electronics and Low Temperature Cofired Ceramic Based Electronic Devices
Author | : Electrochemical Society. Meeting |
Publisher | : The Electrochemical Society |
Total Pages | : 332 |
Release | : 2004 |
Genre | : Technology & Engineering |
ISBN | : 9781566774123 |
Advanced VLSI Design and Testability Issues
Author | : Suman Lata Tripathi |
Publisher | : CRC Press |
Total Pages | : 379 |
Release | : 2020-08-18 |
Genre | : Technology & Engineering |
ISBN | : 1000168158 |
This book facilitates the VLSI-interested individuals with not only in-depth knowledge, but also the broad aspects of it by explaining its applications in different fields, including image processing and biomedical. The deep understanding of basic concepts gives you the power to develop a new application aspect, which is very well taken care of in this book by using simple language in explaining the concepts. In the VLSI world, the importance of hardware description languages cannot be ignored, as the designing of such dense and complex circuits is not possible without them. Both Verilog and VHDL languages are used here for designing. The current needs of high-performance integrated circuits (ICs) including low power devices and new emerging materials, which can play a very important role in achieving new functionalities, are the most interesting part of the book. The testing of VLSI circuits becomes more crucial than the designing of the circuits in this nanometer technology era. The role of fault simulation algorithms is very well explained, and its implementation using Verilog is the key aspect of this book. This book is well organized into 20 chapters. Chapter 1 emphasizes on uses of FPGA on various image processing and biomedical applications. Then, the descriptions enlighten the basic understanding of digital design from the perspective of HDL in Chapters 2β5. The performance enhancement with alternate material or geometry for silicon-based FET designs is focused in Chapters 6 and 7. Chapters 8 and 9 describe the study of bimolecular interactions with biosensing FETs. Chapters 10β13 deal with advanced FET structures available in various shapes, materials such as nanowire, HFET, and their comparison in terms of device performance metrics calculation. Chapters 14β18 describe different application-specific VLSI design techniques and challenges for analog and digital circuit designs. Chapter 19 explains the VLSI testability issues with the description of simulation and its categorization into logic and fault simulation for test pattern generation using Verilog HDL. Chapter 20 deals with a secured VLSI design with hardware obfuscation by hiding the ICβs structure and function, which makes it much more difficult to reverse engineer.
Microelectronics Technology and Devices, SBMICRO 2004
Author | : Edval J. P. Santos |
Publisher | : The Electrochemical Society |
Total Pages | : 418 |
Release | : 2004 |
Genre | : Technology & Engineering |
ISBN | : 9781566774161 |
Mechanics of Microelectronics
Author | : G.Q. Zhang |
Publisher | : Springer Science & Business Media |
Total Pages | : 580 |
Release | : 2006-08-25 |
Genre | : Technology & Engineering |
ISBN | : 1402049358 |
This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Thirty-fourth International Symposium for Testing and Failure Analysis
Author | : ASM International |
Publisher | : ASM International |
Total Pages | : 551 |
Release | : 2008-01-01 |
Genre | : Electronic apparatus and appliances |
ISBN | : 1615030913 |
Mems for Automotive and Aerospace Applications
Author | : Michael Kraft |
Publisher | : Elsevier |
Total Pages | : 358 |
Release | : 2013-01-02 |
Genre | : Technology & Engineering |
ISBN | : 0857096486 |
MEMS for automotive and aerospace applications reviews the use of Micro-Electro-Mechanical-Systems (MEMS) in developing solutions to the unique challenges presented by the automotive and aerospace industries.Part one explores MEMS for a variety of automotive applications. The role of MEMS in passenger safety and comfort, sensors for automotive vehicle stability control applications and automotive tire pressure monitoring systems are considered, along with pressure and flow sensors for engine management, and RF MEMS for automotive radar sensors. Part two then goes on to explore MEMS for aerospace applications, including devices for active drag reduction in aerospace applications, inertial navigation and structural health monitoring systems, and thrusters for nano- and pico-satellites. A selection of case studies are used to explore MEMS for harsh environment sensors in aerospace applications, before the book concludes by considering the use of MEMS in space exploration and exploitation.With its distinguished editors and international team of expert contributors, MEMS for automotive and aerospace applications is a key tool for MEMS manufacturers and all scientists, engineers and academics working on MEMS and intelligent systems for transportation. - Chapters consider the role of MEMS in a number of automotive applications, including passenger safety and comfort, vehicle stability and control - MEMS for aerospace applications are also discussed, including active drag reduction, inertial navigation and structural health monitoring systems - Presents a number of case studies exploring MEMS for harsh environment sensors in aerospace