IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings].
Author | : |
Publisher | : |
Total Pages | : 194 |
Release | : 1998 |
Genre | : Electronic apparatus and appliances |
ISBN | : |
Download 1998 Ieee Cpmt 22nd International Electronics Manufacturing Technology Symposium full books in PDF, epub, and Kindle. Read online free 1998 Ieee Cpmt 22nd International Electronics Manufacturing Technology Symposium ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Author | : |
Publisher | : |
Total Pages | : 194 |
Release | : 1998 |
Genre | : Electronic apparatus and appliances |
ISBN | : |
Author | : |
Publisher | : |
Total Pages | : 370 |
Release | : 2004 |
Genre | : Electronic apparatus and appliances |
ISBN | : |
Author | : Peter Ramm |
Publisher | : John Wiley & Sons |
Total Pages | : 435 |
Release | : 2012-02-13 |
Genre | : Technology & Engineering |
ISBN | : 3527326464 |
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Author | : John Kieffer |
Publisher | : John Wiley & Sons |
Total Pages | : 290 |
Release | : 2009-09-28 |
Genre | : Technology & Engineering |
ISBN | : 0470295058 |
This volume is part of the Ceramic Engineering and Science Proceeding (CESP) series. This series contains a collection of papers dealing with issues in both traditional ceramics (i.e., glass, whitewares, refractories, and porcelain enamel) and advanced ceramics. Topics covered in the area of advanced ceramic include bioceramics, nanomaterials, composites, solid oxide fuel cells, mechanical properties and structural design, advanced ceramic coatings, ceramic armor, porous ceramics, and more.
Author | : ASM International |
Publisher | : ASM International |
Total Pages | : 593 |
Release | : 2018-12-01 |
Genre | : Technology & Engineering |
ISBN | : 1627080996 |
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Author | : British Library. Document Supply Centre |
Publisher | : |
Total Pages | : 870 |
Release | : 2003 |
Genre | : Conference proceedings |
ISBN | : |
Author | : Yoon Seok Chang |
Publisher | : Springer Science & Business Media |
Total Pages | : 525 |
Release | : 2004-03-31 |
Genre | : Business & Economics |
ISBN | : 1402078129 |
In the last half of the twentieth century industry encountered a revolutionary change brought about by the harnessed power of seemingly ever-increasing capacity, speed and functionality of computers and microprocessors. This strength provided management and workers within industries with new capabilities for management, planning and control, design, quality assurance and customer support. Organized information flow became the mainstay of industrial companies. New tools and information technology systems emerged and evolved to enable companies to integrate the various departments (Design, Procurement, Manufacturing, Sales and Finance) within companies, particularly the lager ones, including international corporations. This was to give them a chance to meet new demands for product time to market, just in time supply of orders, and customer support. To the smaller company these changes were not so apparent. Neither the tools nor systems nor indeed their economic value seemed appropriate to them except for special cases. While all this was happening the structure of the larger companies began to disintegrate. Strong competitive pressures and globalization of the market place brought this about. Shedding unwanted competence and subcontracting it to others became common practice. Regional market pressures triggered companies to reorganize to create, produce, and distribute goods and services. Greater dependency on chains of supply from external companies became the norm. Medium and smaller sized companies began to gain some advantage and at the same time some were sucked into management and control systems governed by the larger companies.
Author | : Navid Asadizanjani |
Publisher | : Springer Nature |
Total Pages | : 193 |
Release | : 2021-02-15 |
Genre | : Technology & Engineering |
ISBN | : 3030626091 |
This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.
Author | : Rajesh Gomatam |
Publisher | : CRC Press |
Total Pages | : 436 |
Release | : 2008-12-23 |
Genre | : Science |
ISBN | : 9004187820 |
With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectroni