16th Annual GaAs IC Symposium
Author | : IEEE Electron Devices Society |
Publisher | : Institute of Electrical & Electronics Engineers(IEEE) |
Total Pages | : 376 |
Release | : 1994 |
Genre | : Technology & Engineering |
ISBN | : |
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Author | : IEEE Electron Devices Society |
Publisher | : Institute of Electrical & Electronics Engineers(IEEE) |
Total Pages | : 376 |
Release | : 1994 |
Genre | : Technology & Engineering |
ISBN | : |
Author | : Ingo Wolff |
Publisher | : John Wiley & Sons |
Total Pages | : 558 |
Release | : 2006-07-11 |
Genre | : Technology & Engineering |
ISBN | : 0471121010 |
The tools and techniques to fully leverage coplanar technology Coplanar Microwave Integrated Circuits sets forth the theoretical underpinnings of coplanar waveguides and thoroughly examines the various coplanar components such as discontinuities, lumped elements, resonators, couplers, and filters, which are essential for microwave integrated circuit design. Based on the results of his own research findings, the author effectively demonstrates the many advantages of coplanar waveguide technology for modern circuit design. Following a brief introductory chapter, the text thoroughly covers the material needed for successful design and realization of coplanar microwave circuits, including: * Fundamental transmission properties of coplanar waveguides using a full wave analysis * Detailed analysis of most discontinuities used in coplanar waveguide design * Lumped elements in coplanar technology that are needed in circuit design * Development of software for coplanar circuit design, including a CD-ROM containing a test version of the software for modeling coplanar circuit components and circuits * Application of derived results to build more complex components such as lumped element filters, waveguide filters, millimeter wave filters, end-coupled waveguide structures, waveguide couplers, and Wilkinson couplers for different frequency ranges in coplanar technology The final chapter focuses on special coplanar microwave integrated circuits that have been developed using the software presented in the text. The book concludes with a thought-provoking discussion of the advantages and disadvantages of the coplanar technique. Extensive use of figures and tables helps readers easily digest and visualize complex concepts. A bibliography is included at the end of each chapter for further study and research. Coplanar Microwave Integrated Circuits is recommended for graduate students and engineers in RF microwaves who want to reap all the advantages and possibilities of coplanar technology.
Author | : Guo'an Wang |
Publisher | : Artech House |
Total Pages | : 306 |
Release | : 2012 |
Genre | : Technology & Engineering |
ISBN | : 1608071995 |
Focusing on novel materials and techniques, this pioneering volume provides you with a solid understanding of the design and fabrication of smart RF passive components. You find comprehensive details on LCP, metal materials, ferrite materials, nano materials, high aspect ratio enabled materials, green materials for RFID, and silicon micromachining techniques. Moreover, this practical book offers expert guidance on how to apply these materials and techniques to design a wide range of cutting-edge RF passive components, from MEMS switch based tunable passives and 3D passives, to metamaterial-based passives and on-chip passives. Supported with over 145 illustrations, this forward-looking resource summarizes the growing trend of smart RF passive component design and serves as a guide to the performance improving and cost-down solutions this technology offers the next generation of wireless communications.
Author | : P. Singh |
Publisher | : Springer Science & Business Media |
Total Pages | : 398 |
Release | : 1997-11-30 |
Genre | : Technology & Engineering |
ISBN | : 9780412105913 |
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
Author | : Michael S. Shur |
Publisher | : Springer Science & Business Media |
Total Pages | : 677 |
Release | : 2013-11-21 |
Genre | : Technology & Engineering |
ISBN | : 1489919899 |
GaAs devices and integrated circuits have emerged as leading contenders for ultra-high-speed applications. This book is intended to be a reference for a rapidly growing GaAs community of researchers and graduate students. It was written over several years and parts of it were used for courses on GaAs devices and integrated circuits and on heterojunction GaAs devices developed and taught at the University of Minnesota. Many people helped me in writing this book. I would like to express my deep gratitude to Professor Lester Eastman of Cornell University, whose ideas and thoughts inspired me and helped to determine the direction of my research work for many years. I also benefited from numerous discussions with his students and associates and from the very atmosphere of the pursuit of excellence which exists in his group. I would like to thank my former and present co-workers and colleagues-Drs. Levinstein and Gelmont of the A. F. Ioffe Institute of Physics and Technology, Professor Melvin Shaw of Wayne State University, Dr. Kastalsky of Bell Communi cations, Professor Gary Robinson of Colorado State University, Professor Tony Valois, and Dr. Tim Drummond of Sandia Labs-for their contributions to our joint research and for valuable discussions. My special thanks to Professor Morko.;, for his help, his ideas, and the example set by his pioneering work. Since 1978 I have been working with engineers from Honeywell, Inc.-Drs.
Author | : Robert S. Bauer |
Publisher | : |
Total Pages | : 272 |
Release | : 1985 |
Genre | : Semiconductors |
ISBN | : |